Device Architecture

DEVICE ARCHITECTURE ARTICLES



Winbond, Etron win DRAM deals

03/19/2004  March 19, 2004 - Winbond Electronics Corp. and Etron Technology Inc. reportedly have received "lucrative" orders from Intel and Sharp to bundle their memory chips with multichip package products in next-generation handsets.

EU approves Infineon, Altis aid

03/16/2004  March 16, 2004 - The European Union has approved government aid from France and Portugal to be used to support Infineon Technologies AG and Altis Semiconductor, its JV with IBM.

Sharp to double chip investment in 2005

03/12/2004  March 12, 2004 - Sharp reportedly plans to invest ¥27 billion ($199.3 million) in its fiscal year 2005, targeting production upgrades for flash memory and image sensors.

Korean IT exports jump

03/11/2004  March 11, 2004 - Strong demand for semiconductors drove Korean exports of IT goods to $5.72 billion in February, an increase of more than 50% year-on-year, according to data from the Ministry of Information and Communication.

Aixtron joins IMEC high-k program

03/11/2004  March 11, 2004 - Aixtron AG, a German supplier of equipment for semiconductor epitaxy, has entered into a three-year deal with IMEC to jointly develop atomic-vapor deposition materials for high-k and metal gate stacks.

Firms link up with IMEC

03/09/2004  March 9, 2004 - Royal Philips Electronics of The Netherlands and Japan's Matsushita Electric Industrial Co. Ltd. have joined IMEC's sub-45nm CMOS research program.

SST invests in Grace

03/08/2004  March 8, 2004 - Flash memory developer Silicon Storage Technology (SST), Sunnyvale, CA, said it contributed $33 million to the recent Series B round of financing in Grace Semiconductor Manufacturing Corp., the holding company for foundry Shanghai Grace Semiconductor.

Europe to lead sub-45nm development

03/08/2004  March 8, 2004 - The European Commission has announced plans to create a consortium to demonstrate the feasibility of 45nm-and-below CMOS logic technologies.

Nanochip to make memories with $20 million more

03/08/2004  Armed with new investment, Nanochip Inc. expects to make a memorable impact on the removable storage market. The Oakland, Calif., firm today received $20 million from a syndicate of institutional and industry investors, including Microsoft Corp. That is about $5 million more than the company sought during its second funding round.

Samsung joins 65nm trio

03/05/2004  March 5, 2004 - Samsung Electronics has joined IBM, Chartered, and Infineon in efforts focus on 65nm CMOS logic processes, eventually including 45nm process development.

Flash inventor seeks payday

03/03/2004  March 3, 2004 - Former Toshiba Corp. engineer Fujio Masuoka has filed a suit in the Tokyo District Court seeking 1 billion yen ($9.2 million) from his former employer for his contributions toward the creation of flash memory.

Renesas files against Nanya

03/01/2004  March 1, 2004 - Renesas Technology Corp. has filed a complaint in Tokyo District Court against Nanya Technology Corp.'s Japan subsidiary, alleging "willful" misuse of two memory-related patents.

EU probing alleged chip price fixing

02/26/2004  February 26, 2004 - The European Union has opened a probe into allegations of collusion over chip prices and output among the world's memory chip producers.

Intel: 2004 revenues in step with industry

02/24/2004  February 24, 2004 - Intel Corp., Santa Clara, CA, said its revenue growth in 2004 will be about 15%, in the middle of earlier forecasts and the same as the projected growth for the entire chip industry.

Synopsys boosts IP with acquisitions

02/23/2004  February 23, 2004 - Synopsys Inc., Mountain View, CA, has made a pair of acquisitions to bolster its IP portfolio with embedded memory and CMOS transceiver technologies.

Hynix ramping up in China

02/23/2004  February 23, 2004 - Now in the final stages of factory site selection, Hynix Semiconductor's China affiliate reportedly could begin commercial production of memory chips by 2H05.

AML: No more MEMS fabless model for us

02/19/2004  February 19, 2004 - UK-based AML said it is abandoning the foundry model for fabricating MEMS devices, calling it a "flawed concept" and "not flexible enough" to meet its demands, and is reverting back to in-house fabrication.

Bye-bye, SiGe BiCMOS in cell phones, says TI

02/19/2004  Silicon-germanium BiCMOS has been relegated to the status of a niche technology at Texas Instruments Inc., now that the Dallas-based company has demonstrated a single-chip CMOS concept for next-generation radio circuits used in cellular phones and other portable wireless applications.

Matsushita targets 15% chip sales growth

02/13/2004  February 13, 2004 - Matsushita Electric Industrial Co. said it is planning for 15% revenue growth in its semiconductor business over the next three years, by focusing efforts on system LSIs and image sensors for consumer devices.

Winbond reading fab for 3Q

02/11/2004  February 11, 2004 - Winbond Electronics Corp. said it is planning to start the $1.3 billion first stage of construction on its 300mm facilitiy in the Central Taiwan Science Park by 3Q04.




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Environment, Safety & Health

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The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

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As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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