Device Architecture

DEVICE ARCHITECTURE ARTICLES



Fujitsu develops spread-spectrum clock generator

04/21/2003  APRIL 21--TOKYO, Japan--Fujitsu Limited and Fujitsu VLSI Limited have developed a spread-spectrum clock generator (SSCG) system chip that achieves the world's lowest power requirement and electromagnetic interference (EMI) levels.

Leading-edge technology is no safe place for foundry investment, says SMA

04/14/2003  April 14, 2003 - Santa Cruz, CA - New data from the latest World Fab Watch, by Strategic Marketing Associates (SMA), indicates that competition is heating up to provide sub-180nm foundry services among a variety of players. The result is a threat of overcapacity by 2005.

Fujitsu, AMD to merge flash memory ops

04/01/2003  April 1, 2003 - Tokyo, Japan, and Sunnyvale, CA - Fujitsu Ltd. is set to merge its flash memory operations with those of Advanced Micro Devices Inc. (AMD) through a joint venture, reported the Nihon Keizai Shimbun.

Motorola develops nanocrystal-based memory chip

04/01/2003  Motorola Inc. has demonstrated what it calls the first memory chip based on silicon nanocrystals, according to a news release.

HP's moltronics research helps energize small tech startups

03/28/2003  There are very few companies that possess the money and technical talent it takes to seriously pursue molecular electronics. That's where Hewlett-Packard Co. comes in. HP’s nanocomputing efforts will have major effects on smaller startups that are working on their own molecular electronics applications.

NVE gets ready to clean up when memory enters the spin cycle

03/10/2003  A small Minnesota company hopes to make conventional electronic memory, well, a thing of the past. NVE Corp. is designing devices that use spintronics to store information. The technique promises to shrink products to a new scale while creating always-on electronic components for military, biomedical, environmental and consumer devices.

Another nail in Schon's research coffin

03/03/2003  Fired Bell Laboratories researcher Jan Hendrik Schon’s fall from grace continues months after investigators concluded his molecular electronics studies contained fabricated data. Two independent efforts to replicate Schon’s self-assembled monolayer field effect transistors failed to produce working devices, the journal Nano Letters reported, suggesting there is little to salvage from what was considered hallmark findings in 2001.

ST, Philips, Motorola open R&D and process center

02/27/2003  Feb. 27, 2003 - Crolles, France - Jacques Chirac, president of the French Republic, inaugurated the Crolles2 Alliance facility in Crolles near Grenoble, France. The R&D center, owned by STMicroelectronics (ST), Motorola, and Philips, will pioneer CMOS technology from 90nm processes to 32nm over the next five years and also includes a 300mm wafer semiconductor manufacturing pilot line, which is now beginning operation.

Samsung to invest $296 million in memory-chip producing facilities

02/27/2003  Feb. 27, 2003 - Seoul, Korea - Samsung Electronics Co. will invest 305 billion won (US$295.54 million) in memory-chip producing facilities during the first half of this year to meet increasing demand, the company said.

Pity by the Bay: Valley frets over other areas' newfound fortunes

02/07/2003  Is the Bay Area’s status as a nanotech stronghold in trouble? Speakers at a San Francisco nanotech event recently would have you thinking yes. They painted a bleak picture of nanotech’s future, warning that the Valley was in danger of ceding its preeminence to other places. “The Valley is living off its past glories, assuming that this will extend to nanotechnology,” said one VC.

Exclusive Feature: WAFER TEST

Parametric test hardware for ultralow-current measurements

01/22/2003  By: David Rose, Qi Wang, Keithley Instruments Inc., Cleveland, Ohio

Increasingly, parametric testing of MOSFETs in CMOS ICs requires very accurate measurement of various source, drain, and gate currents, and characterization of low current phenomena. The tester, cabling, and chucks used must be properly integrated... MORE

Akustica extends first round financing to $4.5M

01/22/2003  Akustica Inc., a Pittsburgh developer of MEMS-based acoustic chips, extended its first round of financing to $4.5 million, according to a company news release. Akustica previously closed the round in October at $2.25 million.

Tahoe RF Semiconductor launched

01/09/2003  Jan. 9, 2003 - Auburn, CA - A team of engineers formerly with IBM Microelectronics' wireless division have formed a new radio and analog IC design company, Tahoe RF Semiconductor Inc.

AMD, IBM to develop advanced chip technologies

01/08/2003  Jan. 8, 2003 - Sunnyvale, CA, and East Fishkill, NY - AMD and IBM have entered into an agreement to jointly develop chipmaking technologies for use in future high-performance products.

NEC, Hitachi ask Intel to fund DRAM company

01/06/2003  Jan. 6, 2003 - Tokyo, Japan - NEC Corp. and Hitachi Ltd. have started negotiations with Intel Corp., requesting that Intel take a stake in their joint venture.

SMIC forms foundry partnership with Elpida

01/06/2003  Jan 6., 2003 - Shanghai, China - Semiconductor Manufacturing International Corporation (SMIC) and Elpida Memory Inc. have signed a five-year arrangement.

Multichip Packaging, Business and logistical issues

01/01/2003  Continuing functional enhancement of portable consumer and computing products challenges electronics industry OEMs to provide these products in smaller and lighter form factors.

Sandisk, Toshiba considering fab expansion

12/20/2002  Dec. 20, 2002 - Sunnyvale, CA - Sandisk and Toshiba are planning a substantial increase in memory production at their Flashvision joint venture from 2003. They are also considering the construction of a new fabrication plant to handle an anticipated increase in demand in the second half of this decade, the companies have announced.

Micron posts wider net loss

12/18/2002  Dec. 18, 2002 - Boise, ID - Micron Technology Inc. reported a wider fiscal first quarter net loss on Tuesday, saying the average selling prices for its products dropped about 12% from the prior quarter, according to Reuters.

AMD reorganizes memory group

12/16/2002  Dec. 16, 2002 - Sunnyvale, CA - Advanced Micro Devices has reorganized its flash memory chip operations as it attempts to take better advantage of increased memory needs in advanced electronics products, reports CBS MarketWatch.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

Sponsored By:

More Webcasts