Device Architecture

DEVICE ARCHITECTURE ARTICLES



North American semiconductor equipment industry posts November 2017 billings

12/15/2017  North America-based manufacturers of semiconductor equipment posted $2.05 billion in billings worldwide in November 2017 (three-month average basis), according to the November Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI.

Toshiba and Western Digital reach global settlement and agree to strengthen flash memory collaboration

12/14/2017  As part of this agreement, TMC and Western Digital will participate jointly in future rounds of investment in Fab 6, the memory fabrication facility now under construction at Yokkaichi, including the upcoming investment round announced by Toshiba in October 2017.

IXYS announces 200V power MOSFETs with fast body diodes and lowest on-resistances

12/14/2017  Fabricated using a charge compensation principle and IXYS' own process technology, these new MOSFETs exhibit the lowest on-state resistances in the industry.

QuickLogic collaborates with Mentor to provide seamless design environment for eFPGA technology

12/14/2017  QuickLogic Corporation, a developer of ultra-low power multi-core voice-enabled SoCs, embedded FPGA IP, display bridge and programmable logic solutions, announced that it has collaborated with Mentor, a Siemens business, to provide a seamless design and development environment for its embedded FPGA (eFPGA) technology.

Industry enters the age of WOW

12/13/2017  The semiconductor industry has been there before, with large increases in investments followed by dramatic downturns. While the most dramatic downturns, 2001 and 2009, were due to, in a large part, acro-economic factors, the industry has typically observed one to two years of increased investment spending followed by a down period. This time around, the industry will achieve a “WOW” with three consecutive years of fab investment growth, a pattern not observed since the mid-1990s.

4Q DRAM sales put exclamation point on an amazing year of growth

12/13/2017  Forecast for record quarterly DRAM sales of $21.1 billion, with 74% annual growth expected.

New silicon structure opens the gate to quantum computers

12/12/2017  In a major step toward making a quantum computer using everyday materials, a team led by researchers at Princeton University has constructed a key piece of silicon hardware capable of controlling quantum behavior between two electrons with extremely high precision.

National Academy of Inventors announces SUNY Poly professor Dr. Bin Yu selected as 2017 NAI Fellow

12/12/2017  Dr. Yu selected for significant contributions to semiconductor-based devices, nanotechnology research after being awarded more than 300 U.S. patents.

New power devices could drastically reduce energy waste

12/08/2017  New design could dramatically cut energy waste in electric vehicles, data centers, and the power grid.

Leti memory breakthrough point way to significant improvements in SoC memories

12/08/2017  Leti, a research institute of CEA Tech, demonstrated significant improvements in the field of memory systems at IEDM 2017 this week.

Researchers quantify factors for reducing power semiconductor resistance by two-thirds

12/05/2017  Discovery expected to lower energy consumption in electric power equipment.

SEMI reports record quarterly billings of $14.3B

12/05/2017  Quarterly billings of US$14.3 billion set an all-time record for quarterly billings, exceeding the record level set in the second quarter of this year.

Broad 3Q 2017 growth - Both globally and in Europe

12/04/2017  The third quarter of this year has seen broad growth both globally and also for the European electronic supply chain.

GLOBALFOUNDRIES and Ayar Labs establish strategic collaboration to speed up data center applications 

12/04/2017  GLOBALFOUNDRIES and Ayar Labs, a startup bringing optical input/output (I/O) to silicon chips, today announced a strategic collaboration to co-develop and commercialize differentiated silicon photonic technology solutions.

Google’s head of Quantum AI Lab to keynote at The ConFab 2018

12/01/2017  The ConFab 2018, to be held at The Cosmopolitan of Las Vegas on May 21-23, is thrilled to announce the newest opening day Keynote speaker, Professor John M. Martinis.

Semiconductor industry continues upward trend toward record year

11/30/2017  The semiconductor industry continued its upward trend in the third quarter of 2017, notching 12 percent sequential growth with strength across all application markets, according to IHS Markit.

Micron appoints Derek Dicker as Storage Business Unit vice president and general manager

11/30/2017  Micron Technology Inc. (Nasdaq:MU) today announced that the company has appointed Derek Dicker as vice president and general manager of the Storage Business Unit.

SiFive joins FDXcelerator Program

11/29/2017  SiFive announced today that it has joined GLOBALFOUNDRIES' FDXcelerator Partner Program, and will be making RISC-V CPU IP including SiFive's E31 and E51 RISC-V cores available on GF's 22FDX process technology.

North American semiconductor equipment industry posts October 2017 billings

11/28/2017  North America-based manufacturers of semiconductor equipment posted $2.02 billion in billings worldwide in October 2017 (three-month average basis).

Emmanuel Sabonnadiere named Leti CEO

11/28/2017  Leti, a technology research institute of CEA Tech, announced that Emmanuel Sabonnadiere has been named CEO, succeeding Marie-Noelle Semeria.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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