10/06/2017  This prestigious award recognizes NXP for Excellence in Quality for displaying the highest quality standards, practices, and methodologies in their products and processes, and differentiating through their quality management systems and alignment to Cisco’s strategies and values.

10/06/2017  Researchers are first to demonstrate a circulator on a silicon chip at mm-wave frequencies that enables nonreciprocal transmission of waves: device could enable two-way radios and transform 5g networks, self-driving cars, and virtual reality.

10/05/2017  Global power semiconductor revenues grew year-over-year by 3.9 percent in 2016, reversing a 4.8 percent decline in 2015.

10/05/2017  With fabless companies in China on the rise, the country is expected to account for 13% share of pure-play foundry sales in 2017.

10/04/2017  The MOSFET currently has the industry’s lowest operating voltage of 0.2 Volt (V) and current of less than one nano amp (nA).

10/04/2017  Worldwide sales up 24 percent year-to-year and 4 percent month-to-month; Americas market leads the way with growth of 39 percent year-to-year and 9 percent month-to month.

10/04/2017  A team of University of Wisconsin–Madison engineers has created the most functional flexible transistor in the world -- and with it, a fast, simple and inexpensive fabrication process that’s easily scalable to the commercial level.

10/03/2017  Rutgers-led discovery could spawn a wave of new electronic devices.

10/03/2017  There has been a great deal of speculation around the composition of Intel’s Optane XPoint memory technology. TechInsights set about to find answers.

10/03/2017  Today, SEMI announced the lineup of keynotes coming to SEMICON Japan's "SuperTHEATER" -- focusing on the future of the electronics manufacturing supply chain.

10/02/2017  Japan chip industry finds growth opportunities in robotics; explored at SEMICON Japan (December 13-15) in Tokyo.

10/02/2017  The SEMI International Standards Committee, at their SEMICON West 2017 meeting, approved the transformation of the existing 3D Stacked IC Committee and Assembly & Packaging Committee into a single, unified 3D Packaging and Integration Committee.

10/02/2017  Graphene is a sheet of carbon one atom thick, and it has drawn worldwide attention as a new material. A Japanese research group discovered that pressure is generated by simply stacking graphene oxide nanosheets. They also found that the pressure can be increased by reducing the interlayer distance through heat treatment. It is an innovative approach for applying high pressure without using an enormous amount of energy.

09/29/2017  The Semiconductor Industry Association (SIA) released the following statement today from SIA president & CEO John Neuffer in support of the corporate tax reform framework released today by leaders in the Trump Administration and Congress.

09/28/2017  SK Hynix Inc. announced its board of directors yesterday approved its plan to participate in a Bain Capital-led consortium that plans to purchase Toshiba Corporation's memory chip unit, Toshiba Memory Corporation

09/27/2017  Inventory corrections, economic uncertainty, and price erosion derailed the power transistor market in the last five years, but the 2017 O-S-D Report sees steady modest growth ahead.

09/26/2017  SiFive today announced it has joined the TSMC IP Alliance Program, part of the TSMC Open Innovation Platform, which accelerates innovation in the semiconductor design community.

09/26/2017  Researchers from Finland and Taiwan have discovered how graphene, a single-atom-thin layer of carbon, can be forged into three-dimensional objects by using laser light. A striking illustration was provided when the researchers fabricated a pyramid with a height of 60nm, which is about 200 times larger than the thickness of a graphene sheet.

09/25/2017  Applications now include nanoscale Spintronics sensors that further enhance the areal density of hard disk drives, through MRAMs that are seriously being considered to replace embedded flash, static random access memories (SRAM) and at a later stage dynamic random access memories (DRAM).

09/22/2017  Equipment billings in August declined relative to July, signaling a pause in this year's extraordinary growth.