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DEVICE ARCHITECTURE ARTICLES



Hynix, ProMOS deepening tech partnership, add ownership stake

05/08/2008  May 8, 2008 - Hynix Semiconductor and ProMOS Technologies have agreed to a partnership that will allow access to the Korean chipmaker's 50nm-node DRAM stack process technology, and give Hynix access to more 300mm capacity and an 8%-10% ownership stake in the Taiwan memory firm.

Edge: the final cleaning frontier

05/07/2008  by Ed Korczynski, Senior Technical Editor, Solid State Technology
May 7, 2008 - Applied Materials product manager Paul Miller tells WaferNEWS about the inner workings of the company's new Inflexion edge polishing system that uses mechanical abrasion for removing defects on the wafer edge, touting 2× faster throughput than "competing" tools and an inherently "green" process.

Analyst: No winners in DRAM "chicken game"

05/02/2008  May 2, 2008 - Despite throwing its market-leading weight around by hiking production as competitors retrench, even mighty Samsung couldn't turn a profit in the DRAM market during a tough 1Q08, according to data from iSuppli.

QSV Biologics awarded cGMP manufacturing contract by Pfizer

05/02/2008  May 1, 2008 -- /PRNewswire/ -- EDMONTON, ALBERTA, CANADA -- QSV Biologics, Ltd. has been awarded a cGMP manufacturing contract for a recombinant protein under development by Pfizer, Inc.

SIA: Chip sales creep up despite memory, outlook still optimistic

05/01/2008  May 1, 2008 - The global semiconductor market is building strength, according to latest industry sales figures, but the SIA admits it's hard to tell because of the weak memory sector.

Extending Leadframe Application Opportunities

05/01/2008  Leadframe-based packages accounted for over 70% of the 147 billion IC packages produced in 2007.

Flash Memory for Stacked PoP Technology Issues and Test Challenges

05/01/2008  Flash memory has become a fundamental building block in modern electronic systems.

Spansion, IBM ink memory license pact

04/29/2008  Apr. 29, 2008 - IBM and Spansion have signed a seven-year patent cross-licensing agreement that is expected to widen Spansion's reach into flash memory design and manufacturing, and support both companies' end-market interests in China.

IBM, Matheson to develop ≤32nm chip gases

04/29/2008  Apr. 29, 2008 - IBM and Matheson Tri-Gas, a subsidiary of Japan's Taiyo Nippon Sanso, have signed a four-year deal to jointly develop new high-purity gases and delivery systems for use in semiconductor manufacturing starting at the 32nm node.

Analyst: "Worst is over" for DRAM, but softness lingers

04/26/2008  Apr. 25, 2008 - Industry analysis firm iSuppli is upgrading its rating of near-term DRAM market conditions to "neutral," up from a "negative" assessment back in November, saying future conditions look to be positive and indications suggest "the worst is over for DRAM suppliers" -- but the road back to market balance and profitability will still be bumpy in the near term.

Report: Elpida seeking stake in ProMOS

04/25/2008  Apr. 25, 2008 - Japan's Elpida Memory plans to buy an ownership stake in 2nd-tier firm ProMOS Technologies through a private placement, even as it explores a DRAM JV with Qimonda and an existing far-reaching JV with regional rival Powerchip Semiconductor, according to local reports.

Qimonda, Elpida agree to DRAM JV

04/25/2008  Apr. 25, 2008 - Germany's Qimonda AG and Japan's Elpida Memory have signed a memorandum of understanding to develop DRAM chips, targeting 40nm processes by 2010 and subsequently scaling to 30nm.

MEMS developer Colibrys appoints Stoops as global ops VP

04/24/2008  Colibrys, supplier of MEMS motion sensors, has appointed Don Stoops to the role of VP, Global Operations. Colibrys is a world-leading supplier of standard and semi-custom MEMS-based motion sensors to the harsh-environment (military, aerospace and energy) and safety critical (industrial and instrumentation) applications.

Report: Macronix eyes NOR battle vs. Spansion, Numonyx

04/23/2008  Apr. 23, 2008 - Taiwan's Macronix plans to push into NOR flash for handsets within the next three years, placing it in direct competition with Spansion and Numonyx, according to a local report.

Analyst's "contrarian" view: ASML set to outperform

04/23/2008  Apr. 23, 2008 - A pending memory recovery later this year and more migrations to smaller technology nodes will spur another round of immersion tool orders for ASML, according to an analysis from FBR Research.

Renesas joins IMEC's 45nm RF transceivers program

04/22/2008  Apr. 22, 2008 - Renesas Technology and European R&D consortia IMEC have entered into a strategic research collaboration to develop 45nm RF transceivers for Gbit/sec cognitive radios, building on previous work with 130nm RF transceiver (results published at last year's ISSCC).

Report: Hynix invests in Phison

04/22/2008  Apr. 22, 2008 - Hynix Semiconductor has made an investment in Taiwan's design house Phison Electronics in a bid to prop up its NAND flash memory business, according to local reports.

Qimonda tips soft 1Q numbers, tweaks partnerships

04/22/2008  April 22, 2008 - Qimonda AG reported a big loss in its fiscal 2Q08, indicating it is still mired in "extremely difficult market conditions," and laid out further cost reduction plans, including some changes to its technology partnerships.

Micron, Nanya formalize DRAM memory JV

04/21/2008  April 21, 2008 - Micron Technology and Taiwan's Nanya Technology have formalized a recently announced partnership to create a new DRAM JV. An analyst tells WaferNEWS who should be most worried and why.

Analyst: Image sensor market to "bounce back" in 2008

04/11/2008  Apr. 11, 2008 - Image sensor sales are poised to return to growth in 2008 after a "rare" off year in 2007, rising about 10% to a record ~$7.6B, according to a new report from IC Insights.




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Environment, Safety & Health

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The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

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As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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