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WEBCASTS
 Environment, Safety & Health Date and time TBD The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.
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Wafer Processing Date and time TBD As the industry moves to 10nm and 7nm nodes, advances in wafer processing etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.
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While speculation abounds about what will be the next generation of memories and their applications, CNRS, a French government-funded research organization, has 4 new concepts of memories in 2010. The organization is actively recruiting collaborators on RE-RAM, A-RAM, MS-DRAM, and MELRAM memory technologies.
Over the years, undesirable process effects related to ion implantation have become well known: the like channeling effect, for example, and how to minimize it for 25μm and 13μm mature technology. Patrick Demarest, Altis Semiconductor, describes how a stable process can emerge in data mining analysis for low final test yield, and provides definitions for incidence, tilt and twist angles, and channeling effects.
Picotest released a new family of Signal Injectors, or adapters, to improve voltage regulator, LDO, and power supply testing accuracy. Increased bandwidth and higher resolution measurements are enabled for PSRR, stability, crosstalk, reverse transfer, input impedance, Bode plots, and crosstalk tests along with non-invasive ICT for load transients, stability and output impedance.