Device Architecture

DEVICE ARCHITECTURE ARTICLES



Toshiba starts construction of Fab 6 and memory R&D center at Yokkaichi, Japan

02/09/2017  Toshiba Corporation today announced that it has started construction of a new semiconductor fabrication facility, Fab 6, and a new R&D center, the Memory R&D Center, at Yokkaichi Operations in Mie prefecture, Japan, the company’s main memory production base.

Intel announces $7B investment in next-gen semiconductor fab in Arizona

02/09/2017  The announcement was made by U.S. President Donald Trump and Intel CEO Brian Krzanich at the White House.

IC market growth limited by narrow window of global GDP expansion

02/09/2017  Significant and noticeable IC market growth closely tied to significant worldwide GDP growth.

UNIST to engineer dream diodes with a graphene interlayer

02/08/2017  A team of researchers, affiliated with UNIST has created a new technique that greatly enhances the performance of Schottky Diodes (metal-semiconductor junction) used in electronic devices.

SEMICON Korea huge 30th year anniversary event opens today

02/08/2017  SEMICON Korea 2017, opening today at COEX in Seoul, celebrates its 30th anniversary with its largest-ever exhibition.

Annual silicon volume shipments remain at record highs

02/07/2017  Revenues continue to be under pressure.

Marcel Pelgrom of NXP named recipient of prestigious IEEE Gustav Robert Kirchhoff Award

02/06/2017  NXP Semiconductors N.V. today announced that Marcel Pelgrom is the recipient of the 2017 Gustav Robert Kirchhoff Award from the IEEE.

Global semiconductor sales reach $339B in 2016

02/03/2017  Worldwide industry posts highest-ever annual sales; year-to-year sales increase 12 percent in December.

Veeco enters into agreement to acquire Ultratech

02/03/2017  The Boards of Directors of both Veeco and Ultratech have unanimously approved the transaction.

Micron CEO announces upcoming retirement

02/02/2017  Micron Technology, Inc. today announced the upcoming retirement of its Chief Executive Officer, Mark Durcan.

Artificially introduced atomic-level sensors enable measurements of the electric field within a working semiconductor device

02/02/2017  A group of Takayuki Iwasaki, Mutsuko Hatano and colleagues at the Tokyo Institute of Technology, the Japan Science and Technology Agency (JST) and Toshiharu Makino at the National Institute of Advanced Industrial Science and Technology (AIST) has reported a new method for sensing internal electric fields at the interior of operating semiconductor devices.

Samsung and Apple continued to lead as top global semiconductor customers in 2016

02/01/2017  Samsung Electronics and Apple remained the top two semiconductor chip buyers in 2016, representing 18.2 percent of the total worldwide market, according to Gartner, Inc.

Reliability Symposium coming to Silicon Valley

02/01/2017  The Silicon Valley Reliability Symposium will be held on Thursday, February 9th, 2017 at the Biltmore Hotel and Suites in Santa Clara, CA from 8:00 AM until noon.

SEMI 2020: "There are far better things ahead than any we leave behind"

02/01/2017  “Do not go where the path may lead, go instead where there is no path and leave a trail,” was how I started last week’s article. In that article we looked back on 2016 and the incredible progress of the industry and how it continually cuts new trail and keeps moving at the speed of Moore’s Law.

Without technology, China's "MIC 2025" results for ICs likely to fall woefully short of its goals

02/01/2017  IC Insights believes China's self-sufficiency targets for ICs of 40% in 2020 and 70% in 2025 are unrealistic.

The world's first heat-driven transistor

01/31/2017  The heat-driven transistor opens the possibility of many new applications such as detecting small temperature differences, and using functional medical dressings in which the healing process can be monitored.

Sequans opens R&D facility in Sophia Antipolis, France

01/30/2017  LTE for IoT chip maker Sequans Communications S.A. today announced the opening of a new development site in Sophia Antipolis, on the Côte d’Azur, in the south of France.

Axcelis announces multiple orders for 'Purion H' from  memory chipmakers in Asia Pacific

01/30/2017  Axcelis Technologies, Inc. announced today that it has received orders for the Purion H high current implanter from two leading manufacturers of memory devices in the Asia Pacific region.

MACOM successfully completes acquisition of AppliedMicro

01/27/2017  MACOM Technology Solutions Holdings, Inc. today announced that it has successfully completed its previously announced acquisition of Applied Micro Circuits Corporation.

Do not go where the path may lead

01/27/2017  What follows, in Part 1 of this two-part article, is a quick look back at the industry in 2016 and the road ahead in 2017 followed by what SEMI achieved in 2016 and where SEMI’s road will lead in 2017 to keep pace our industry charging forward where there is no path.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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