Device Architecture

DEVICE ARCHITECTURE ARTICLES



Annual Washington forum brings top industry priorities to policymakers

05/01/2018  Just as the annual Cherry Blossom festival wraps up, international trade has flowered as a top concern for SEMI members, requiring immediate action as 20 SEMI member executives carried the torch for the industry in recent meetings with lawmakers at the annual SEMI Washington Forum.

Cyient acquires semiconductor firm AnSem N.V.

04/30/2018  Cyient Limited today announced that its step down subsidiary Cyient Europe Ltd. has acquired AnSem N.V.

TSMC certifies Synopsys Design platform for high-performance 7nm FinFET Plus technology

04/30/2018  Synopsys, Inc. today announced certification of the Synopsys Design Platform with TSMC's latest Design Rule Manual (DRM) for advanced 7nm FinFET Plus process technology.

Spin Transfer Technologies announces breakthrough MRAM technology for SRAM and DRAM applications

04/30/2018  Spin Transfer Technologies, Inc. announced results of its unique Precessional Spin Current (PSC) structure.

Jim Keller joins Intel to lead silicon engineering

04/27/2018  Intel today announced that Jim Keller will join Intel as a senior vice president. He will lead the company's silicon engineering, which encompasses system-on-chip (SoC) development and integration.

Samsung begins mass production of 10nm-class 16Gb LPDDR4X DRAM for automobiles

04/26/2018  The latest LPDDR4X features high performance and energy efficiency while significantly raising the thermal endurance level for automotive applications that often need to operate in extreme environments.

TSMC continues to dominate the worldwide foundry market

04/25/2018  Top eight companies held 88% of global foundry market last year.

North American semiconductor equipment industry posts March 2018 billings

04/25/2018  "March 2018 monthly billings for North American equipment manufacturers remain at robust levels," said Ajit Manocha, president and CEO of SEMI.

Worldwide semiconductor revenue grew 21.6% in 2017 as Samsung takes over No. 1 position

04/24/2018  Booming memory market overshadows high growth in other segments.

Orbotech's SPTS Technologies honored with Queen's Award for Enterprise in Innovation 2018

04/24/2018  The award recognizes SPTS's development of novel physical vapor deposition (PVD) process solutions for Fan-Out Wafer Level Packaging (FOWLP) of semiconductor devices.

Semiconductor Industry Association recognizes Senator Mike Crapo, Congressman Peter Roskam with Congressional Leadership Awards

04/20/2018  The Semiconductor Industry Association (SIA) this week presented its Congressional Leadership Awards to Senator Mike Crapo (R-Idaho) and Congressman Peter Roskam (R-Ill.) for their leadership in enacting tax reform legislation, the Tax Cuts and Jobs Act of 2017.

Mobile Semiconductor's 22nm ULL memory compiler joins the GlobalFoundries FDXcelerator Partner Program

04/20/2018  This new embedded SRAM technology on 22nm FDX offers the best in class memory solution using the GLOBALFOUNDRIES low leakage FDSOI bit cells and ultra-low leakage devices.

Robot developed for automated assembly of designer nanomaterials

04/20/2018  A current area of intense interest in nanotechnology is van der Waals heterostructures, which are assemblies of atomically thin two-dimensional (2D) crystalline materials that display attractive conduction properties for use in advanced electronic devices.

Nexperia secures $800M financing to fund future growth plans

04/19/2018  Discrete semiconductor company’s refinancing supported by major global banks.

Getting better by design

04/18/2018  With the IC industry now worth over $400 billion in annual revenue, developing a single new chip can cost hundreds of millions of dollars.

Toyoda Gosei achieves state-of-the-art high current operation with vertical GaN power semiconductor

04/16/2018  Toyoda Gosei Co., Ltd. has achieved state-of-the-art high current operation in a vertical GaN power semiconductor developed using gallium nitride (GaN), a main material in blue LEDs.

SEMI announces ESD Alliance to join as Strategic Association Partner

04/16/2018  SEMI today announced that it has signed a memorandum of understanding to integrate the ESD (Electronic System Design) Alliance as a SEMI Strategic Association Partner this year.

Psst! A whispering gallery for light boosts solar cells

04/13/2018  Trapping light with an optical version of a whispering gallery, researchers at the National Institute of Standards and Technology (NIST) have developed a nanoscale coating for solar cells that enables them to absorb about 20 percent more sunlight than uncoated devices.

SEMI postpones SEMICON Southeast Asia 2018 to avoid Malaysian election conflict

04/13/2018  SEMI today announced postponement of SEMICON Southeast Asia from 8-10 May 2018 to 22-24 May 2018.

Worldwide PC shipments declined 1.4% in first quarter of 2018

04/12/2018  Worldwide PC shipments totaled 61.7 million units in the first quarter of 2018, a 1.4 percent decline from the first quarter of 2017, according to preliminary results by Gartner, Inc.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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