Device Architecture

DEVICE ARCHITECTURE ARTICLES



Fujitsu, Pulse-link sign deal

10/02/2003  September 25, 2003 - Fujitsu Microelectronics America Inc., Sunnyvale, Ca, and Pulse-Link Inc., San Diego, CA, have signed an agreement to codevelop digital baseband processors.

FSA: Wafer prices up in 3Q

10/02/2003  September 24, 2003 - CMOS wafer prices rose an average of 3% from 2Q03 to 3Q03, according to the Fabless Semiconductor Association (FSA).

Global chip sales climb

09/29/2003  SEPT. 29--SAN JOSE, Calif.--The Semiconductor Industry Association (SIA) says that sales of semiconductor chips reached $13.4 billion in August, up from $12.9 billion the previous month, making it the sixth consecutive monthly increase.

IMEC develops noise analysis tool

09/25/2003  September 23, 2003 - Researchers at Europe's Inter-university MicroElectronics Center (IMEC), Leuven, Belgium, have developed a prototype tool to model and analyze noise generated on low- and high-ohmic substrates used in ultra-deep, sub-micron CMOS technologies.

Philips, IMEC continue 65nm efforts

09/25/2003  September 22, 2003 - Researchers at Royal Philips Electronics, Amsterdam, The Netherlands, and the Inter-university Microelectronics Center (IMEC), Leuven, Belgium, say they have completed fabrication of 65nm CMOS devices.

Nam Tai breaks ground in China

09/22/2003  September 19, 2003 - Nam Tai Electronics has begun construction of new manufacturing facilities in Shenzen, China to produce LCD, RF, and CMOS components.

Infineon stakes claim in China

09/22/2003  September 17, 2003 - Infineon Technologies, Munich, Germany, plans to spend $1.2 billion over the next four years on its China operations to double its domestic market share.

Using wafer-level probing to assess reliability

09/19/2003  Getting a handle on the reliability of devices using new low-k materials and copper interconnects is key to successful integration efforts. Recently, Applied Materials announced it has developed benchmarks for testing the electrical reliability of copper and low-k materials using Agilent Technologies' Parallel Parametric Reliability (PPR) test system.

Renesas, PointChips aim for USB 2.0

09/12/2003  September 11. 2003 - Renesas Technology Corp., the chipmaking JV between Hitachi Ltd. and Mitsubishi Electric Corp., and PointChips, a fabless USB flash drive controller provider, have announced plans to jointly deliver an ASIC combining Renesas' USB 2.0 technology with PointChips flash controller design.

Sunny mid-quarter reports brighten industry outlook

09/11/2003  Halfway through the third quarter, many big-name chipmaking firms are upping their 3Q performance estimates, and for the most part, Wall Street is cheering. Here's a rundown of recent mid-quarter revelations.

Nantero wins funding

09/11/2003  September 9, 2003 - Nantero, Woburn, MA, a developer of nonvolatile random access memory (NRAM) chips using nanotechnology, has completed a second round of investments totaling $10.5 million.

IBM forges new chip technologies

09/11/2003  September 9, 2003 - IBM says it has developed two new chip manufacturing technologies that could improve CMOS performance by more than 60%.

SMSC, Intel expand partnership

09/11/2003  September 9, 2003 - Fabless semiconductor supplier Standard Microsystems Corp., Hauppage, NY, and Intel Corp., Santa Clara, CA, have enhanced their partnership in advanced input/output devices.

Simtek samples 1MB SRAM

09/11/2003  September 9, 2003 - Simtek Corp., Colorado Springs, CO, says it is sampling intitial production of its 1Mbit SRAM chips.

Samsung pours money into DRAM

09/11/2003  September 9, 2003 - Samsung Electronics Co. says it will invest up to $432 million over the next two years to boost output of its DRAM and flash memory chips.

IBM, Agilent to shrink optics for computers

09/11/2003  IBM and Agilent Technologies Inc. are teaming up to develop optical transmission technology small enough to enable rapid connections within computers, according to a news release.

Nantero secures $10.5M in funding

09/08/2003  Sept. 8, 2003 – Nantero Inc. announced it received $10.5 million in second-round funding. The new lead investor is Charles River Ventures. Bruce Sachs and Bill Tai, both partners at the venture firm, have joined Nantero's board of directors. Returning investors include Draper Fisher Jurvetson, Stata Venture Partners and Harris & Harris Group.

SIA: July chip sales up, future looks bright

09/05/2003  Worldwide semiconductor sales totaled $12.90 billion in July, up a bit from the $12.54 billion in revenues reported in June 2003, and a healthy 10.5% jump from $11.68 billion in sales a year ago, according to data from the Semiconductor Industry Association (SIA).

Mosel Vitelic to sell ProMOS shares

09/02/2003  September 2, 2003 - Mosel Vitelic, Taipei, Taiwan, has applied with the Taiwan Stock Exchange to sell 90 million shares of ProMOS Technologies, nearly 11% of its stake in the DRAM chipmaker.

Xignal launches front-end design IP

09/02/2003  September 2, 2003 - Xignal Technologies AG, Munich, Germany, an IP provider for the communications semiconductor industry, has released a new AFE design for mixed-signal ICs.




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Environment, Safety & Health

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The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

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As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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