Device Architecture

DEVICE ARCHITECTURE ARTICLES


SEMI and Solid State Technology announce 2017 “Best of West” Award finalists

06/28/2017  Each year at SEMICON West, the “Best of West” awards are presented by Solid State Technology and SEMI.

It’s time for new innovation

06/20/2017  What if the automotive industry had achieved the incredible pace of innovation as the semiconductor industry during the last 52 years?
How SEMI Standard E175 is saving energy and cutting costs

06/20/2017  Industry experts answer questions about the new standard in a virtual roundtable.
Synopsys, GlobalFoundries collaborate to deliver design platform and IP enablement for 7nm finFET process

06/20/2017  Synopsys, Inc. today announced the enablement of the Synopsys Design Platform and DesignWare Embedded Memory IP on GLOBALFOUNDRIES 7nm Leading-Performance (7LP) FinFET process technology.
Cellphone IC sales will top total personal computing in 2017

06/20/2017  Higher memory prices accelerate sales growth in both cellphones and personal computing systems but cellular handsets will become the largest application for ICs this year.
What TechInsights analysts are watching in 2017

06/19/2017  TechInsights analysts share their view on where technology is going, how it’s changing, and what new developments are emerging.
GLOBALFOUNDRIES, ON Semiconductor deliver the industry's lowest power Bluetooth low energy SoC family

06/19/2017  GLOBALFOUNDRIES and ON Semiconductor (Nasdaq: ON) today announced the availability of a System-on-Chip (SoC) family of devices, on GF's 55nm Low Power Extended (55LPx), RF-enabled process technology platform.
MagnaChip to offer 0.13 micron BCD process technology with high-density embedded flash

06/19/2017  This BCD process offers 40V power LDMOS and delivers 64K Bytes flash memory, making it suitable for programmable PMIC, wireless power chargers and USB-C power-delivery IC products.
The automotive electronics market: A view from a material supplier

06/16/2017  With the increasing sophistication of future vehicles, new and more advanced semiconductor technologies will be used and vehicles will become technology centers.
North American semiconductor equipment industry posts May 2017 billings

06/16/2017  North America-based manufacturers of semiconductor equipment posted $2.27 billion in billings worldwide in May 2017 (three-month average basis)
GLOBALFOUNDRIES on track to deliver Leading-Performance 7nm FinFET technology

06/14/2017  GLOBALFOUNDRIES this week announced the availability of its 7nm Leading-Performance (7LP) FinFET semiconductor technology, delivering a 40 percent generational performance boost.
Imec world-first to develop 200V, 650V dispersion free normally-off/e-mode power devices on 200mm/8-inch Si wafers

06/13/2017  Imec announced today that it has developed 200V and 650V normally-off/enhancement mode (e-mode) on 200mm/8-inch GaN-on-Silicon wafers.
Cypress Executive Chairman Ray Bingham steps down from Board

06/12/2017  Cypress Semiconductor Corporation announced that Executive Chairman Ray Bingham has tendered his resignation as Executive Chairman and is stepping down from the Board of Directors.
Long-term IoT semiconductor forecast reduced

06/08/2017  Total IoT forecast scaled back mostly because of lower revenue projections for connected cities.
Global semiconductor sales increase 21% year-to-year in April

06/07/2017  Double-digit annual growth projected for 2017.
SIA welcomes DARPA initiative to advance transformative semiconductor technologies

06/06/2017  New program aims to progress beyond traditional scaling, catalyze next-generation semiconductor technologies.
SEMI reports record quarterly billings of $13.1B

06/06/2017  The quarter ended very strong, with March billings reaching $5.6 billion, an all-time monthly record.
Record fab spending for 2017 and 2018

06/06/2017  In 2017, over US$49 billion will be spent on equipment alone, a record for the semiconductor industry. Spending on new fab construction is projected to reach over $8 billion, the second largest year on record.

Engineer unveils new spin on future of transistors with novel design

06/05/2017  All-carbon, spintronic proposal could lead to smaller, better performing structures in electronics.
Seeing the invisible with a graphene-CMOS integrated device

06/05/2017  Flagship researchers integrate graphene and quantum dots with CMOS technology to create an array of photodetectors, producing a high resolution image sensor.



WEBCASTS


Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

Sponsored By:

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