Device Architecture

DEVICE ARCHITECTURE ARTICLES



Update on the sale of Toshiba Memory Corporation

09/01/2017  There have been media reports speculating that Toshiba will make a decision on Aug 31 at Toshiba’s Board of Directors meeting.

DARPA's drive to keep the microelectronics revolution at full speed builds its own momentum

09/01/2017  A dozen performer teams with DARPA’s CHIPS program convene to kick off an ambitious push for an era of versatile, plug-and-play "chiplets."

SiC & GaN technologies upset the traditional benchmarks of the IGBT industry

09/01/2017  How is the IGBT market evolving for different applications? How will the IGBT market face the adoption of high performance WBG based devices?

Equipment forecast: $49.4 billion

09/01/2017  In 2018, 7.7 percent growth is expected, resulting in another record-breaking year—totaling $53.2 billion for the global semiconductor equipment market.

New device could turn heat energy into a viable fuel source

08/31/2017  A new device being developed by Washington State University physicist Yi Gu could one day turn the heat generated by a wide array of electronics into a usable fuel source.

Most of 2017 capital spending will go to foundry and flash memory

08/31/2017  Spending for DRAM expected to show biggest percentage gain in 2017.

Leti launches emulator service to boost ROI and speed time to market for European chipmakers

08/31/2017  Leti, a technology research institute of CEA Tech, and Mentor, a Siemens business, today announced Leti will provide access to the Mentor Veloce emulator to SMEs and startups and will introduce emulation technology to global companies beginning Q3 2017.

Silicon solves problems for next-generation battery technology

08/30/2017  Silicon - the second most abundant element in the earth's crust - shows great promise in Li-ion batteries, according to new research from the University of Eastern Finland. By replacing graphite anodes with silicon, it is possible to quadruple anode capacity.

Researchers validate UV light's use in improving semiconductors

08/29/2017  A discovery by two scientists at the Energy Department's National Renewable Energy Laboratory (NREL) could aid the development of next-generation semiconductor devices.

Littelfuse to acquire IXYS Corporation

08/28/2017  Acquisition significantly expands capabilities across high growth power semiconductor markets.

New results reveal high tunability of 2-D material

08/28/2017  Berkeley Lab-led team also provides most precise band gap measurement yet for hotly studied monolayer moly sulfide.

Recipe for safer batteries -- Just add diamonds

08/25/2017  Drexel researchers show nanodiamonds can prevent short-circuits and fires in lithium batteries.

Gary Locke joins nLIGHT, Inc. Board of Directors

08/23/2017  nLIGHT, Inc., a U.S. company in high-power semiconductor and fiber lasers, today announced the appointment of Gary Locke to its board of directors effective immediately.

North American semiconductor equipment industry posts July 2017 billings

08/23/2017  North America-based manufacturers of semiconductor equipment posted $2.27 billion in billings worldwide in July 2017.

SiFive and Rambus to provide IP to the 'DesignShare' economy

08/22/2017  SiFive, the first fabless provider of customized, open-source-enabled semiconductors, today announced it will partner with Rambus to make Rambus cryptography technology available for the SiFive Freedom platforms.

Silego announces shipping more than 3 billion configurable mixed-signal ICs

08/22/2017  Silego Technology today announced shipping three billion units since its introduction of the pioneering Configurable Mixed-signal ICs (CMICs). In addition, Silego announced it shipped more than one hundred million units in the month of July.

Semiconductor industry capital spending forecast to jump 20% in 2017

08/22/2017  Samsung remains the “wild card” with regard to 2H17 capital expenditures.

TowerJazz and Tacoma announce a partnership for a new 8-inch fabrication facility in Nanjing, China

08/21/2017  TowerJazz to gain up to 50% of the planned fab loading capacity.

SEMI Foundation celebrates New York State United Teachers, Recognizes Applied Materials & KLA-Tencor Volunteers of the Year

08/21/2017  The SEMI Foundation today announced that it will be celebrating its 10th anniversary of partnership with New York State United Teachers (NYSUT) on August 22-23 in Latham, New York at the NYSUT headquarters.

PC DRAM contract price rose by over 10% sequentially and global DRAM revenue increase by 16.9% sequentially Q2

08/18/2017  Global DRAM revenue reached a new historical high in the second quarter of 2017, according to DRAMeXchange.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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