07/26/2018  In a key move to inspire the next generation of innovators, the School District of Osceola County (SDOC) today became the first school district to join the SEMI High Tech U (HTU) Certified Partner Program (CPP), a curriculum that prepares high-school students to pursue careers in STEM fields.

07/26/2018  In a paper published online this spring in the journal Nature Photonics, scientists at the University of Washington report that a prototype semiconductor thin-film has performed even better than today's best solar cell materials at emitting light.

07/26/2018  JUMP program funds 24 new research projects to amplify mission of its six innovation centers.

07/25/2018  DARPA selects research teams from industry, academia to receive funding through its Electronics Resurgence Initiative to bolster next-generation semiconductor design, materials, architectures.

07/25/2018  SiFive, a provider of commercial RISC-V processor IP, today announced Brad Holtzinger as Vice President of Worldwide Sales, where he will work with the existing global portfolio of SiFive customers and onboard new clients seeking to take advantage of the company's market-leading Core IP. 

07/25/2018  Semiconductor revenues are expected to increase 12.8% in 2018 as a result of continued strong memory prices.

07/25/2018  Global billings of North American equipment manufacturers declined for the current month by 8 percent from the historic high but is still 8 percent higher than billings for the same period last year.

07/24/2018  On its completion in autumn 2019, the facility will be one of the most advanced manufacturing operations in the world, dedicated to production of 3D flash memory.

07/24/2018  Millimeter-scale chip uses less power to create quantum random numbers at high speeds.

07/24/2018  Applied Materials, Inc. today announced it has been awarded a contract by the Defense Advanced Research Projects Agency (DARPA) to develop a new type of electronic switch for artificial intelligence that mimics the way the human brain works to enable dramatic improvements in performance and power efficiency.

07/24/2018  Imec, a research and innovation hub in nanoelectronics, energy and digital technology, within the partnership of EnergyVille, today announced a record result for its 4-terminal Perovskite/silicon tandem photovoltaic cell.

07/23/2018  Toshiba Memory will start to deliver samples to SSD and SSD controller manufacturers for evaluation from the beginning of September, and expects to start mass production in 2019.

07/19/2018  Rahul Goyal of Intel has been elected to a one-year term as board chair of Silicon Integration Initiative, a research and development joint venture that provides standard interoperability solutions for integrated circuit design tools.

07/19/2018  New material draws heat away from hotspots much faster than current materials.

07/19/2018  Semi content to surpass 30% this year, smashing the previous record high set just last year.

07/17/2018  Micron and Intel today announced an update to their 3D XPoint joint development partnership, which has resulted in the development of an entirely new class of non-volatile memory with dramatically lower latency and exponentially greater endurance than NAND memory.

07/16/2018  Daniel Cooley has been named Senior Vice President and Chief Strategy Officer.

07/16/2018  Intel is competing to win in the largest-ever addressable market for silicon, which is being driven by the explosion of data and the need to process, analyze, store and share it.

07/16/2018  A team of researchers from the Centre of Excellence for Quantum Computation and Communication Technology (CQC2T) at UNSW Sydney have successfully implemented an atomic engineering strategy for individually addressing closely spaced spin qubits in silicon.

07/13/2018  Broadcom Inc. and CA Technologies today announced that the companies have entered into a definitive agreement under which Broadcom has agreed to acquire CA to build one of the world's leading infrastructure technology companies.