Device Architecture

DEVICE ARCHITECTURE ARTICLES


U.S. companies still hold largest share of fabless company IC sales

03/16/2017  Largest fabless IC marketshare increase has come from Chinese suppliers, who now hold a 10% share.
AIM Photonics welcomes Coventor as newest member

03/16/2017  US-backed initiative taps process modeling specialist to enable manufacturing of high-yield, high-performance integrated photonic designs.
Synopsys' IC Compiler II certified for TSMC's 12nm process technology

03/16/2017  Synopsys, Inc. today announced that TSMC has certified the complete suite of products in the Synopsys Galaxy Design Platform for the most current version of 12nm FinFET process technology.
Electro-optical switch transmits data at record-low temperatures

03/16/2017  A silicon optical switch newly developed at Sandia National Laboratories is the first to transmit up to 10 gigabits per second of data at temperatures just a few degrees above absolute zero.

Synopsys and TSMC collaborate to develop interface, analog and foundation IP for 12nm finFET process

03/16/2017  Synopsys, Inc. (Nasdaq: SNPS) today announced its collaboration with TSMC to develop DesignWare Interface, Analog and Foundation IP for TSMC's 12FFC process.
Cadence expands capabilities of integrated design and analysis flow for TSMC InFO packaging technology

03/13/2017  Cadence Design Systems, Inc. today announced new optimization capabilities within its holistic, integrated design flow for TSMC's advanced wafer-level Integrated Fan-Out (InFO) packaging technology.

SEMICON China 2017 opens tomorrow in Shanghai

03/13/2017  Over 60,000 attendees are expected at SEMICON China opening tomorrow at Shanghai New International Expo Centre (SNIEC).
Analog Devices completes acquisition of Linear Technology

03/10/2017  Analog Devices, Inc. today announced the completion of its acquisition of Linear Technology Corporation.
Applied Materials names Thomas J. Iannotti chairman of the Board of Directors

03/10/2017  Applied Materials, Inc. today announced Thomas J. Iannotti as chairman of the Board of Directors effective immediately. Mr. Iannotti succeeds Willem P. Roelandts, who has retired from the board.
Semiconductor shipments dominated by opto-sensor-discrete devices

03/10/2017  Updated forecast shows total semiconductor shipments surpassing one trillion devices in 2018.
Synopsys advances virtual prototyping to enable system and semiconductor supply chain collaboration for next-gen SoCs

03/09/2017  Synopsys, Inc. today announced the availability of a key technology in virtual prototyping which enables architecture performance requirements to be easily shared through the supply chain.
NXP launches single-chip SoC with integrated microcontroller

03/09/2017  NXP Semiconductors today announced the world's smallest single-chip SoC solution -- the MC9S08SUx microcontroller (MCU) family -- with an integrated 18V-to-5V LDO and MOSFET pre-driver that delivers ultra-high-voltage solution for drones, robots, power tools, DC fan, healthcare and other low-end brushless DC electric motor control (BLDC) applications.
Leti announces backside shield that protects microchips from physical attacks

03/08/2017  Leti, a research institute of CEA Tech, today announced it has developed a shield that can help protect electronic devices against physical attacks from the chips’ backside.
Reducing conducting thin film surface roughness for electronics

03/07/2017  In a significant advance, particularly within the microelectronics realm, University of Massachusetts Amherst engineers have established electrical surface treatment of conducting thin films as a physical processing method to reduce surface roughness.
Imec’s 200mm GaN-on-Si e-mode power devices withstand heavy ion and neutron irradiation

03/07/2017  Radiation hardness of e-mode devices confirm maturity of imec’s 200mm GaN-on-Si platform.
Record spending for fab equipment expected in 2017 and 2018

03/07/2017  Today, SEMI announced updates to its World Fab Forecast report, revealing that fab equipment spending is expected to reach an industry all-time record ? more than US$46 billion in 2017.

Cypress closes sale of Minnesota wafer fabrication facility

03/06/2017  Cypress Semiconductor Corp. (Nasdaq: CY) today announced it has sold the subsidiary that owns its semiconductor wafer fabrication facility in Bloomington, Minnesota to SkyWater Technology Foundry for $30 million.
January semiconductor sales up 14% compared to last year

03/06/2017  Year-to-year growth is market's largest since November 2010; month-to-month sales decrease slightly.
Imec presents InGaAs TFET with sub-60 mV/decade sub-threshold swing

03/06/2017  Promising alternative for MOSFET in future ultralow power chips.
Semiconductor manufacturing's next big thing at ASMC 2017

03/02/2017  Manufacturers, suppliers and academia gather to understand the road ahead.



WEBCASTS


Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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