Device Architecture

DEVICE ARCHITECTURE ARTICLES



Imec extends damascene metallization towards the 3nm technology node

06/04/2018  At this week’s 2018 IEEE International Interconnect Technology Conference (IITC 2018), imec will present 11 papers on advanced interconnects, ranging from extending Cu and Co damascene metallization, all the way to evaluating new alternatives such as Ru and graphene.

Worldwide semiconductor equipment billings in first quarter 2018 reach record $17B

06/04/2018  SEMI reported that worldwide semiconductor manufacturing equipment billings reached a historic quarterly high of US$17.0 billion for the first quarter of 2018, surging 59 percent in March to end the quarter with an all-time monthly high of $7.8 billion.

BISTel announces intelligent chamber matching application to help semiconductor manufacturers guard against events impacting yield

06/01/2018  BISTel, a provider of intelligent, real-time data management, advanced analytics and predictive solutions for smart manufacturing announced today an innovative new Chamber Matching (CM) application that enables semiconductor manufacturers to better guard against events that negatively impact yield.

Automotive IC market on pace for third consecutive record growth year

06/01/2018  18.5% forecast increase in 2018 driven by systems monitoring and control, safety, ADAS, convenience, and growth of autonomous driving. Continued rise of memory ASP adds to growth.

Gartner reports worldwide sales of smartphones returned to growth in first quarter of 2018

05/31/2018  Global sales of smartphones to end users returned to growth in the first quarter of 2018 with a 1.3 percent increase over the same period in 2017, according to Gartner, Inc.

TowerJazz & Gpixel announce world's smallest global shutter pixel

05/29/2018  TowerJazz, the global specialty foundry leader, and Gpixel, Inc., a fast-growing CMOS image sensor (CIS) provider focusing on professional applications, announced today that Gpixel's GMAX0505.

GLOBALFOUNDRIES enters volume production of ultra high voltage process technology

05/29/2018  GLOBALFOUNDRIES today announced that its 180nm Ultra High Voltage (180UHV) technology platform has entered volume production for a range of client applications, including AC-DC controllers for industrial power supplies, wireless charging, solid state and LED lighting, as well as AC adapters for consumer electronics and smartphones.

Microsemi continues to expand silicon carbide product portfolios

05/24/2018  Microsemi Corporation (Nasdaq: MSCC), a provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced it will be expanding its Silicon Carbide (SiC) MOSFET and SiC diode product portfolios early next quarter, including samples of its next-generation 1200-volt (V), 25 mOhm and 80 mOhm SiC MOSFET devices.

Switching with molecules

05/24/2018  Molecular switch will facilitate the development of pioneering electro-optical devices.

Brite Semiconductor joins SiFive's DesignShare program

05/23/2018  The company will be the first to offer DDR IP in the growing ecosystem.

North American semiconductor equipment industry posts April 2018 billings 

05/23/2018  April 2018 monthly billings for North American equipment manufacturers surpassed the October 2000 record high of $2.6 billion.

GLOBALFOUNDRIES announces industry's most advanced automotive-qualified production FD-SOI process technology

05/23/2018  Manufacturing certification for security, reliability and robustness provides customers with performance and power efficiency for automotive applications.

Cadence Design Systems and NI announce collaboration to simplify next-gen semiconductor and RF development

05/22/2018  Cadence Design Systems, Inc. and NI today announced a broad-ranging collaboration to improve the overall semiconductor development and test process of next-generation wireless, automotive and mobile integrated circuits (ICs) and modules.

Memory device packaging: From leadframe to TSV

05/22/2018  Memory devices employ a wide range of packaging technology from wire-bond leadframe and BGA to TSV.

Semi capex forecast to exceed $100B for the first time in 2018

05/22/2018  IC Insights raises its full-year spending growth forecast for this year from 8% to 14%.

Market growth rate peaks after a strong 2017; IDC forecasts semiconductor revenue growth of 7.7%

05/21/2018  After strong year-over-year growth of 24% in 2017, worldwide semiconductor revenue is forecast to grow for the third consecutive year in 2018 to $450 billion, up 7.7% over 2017.

Micron and Intel extend their leadership in 3D NAND flash memory

05/21/2018  Micron Technology, Inc. (Nasdaq:MU), and Intel Corporation today announced production and shipment of the industry's first 4bits/cell 3D NAND technology.

Keep the light off: A material with improved mechanical performance in the dark

05/18/2018  Researchers at Nagoya University find an inorganic semiconductor is brittle when exposed to light, but flexible in the dark.

Global, U.S. electronics supply chains see healthy midyear business conditions

05/18/2018  The first quarter of this year was very strong globally, with growth across the entire electronics supply chain.

SEMI opposes trade tariffs against China, cites damaging impact to chip industry in U.S. government testimony

05/18/2018  Testifying before a U.S. interagency panel weighing trade tariffs against China, a representative from the semiconductor manufacturing industry yesterday called for the removal of more than 100 products from the list of proposed tariffs, stressing that an escalation of the U.S.-Sino dispute could trigger a full-blown trade war and hasten deep, unintended damage including higher consumer prices, an expanded U.S. trade deficit, and a slowdown in U.S. economic growth.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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