Device Architecture

DEVICE ARCHITECTURE ARTICLES



Sidense, UMC qualify 90-65nm OTP cores

04/26/2006  April 26, 2006 - Sidense Corp., a fabless provider of one-time-programmable (OTP) memory IP, said its 1T-Fuse family of embedded OTP cores is slated to be silicon-verified in UMC's 90nm and 65nm process technologies

Elpida eyes 24% capacity ramp

04/26/2006  April 26, 2006 - Elpida Memory Inc. reportedly plans to raise production capacity at its 300mm site in Hiroshima, Japan, by about 24% from current levels to 67,000 wafers/month by fiscal 1Q07.

Cadence updates PCB design platform

04/26/2006  April 26, 2006 - Cadence Design Systems Inc., San Jose, CA, is extending its "segmented" product strategy to its system interconnect design platform, used for simplifying and streamlining designs for printed circuit boards.

CMP pads, slurries market tracking 15% CAGR

04/24/2006  April 24, 2006 - The market for chemical-mechanical planarization (CMP) products is expected to see strong growth as chipmakers continue to switch to copper interconnects, according to a new report from Linx Consulting, Boston, MA.

Capex big spenders swell ranks in 2006

04/24/2006  April 24, 2006 - The roster of companies spending more than $1 billion is set to expand to sixteen companies, vs. 13 a year ago, with memory firms particularly aggressive in their capacity investments, according to a new report from IC Insights Inc.

UMC ships SONOS memory

04/21/2006  April 21, 2006 - Taiwanese fabless IC design house Solid State System Co. has received pilot devices of a new type of SONOS dielectric storage memory from UMC.

Report: Soccer trumps holidays for Japan chipmakers

04/21/2006  April 21, 2006 - Several Japanese chipmakers plan to extend working hours during the "golden week" of holidays in late April and early May, in order to capitalize on projected demand for digital consumer electronics devices ahead of this summer's World Cup soccer matches.

Price slumps undercut Hynix sales, profits

04/21/2006  April 21, 2006 - Thanks to sliding NAND flash ASPs and a strong Korean won vs. the US dollar, Hynix Semiconductor Inc. said 1Q06 profits sunk about 61% in 1Q06 on 18% lower sales.

Analyst: Power transistors on comeback trail

04/20/2006  April 20, 2006 - The market for power transistors, which accounts for half of the discrete semiconductor market, will swell to record levels over the two years, due to demand for devices to keep chips operating at peak efficiency but at low voltages, according to IC Insights Inc.

Samsung rolls out 2GB phone memory

04/20/2006  April 20, 2006 - Samsung Electronics Co. Ltd. has developed a 2GB MultiMediaCard with four 4Gbit NAND flash devices, the highest capacity card for mobile phones.

Intel-backed storage firm nabs funding

04/20/2006  April 20, 2006 - Nanochip Inc. has secured $10 million in funding from sources including Intel Capital, to support its push toward commercialization of MEMS-based data storage chips.

Taiwan DRAM firms fattening wallets for quick expansion

04/18/2006  April 18, 2006 - Three of Taiwan's top DRAM memory producers have raised substantial amounts of cash this year -- about $4.6 billion collectively -- to support immediate capacity expansions, according to the Taiwan Economic News.

Firm touts electro-optic silicon replacement

04/18/2006  April 18, 2006 - PSI-Tec Corp. says it has successfully tested an engineered organic material with better electro-optic properties to convert electronic signals into optical signals for telecom and navigational systems, and possibly eventually optical interconnects and all-optical transistors.

Fabless ASIC/SoC firm decloaks

04/17/2006  April 17, 2006 - Startup Key ASIC, a Santa Clara, CA-based fabless provider of ASIC and system-on-chip (SoC) design-for-manufacturing services, has officially launched with a menu of SoC platforms for various consumer and communications applications.

Korean firm sues Aviza over ALD tech

04/14/2006  April 14, 2006 - South Korean semiconductor-equipment vendor Integrated Process Systems Ltd. (IPS) has filed a lawsuit against Aviza Technology Inc., Scotts Valley, CA alleging that Aviza used confidential information to develop its single-wafer atomic-layer deposition (ALD) system.

Samsung tips 3D memory package

04/13/2006  April 13, 2006 - Samsung Electronics Co. Ltd. said it has developed a wafer-level processed stack package (WSP) of high-density memory chips using "through silicon via" interconnections, resulting in a 15% smaller and 30% thinner device than an equivalent wire-bonded multichip package.

Report: EU to tweak Hynix tariffs

04/12/2006  April 12, 2006 - The European Union reportedly will cut back its countervailing tariff on memory chips from South Korea's Hynix Semiconductor Inc. to 32.9% from 34.8%, following a recommendation from the World Trade Organization (WTO).

Lexar files NAND flash complaint vs. Toshiba

04/12/2006  April 12, 2006 - Lexar Media Inc., Fremont, CA, has filed a complaint with the International Trade Commission (ITC) alleging that Japan's Toshiba Corp. and its US subsidiaries are infringing upon its patented NAND flash technologies.

Nantero touts success with 22nm memory switch

04/12/2006  April 12, 2006 - Nantero Inc. says it has successfully demonstrated scalability of its nonvolatile random access memory (NRAM) technology, with fabrication and testing of a 22nm NRAM memory switch.

Analyst: Mobile-phone memory set to explode

04/12/2006  April 12, 2006 - Average embedded memory density in mobile phones will increase by a factor of more than 40x from 2005-2010 as new utility and entertainment features demand more storage, according to iSuppli Corp.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

Sponsored By:

More Webcasts