Device Architecture

DEVICE ARCHITECTURE ARTICLES



Matsushita, Renesas now testing 45nm SoCs

08/03/2006  August 3, 2006 - Matsushita Electric Industrial Co. Ltd. and Renesas Technology Corp. say they have entered full integration testing of 45nm system-on-chip (SoC) manufacturing technology. The process will be used by both companies in manufacturing SoCs for mobile products and networked consumer electronics products.

FTC slams Rambus for memory industry "hold-up"

08/02/2006  August 2, 2006 - Calling it a case of "deceptive conduct" that resulted in an anticompetitive "hold-up of the computer memory industry," the US Federal Trade Commission (FTC) has overturned a previous court ruling, finding that Rambus Inc. unlawfully monopolized markets for four computer memory technologies that were incorporated into industry standards for SDRAM and DDR SDRAM.

SEMICON West: Bulls and bears divided over 2007

07/31/2006  When leading analysts faced off to debate the prospects for industry growth at the annual "Bulls and Bears" session at SEMICON West, all agreed that 2006 was shaping up to be a very good year, but were widely split in their forecasts for 2007.

SanDisk widens memory reach with Msystems deal

07/31/2006  July 31, 2006 - In the latest big move to consolidate power in the memory sector, flash memory giant SanDisk Corp., Milpitas, CA, has agreed to acquire Msystems Ltd., Kfar Saba, Israel, in an all-stock deal valued at up to $1.55 billion, including stock options and convertible debt.

Intel/Micron Offshoot Develops 50-nm NAND Flash

07/28/2006  IM Flash Technologies, a company formed by, and exclusively manufacturing for, Intel Corporation and Micron Technology, is sampling NAND flash memory built on 50 nm process technology. The 4-GB device is sampling, and the companies plan to roll-out a range of densities on the 50-nm node in 2007. IM Flash operates high-density NAND technology from Micron with multi-level cell technology from Intel.

Flash memory inventor, Toshiba settle landmark litigation

07/27/2006  July 27, 2006 - Toshiba Corp. has agreed to settle a dispute with an ex-engineer who was instrumental in the creation of flash memory, two years after he sued them for reimbursement for his work while at the company.

Mosaid reloads DRAM patent suit vs. chipmakers

07/26/2006  July 26, 2006 - Mosaid Technologies Inc. said it has initiated new litigation in Texas against memory chipmakers Micron Technology Inc., Powerchip Semiconductor Corp., and ProMOS Technologies, alleging infringement of nine US patents concerning DRAM technologies. Meanwhile, Micron has filed for declaratory relief in a separate court hearing.

Intel, Micron push to 50nm NAND

07/26/2006  July 26, 2006 - Intel Corp. and Micron Technology Inc., through their joint venture IM Flash, say they have started sampling 4Gbit NAND flash memory devices using 50nm process technologies, and plan to ramp to mass production across a range of memory densities within the next year.

Midyear forecasts: Chipmakers 'robbing Peter to pay Paul'

07/25/2006  A roundup of midyear forecast updates for semiconductor sales, equipment sales, and capital expenditures indicates general agreement that 2006 will shape up to be a boon year overall, particularly in the first half of the year, and strongest on the equipment side. But growth this year will come at a cost, as the same analysts generally agree that 2007 looks to be downright gloomy.

Samsung readies 65nm low-power process

07/25/2006  July 25, 2006 - Samsung Electronics Co. Ltd. said it has qualified its 65nm low-power process technology, to expand its contract foundry offerings from its S1 300mm logic fab line in Giheung, Korea.

Spansion, TSMC move MirrorBit work to 90nm

07/21/2006  July 21, 2006 - Spansion Inc. has expanded its partnership with Taiwanese foundry TSMC to phase Spansion's MirrorBit flash memory technology from 110nm process technologies to 90nm, with a production ramp planned for 2H07.

Wireless Chip Links Physical to Digital

07/20/2006  HP Labs announced the development of a miniature, wireless data chip that embeds digital information into paper, pharmaceutical containers, and other physical objects. The self-contained, RoHS-compliant prototype chip is based on a standard CMOS, with a built-in antenna; according to HP, no special materials are used in fabrication.

Intel cuts 2006 capex, R&D targets after 2Q shortfall

07/20/2006  July 20, 2006 - Price cuts and rising inventory dented Intel Corp.'s 2Q06 performance, and the company has responded by cutting its capital spending and R&D targets for the rest of the year.

Samsung tips 60nm, 8Gbit NAND flash

07/19/2006  July 19, 2006 - Samsung Electronics Co. Ltd. said it has ramped to volume production of its 8Gbit NAND flash memory based on multilevel cell (MLC) architecture and 60nm process technologies, two years after announcing development of the technology.

Auto-fix for hot-spots in nanometer node designs

07/19/2006  DFM start-up Takumi Technologies, building on its mask-data preparation (MDP) work for NEC and other customers, is now promoting its ability to automatically detect, classify, and repair yield-limiting design "hot spots" -- areas of a design layout which, due to process or geometric conditions, fall outside of process windows, resulting in potential catastrophic or parametric failure.

Micron's Appleton: Why partnerships fail

07/18/2006  In a revealing keynote address at SEMICON West last week, Micron Technology chairman and CEO Steve Appleton offered a behind-the-scenes look at his company's experience in forming business partnerships, and offered some hard-won insight into why partnerships fail and what can be done to ensure their success.

Grace sets up shop in Japan

07/17/2006  July 17, 2006 - Chinese foundry Grace Semiconductor Manufacturing Corp. has established a Japanese subsidiary to establish a presence in the domestic market, aiming to drum up business for mature process technologies in a region known for doing things in-house.

States pursuing more litigation against memory chipmakers

07/17/2006  July 17, 2006 - The US federal government might be done with a group of DRAM chipmakers for their alleged price-fixing practices several years ago, but for Attorneys General in 34 states the fight is just getting started. A federal lawsuit has been filed in San Francisco, CA, against seven international DRAM chipmakers and their US subsidiaries, seeking damages against consumers in various states, as well as state and local governments.

Intel drops axe on 1000 managers

07/14/2006  July 14, 2006 - Intel Corp. says it will lay off 1000 managers, about % of its workforce, following up on its promise to identify underperforming business areas and respark growth.

ASE, P'chip partner for memory backend services

07/14/2006  July 14, 2006 - Advanced Semiconductor Engineering Inc. (ASE) and Powerchip Semiconductor Corp. have agreed to form a joint venture in Taiwan to provide memory IC-related package and testing services. Power ASE Technology Inc. will offer backend capacity to support Powerchip's growth, while giving ASE expertise in memory testing to support its SIP and SOC offerings to customers, according to the companies.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

Sponsored By:

More Webcasts