Device Architecture

DEVICE ARCHITECTURE ARTICLES



Chip sales to surpass $300B in 2008, says SIA

11/17/2005  November 17, 2005 - The SIA has projected in its annual forecast of global semiconductor sales a CAGR of nearly 10% for 2005 through 2008. Worldwide sales of microchips will reach $309B.

IBM awarded National Medal of Technology for semiconductor innovation

11/16/2005  November 16, 2005 - President George W. Bush announced that IBM has been awarded the 2004 National Medal of Technology by the US Department of Commerce and the Technology Administration in recognition of more than four decades of innovation in semiconductor technology.

Elpida starts producing hydrogen on site

11/10/2005  November 10, 2005 - Elpida Memory Inc. has begun on-site production of hydrogen gas necessary for production of DRAM chips at its Higashi Hiroshima main plant, reports the Nikkei English News.

Toshiba and NEC to ally on 45nm logic process technology

11/09/2005  November 9, 2005 - Toshiba Corp., Tokyo, Japan, and NEC Electronics Corp. have entered into an agreement to co-develop 45nm CMOS logic process technology, allowing the companies to "share burdens and accelerate development, while raising system LSI performance and quality," according to a joint statement.

Tower begins production of Biomorphic's cell phone chips

11/03/2005  November 3, 2005 - Wafer foundry Tower Semiconductor has begun manufacturing 2.0 and 1.3-megapixel CMOS system on a chip (SoC) image sensors for Biomorphic Microsystems Corp., reported the Israel Business Arena.

Thermally Enhanced, Next-generation 3-D Power Packages

11/01/2005  A Heat-Management Solution

IMEC, Infineon targeting nitride-based flash memory

10/19/2005  October 19, 2005 - European R&D consortium IMEC and chipmaker Infineon Technologies AG have developed a new profiling technique for extracting charge profiles in nitride-based nonvolatile flash memory (NVM), which will allow the technology to compete broadly against traditional flash memory for standalone code and data storage, as well as in embedded applications.

IMEC embarks on R&D for 45nm RF-CMOS, neuro-electronic systems

10/18/2005  October 18, 2005 - European R&D consortium IMEC has added an RF-CMOS arm to its industrial affiliation program for researching sub-45nm CMOS technologies, expanding its efforts from an earlier 90nm program.

Oki Electric reports high-amplification GaN transistor

10/17/2005  October 17, 2005 - Oki Electric Industry Co. Ltd., Tokyo, Japan, has unveiled the development of a gallium nitride high electron-mobility transistor (GaN-HEMT) formed on a silicon substrate.

Samsung to pay $300M in DOJ DRAM deal

10/14/2005  October 14, 2005 - Samsung Electronics Co. Ltd. has agreed to pay a $300 million fine to the US Department of Justice regarding a single charge related to price-fixing allegations...

Report: Austin has inside track on new Samsung 300mm fab

10/11/2005  October 11, 2005 - Samsung Electronics could be on the verge of naming Austin, TX, as the home for its new $3.3 billion 300mm chip manufacturing site in the US.

Report: Korea trade group eyeing Samsung/Apple flash deal

10/11/2005  October 11, 2005 - Samsung Electronics may face scrutiny from South Korea's Fair Trade Commission (FTC) for an alleged sweetheart deal to supply NAND flash memory to Apple Computer for its iPod nano.

Oki Electric develops transistor that reduces power consumption by >90%

10/07/2005  October 7, 2005 - Oki Electric Industry Co. Ltd. has announced the development of SOI (Silicon on Insulator)-CMOS, a new device structure for super low off-leakage current. While maintaining the speed of performance of previous devices, this transistor reduces the standby consumption current (off-leak current) by over 90% compared to previous transistors. Oki claims to be the first company to develop a fully depleted SOI transistor using a non-doped body and non-overlap type SOI structure.

August's Global Semiconductor Sales Hit $18.6B

10/03/2005  San Jose, Calif. — August's Worldwide semiconductor sales made a sharp increase to $18.6 billion, a 3.2% increase from the $18.0 billion reported in July and a 1.7% increase from the $18.3 billion reported in August 2004, reports the Semiconductor Industry Association (SIA). Year-to-date semiconductor sales through August, at $144.4 billion, are up by 5.8% over the same period of 2004 when total sales amounted to $136.5 billion, according to the SIA.

In the News

10/01/2005 

Infineon, Nanya extend DRAM pact

09/29/2005  September 29, 2005 - Infineon Technologies AG and Taiwan's Nanya Technology Corp. have expanded their existing 90-70nm/300mm DRAM technology development agreement to include 60nm process technologies.

Samsung joins SEMATECH consortium

09/29/2005  September 29, 2005 - Samsung Electronics Co. Ltd. has joined the SEMATECH semiconductor consortium to address next-generation semiconductor technologies, including lithography and materials, both of which are crucial to future semiconductor transistor development. Officials for both companies announced the decision yesterday, following the signing of a formal member participation agreement in Giheung.

iSuppli: Apple changes rules with nano iPod

09/22/2005  September 22, 2005 - Apple's new iPod nano music player includes some "surprising" choices in its semiconductor components, and its heavy use of NAND flash will "radically change the market dynamics of both thememory market and the MP3 player," according to iSuppli Corp.




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Environment, Safety & Health

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The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

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As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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