Device Architecture

DEVICE ARCHITECTURE ARTICLES



Eleven companies forecast to account for 78% of semi capex in 2017

03/02/2017  Three of the top 11 companies are expected to increase capex spending by 25% or more.

TSMC joins Semiconductor Research Corporation

02/28/2017  Semiconductor Research Corporation today announced that TSMC has signed an agreement to participate in two SRC research initiatives.

Semitrex changes name to Helix Semiconductors

02/24/2017  Fabless power semiconductor company Semitrex announced today that it has changed its name to Helix Semiconductors.

NXP joins Auto-ISAC to collaborate on security challenges of connected cars

02/24/2017  NXP Semiconductors N.V., the world's largest supplier of automotive semiconductors, announced that it has joined the Automotive Information Sharing and Analysis Center (Auto-ISAC).

Taiwan maintains largest share of global IC wafer fab capacity

02/23/2017  South Korea narrows gap with Taiwan; China shows biggest increase, accounts for nearly 11%.

North American semiconductor equipment industry posts January 2017 billings

02/22/2017  North America-based manufacturers of semiconductor equipment posted $1.86 billion in billings worldwide in January 2017 (three-month average basis).

SEMI appoints Ajit Manocha as president and CEO

02/21/2017  SEMI today announced the appointment of Ajit Manocha as its president and CEO.

GlobalFoundries announces availability of 45nm RF SOI

02/21/2017  Optimized RF features deliver high-performance solutions for mmWave beam forming applications in 5G smartphones and base stations.

Brooks Instrument names Mohamed Saleem as new Chief Technology Officer

02/21/2017  Mohamed Saleem has joined Brooks Instrument as the company's new chief technology officer (CTO), where he will oversee its California-based technology development center.

'Lossless' metamaterial could boost efficiency of lasers and other light-based devices

02/17/2017  Engineers at the University of California San Diego have developed a material that could reduce signal losses in photonic devices.

Huge growth in cloud memory changes semiconductor supply chain

02/17/2017  The explosive growth in demand for internet bandwidth and cloud computing capacity brings a new set of technology challenges and opportunities for the semiconductor supply chain.

Intel continues to drive semiconductor industry R&D spending

02/16/2017  Among Top-10 R&D spenders, Intel accounted for 36% of R&D outlays.

A new spin on electronics

02/15/2017  Information transport by spin as an alternative to conventional computing technology.

Is a stretchable smart tablet in our future?

02/15/2017  Engineering researchers at Michigan State University have developed the first stretchable integrated circuit that is made entirely using an inkjet printer, raising the possibility of inexpensive mass production of smart fabric.

Extending VCSEL wavelength coverage to the mid-infrared

02/14/2017  In a breakthrough for gas sensing, a group of researchers in Germany has developed a buried tunnel junction VCSEL with a single-stage type-II active region to extend the wavelength coverage of electrically pumped VCSELs.

Semtech adds ultra-low RDS(on) load switch family to FemtoSwitch platform

02/14/2017  Semtech Corporation, a supplier of analog and mixed-signal semiconductors, today announced the latest family of load switches in its FemtoSwitch product platform.

GlobalFoundries 12-inch wafer production line in Chengdu commences operation

02/13/2017  The company will continue investing in its wafer plants in the United States and Germany, expand its capacity in Singapore, and construct a facility to produce 12-inch wafers in Chengdu, China in order to satisfy Chinese and global demands for the company's 22FDX technology.

Applied Materials CTO Dr. Om Nalamasu elected to National Academy of Engineering

02/10/2017  Applied Materials, Inc. announced today that Dr. Om Nalamasu, Senior Vice President and Chief Technology Officer, has been elected to the U.S. National Academy of Engineering (NAE), one of the highest professional honors for engineers.

GlobalFoundries reveals expansion plans

02/10/2017  The company is investing in its existing leading-edge fabs in the United States and Germany, expanding its footprint in China with a fab in Chengdu, and adding capacity for mainstream technologies in Singapore.

A new sensitive and stable self-powered photodetector

02/10/2017  Researchers in Singapore and China collaborate to create new photodetector based on GdNiO3/Nb-doped SrTiO3 p-n heterojunction.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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