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WEBCASTS
 Environment, Safety & Health Date and time TBD The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.
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Wafer Processing Date and time TBD As the industry moves to 10nm and 7nm nodes, advances in wafer processing etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.
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Professor Joel Plawsky and student Michael Riley of Rensselaer Polytechnic Institute will be presenting a paper titled “Experimental analysis of copper diffusion into porous SiCOH” at the Techcon 2010 conference. In a podcast interview, they outline the scope of their interconnect research on copper and porous SiCOH and its significance to the industry.
PolyU Researchers show that sandwiching a simple layer of silver nanoparticles can significantly improve the performance of organic transistors. This is expected to cut down the cost of memory devices such as touchscreens and e-books and improve their performance.
Applied Materials (NASDAQ:AMAT) today released Eterna, a new flowable CVD (FCVD) technology. Ajay Bhatnagar, director, global product management in the Gap Fill Dielectric Division, explains in-depth how it differs from conventional CVD. The technology is run on AMAT's Producer Eterna FCVD system. He also explains how it is being applied to new device architectures such as DRAM vertical transistors, NAND vertical bit stacks, and FinFETs.