Device Architecture

DEVICE ARCHITECTURE ARTICLES



TI Extends IMEC Relationship

05/10/2004  May 7, 2004 -- Leuven, Belgium -- Expanding a 12-year relationship with IMEC, Texas Instruments Inc. is becoming a core member of the sub-45nm CMOS research program, the company reported.

Korea IT exports up, but does a "crisis" loom?

05/06/2004  Technology exports were up more than 42% in April to $5.88 billion, but South Korea's electronics industry could be facing "huge challenges" over the next couple of years, according to an analyst.

IBM, Stanford take partnership for a spin

04/29/2004  It’s not every day that the 80s new wave act Dead or Alive’s song "You Spin Me Round" highlights a press conference dedicated to topics like pulsed laser deposition and qubit decoherence. But when the underlying theme is spintronics, and one of the people involved says one of the fundamental laws of physics could get turned on its head, perhaps one can forgive the pun.

Nanosys files for first ‘real real’ nano IPO, others to follow

04/23/2004  The nanotech community has been waiting for this. Forget the 1997 debut of Nanophase Technologies. Or last week’s Immunicon initial public offering. No, this is the big one. This is, of course, Nanosys Inc., a Palo Alto, Calif.-based developer of inorganic semiconductor nanocrystals and the nascent nanotech sector’s de facto poster child. After months of rumors buzzing about an IPO, Nanosys came out of the lab closet Thursday.

AMD boosted by memory, 64-bit chips

04/22/2004  April 22, 2004 - Advanced Micro Devices (AMD), Sunnyvale, CA, posted sales of $1.236 billion in 1Q04 and a net income of $45 million, "solid results in a seasonally down quarter," but warned of foggy visibility into future quarters.

Samsung hits revenue records, burns through capex

04/22/2004  April 22, 2004 - South Korea's Samsung reported record sales and earnings in 1Q04, due to demand for flash memory, rising DRAM prices, and more advanced shrink technologies.

AMD opens $100 million facility in China

04/16/2004  APRIL 16--SUZHOU, China--Advanced Micro Devices today confirmed it would build a $100 million test, mark and pack facility here.

Foundries to outpace chipmakers in 2004 spending

04/16/2004  Capital investments by chipmakers will grow 42% this year to $43.6 million, nearly an all-time high, but the most aggressive spenders are to be found in the foundry sector, according to a recent report from Strategic Marketing Associates (SMA), Santa Cruz, CA.

Intel, AMD making China inroads

04/15/2004  April 15, 2004 - Intel and AMD are beginning new construction projects in China to bring testing and packaging facilities online by next year.

Renesas boosting flash capacity

04/15/2004  April 15, 2004 - Renesas Technology Corp., the JV between Hitachi and Mitsubishi, plans a 6x increase in capacity of AND-type flash memory by the end of March 2006, a move that would more than double its market share to 15%

Toshiba, SanDisk invest in 300mm

04/15/2004  April 14, 2004 - Toshiba Corp. and SanDisk Corp. plan to invest 270 billion yen to build a 300mm memory chip plant at Toshiba's operations in Yokkaichi, Japan.

Japan boosts nanotechnology budget and industrial cooperation

04/15/2004  Japan’s nanotechnology budget for fiscal 2004, which began April 1, rose 3.1 percent to $875 million. Meanwhile, the two main government ministries responsible for about 90 percent of the country’s nanotechnology research programs are both seeing their budgets increased. The Ministry of Economy Trade and Industry's overall science and technology budget designates nanotechnology and related materials research one of four top-priority areas.

AMCC buys IBM PowerPC assets

04/13/2004  April 13, 2004 - Applied Micro Circuits Corp. (AMCC), San Diego, CA, has agreed to purchase IP and assets associated with IBM's 400 series of embedded PowerPC products for $227 million in cash.

TSMC rebrands offerings

04/13/2004  April 13, 2004 - TSMC has realigned its process technologies into two classes of "technology platforms" in order to add other features and services, and claims to have produced the industry's first fully-functional 65nm SRAM module.

Power outage bumps DRAM prices?

04/12/2004  April 12, 2004 - A power outage hitting the Hsinchu Science-based Industrial Park on April 10, did not take a serious toll on some of its semiconductor occupants, but nevertheless it may boost retail prices of DRAM chips made there.

Micron CEO: 2004 outlook "strong"

04/08/2004  April 9, 2004 - Micron Technology Inc., Boise, ID, is poised to achieve profitability in 2004 -- and stay there, according to CEO Steve Appleton.

Intel takes lead-free stand

04/07/2004  April 7, 2004 - Starting later this year, Intel Corp. will eliminate approximately 95% of the lead used in its processors and chipsets,

Infineon moving from DRAM to logic

04/05/2004  April 5, 2004 - Infineon Technologies AG reportedly plans to shift capacity away from its DRAM operations in order to focus on production of logic chips.

Samsung rolls out 0.13-micron flash

03/31/2004  March 31, 2004 - Samsung has unveiled new embedded flash technology based on 0.13-micron CMOS, for system-on-a-chip and ASIC designs.

Lattice to help fund Fujitsu's 300mm fab

03/23/2004  March 23, 2004 - Lattice Semiconductor Corp., Hillsboro, OR, and Fujitsu have signed a deal that will bring up to $200 million into Fujitsu's planned $1.5 billion 300mm fab in Mie Prefecture.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

Sponsored By:

More Webcasts