Device Architecture

DEVICE ARCHITECTURE ARTICLES



DRAM, NAND flash, automotive analog/logic among bestgrowing ICs

08/15/2017  Topping the chart of fastest-growing products is DRAM, which comes as no surprise given the strong rise of average selling prices in this segment throughout the first half of 2017.

Global Memory Card Market to Exceed $9 billion by 2021

08/10/2017  The market for memory cards will reach $9.025 billion by 2021. That’s up from $8.83 billion in 2016, a CAGR of approximately 0.45%.

Samsung introduces far-reaching V-NAND memory solutions to tackle data processing and storage challenges

08/09/2017  Samsung Electronics Co., Ltd. has announced new V-NAND (Vertical NAND) memory solutions and technology that will address the pressing requirements of next-generation data processing and storage systems.

GLOBALFOUNDRIES demonstrates 2.5D high-bandwidth memory solution

08/09/2017  GLOBALFOUNDRIES today announced that it has demonstrated silicon functionality of a 2.5D packaging solution for its high-performance 14nm FinFET FX-14 integrated design system for application-specific integrated circuits (ASICs).

IntelliProp announces Gen-Z persistent memory controller combining DRAM and NAND

08/08/2017  This controller combines DRAM and NAND and sits on the Gen-Z fabric, not the memory bus.

Microsemi collaboration enables Mellanox and other industry leaders to deliver NVMe-oF architectures

08/08/2017  Microsemi's peer-to-peer memory technology facilitates large data streams to transfer between NVMe-oF applications with better throughput, latency and quality of service.

NXP announces production of security chips in its US manufacturing facilities

08/04/2017  NXP Semiconductors N.V. announced a $22 million dollar program that expands its operations in the United States.

Mid-year global semiconductor sales up 21% compared to 2016

08/04/2017  Q2 sales are highest on record, 5.8 percent more than previous quarter, 23.7 percent higher than Q2 of last year.

?GLOBALFOUNDRIES, Silicon Mobility deliver the industry’s first automotive FPCU to boost performance for hybrid and electric vehicles

08/03/2017  GLOBALFOUNDRIES and Silicon Mobility today announced they have successfully produced the industry’s first automotive Field Programmable Controller Unit (FPCU) solution, called OLEA T222.

Gen. Keith Alexander to deliver keynote address at SIA's 40th Anniversary Award Dinner

08/02/2017  Former Director of National Security Agency, Commander of U.S. Cyber Command to weigh in on the importance of technology to national security.

Significant mid-year revision to 2017 IC market forecast

08/02/2017  DRAM, NAND flash memory markets drive the first annual double-digit upturn since 2010.

Ferroelectric phenomenon proven viable for oxide electrodes, disproving predictions

08/01/2017  Researchers in China have disproved the theory that oxide electrodes destabilize ferroelectric phenomena called flux-closure domains in ferroelectric thin films.

Analog Devices joins University of Michigan’s Mcity Initiative for advancing connected and autonomous vehicles

07/31/2017  Analog Devices, Inc. (ADI) today announced that it has become an affiliate member of Mcity at the University of Michigan.

The pervasiveness of ASICs in the IoT era

07/28/2017  For an increasing number of designs, companies are finding it beneficial to design their own ASICs with system-on-a- chip (SoC) complexity. For reasons of cost reduction, quality improvement, IP protection and security, a full turn-key ASIC can be achieved for $1-5 million, particularly if the design can be built using mature technology nodes.

Overcoming challenges in 3D NAND volume manufacturing

07/27/2017  As 3D NAND becomes the mainstream technology, its challenging roadmap poses opportunities for continued innovation.

Atomic discovery opens door to greener, faster, smaller electronic circuitry

07/26/2017  Scientists find way to correct communication pathways in silicon chips, making them perfect.

Dow Corning receives Global Supplier Award from Bosch

07/26/2017  Issued every two years, Bosch’s coveted awards recognize companies that have demonstrated outstanding performance in the manufacture and supply of products or services to Bosch.

North American semiconductor equipment industry posts June 2017 billings

07/26/2017  Through the first half of the year, 2017 equipment billings are 50 percent above the same period last year.

Scientists announce the quest for high-index materials

07/25/2017  A team of physicists featuring researchers from MIPT and ITMO University has conducted a comparative analysis of a range of materials to determine if they are applicable to dielectric nanophotonics. Their systematic study produced results that can optimize the use of known materials for building optical nanodevices, as well as encourage the search for new materials with superior properties.

Second quarter 2017 silicon wafer shipments increase quarter-over-quarter

07/25/2017  Worldwide silicon wafer area shipments increased during the second quarter 2017 when compared to first quarter 2017 area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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