12/08/2016  At this week's IEEE IEDM conference, imec, the research and innovation hub in nano-electronics and digital technologies showed for the first time a silicon (Si)-passivated germanium (Ge) nMOS gate stack with dramatically reduced interface defect density (DIT) reaching the same level as a Si gate stack and with high mobility and reduced positive bias temperature instability (PBTI).

12/07/2016  Two years of busy M&A activity boost marketshare among top suppliers.

12/07/2016  Presented at IEDM 2016, breakthrough suggests path to embedding neuromorphic learning in low-power devices that could enable autonomous systems.

12/07/2016  While exploring the atomic-level forces at play in a new type of computer chip, researchers found an energy-saving surprise that could translate into longer battery life for next-generation mobile devices.

12/06/2016  IEDM 2016 papers demonstrate novel responses to problems of performance and parasitic capacitances.

12/06/2016  SEMI today reported that worldwide semiconductor manufacturing equipment billings reached US$11.0 billion in the third quarter of 2016.

12/06/2016  Leti CEO Marie Semeria today delivered a sweeping, optimistic assessment of a rapidly evolving world where "hyperconnectivity" and the Internet of Things – guided by a "human-centered research approach and symbiotic development strategies" – herald profound changes in the way individuals relate to each other and to the physical world.

12/06/2016  At the 2016 IEEE International Electron Devices Meeting, in a special poster session on MRAM, world-leading research and innovation hub for nano-electronics and digital technology imec presented a 8nm p-MTJ device with 100 percent tunnel magnetoresistance (TMR) and coercive field as high 1500Oe.

12/01/2016  QuickLogic Corporation, a developer of ultra-low power programmable sensor processing, display bridge and programmable logic solutions, today announced that it has joined GLOBALFOUNDRIES' FDXcelerator Partner Program.

12/01/2016  12.1 percent efficiency for 16 cm² cell is the largest single to be independently certified with highest energy conversion efficiency.

11/30/2016  ChipMOS TECHNOLOGIES INC. and Tsinghua Unigroup Ltd. today announced an agreement to form a joint-venture and to mutually terminate Tsinghua Unigroup's earlier private placement plan.

11/30/2016  David Anderson joins as SEMI Americas President.

11/30/2016  New report also projects good IC sales increases in medical electronics, digital TVs, and servers.

11/29/2016  SiFive, the first fabless provider of customized, open-source-enabled semiconductors, today announced the availability of its Freedom Everywhere 310 (FE310) system on a chip (SoC).

11/28/2016  The book-to bill ratio for October dropped below parity for the first time in 11 months, even though bookings and billings activity remains at elevated levels relative to last year.

11/21/2016  Technavio's latest report on the global industrial embedded systems market provides an analysis on the most important trends expected to impact the market outlook from 2016-2020.

11/21/2016  Microsemi Corporation (Nasdaq: MSCC) announced it is the first field programmable gate array (FPGA) provider to offer a comprehensive software tool chain and intellectual property (IP) core for RISC-V designs.

11/21/2016  MACOM Technology Solutions Holdings, Inc., a leading supplier of high-performance analog RF, microwave, millimeterwave and photonic semiconductor products, today announced it has entered into a definitive agreement to acquire Applied Micro Circuits Corporation

11/17/2016  Electronics manufacturing executives will examine growth prospects, global industry developments and technology strategy at the SEMI Industry Strategy Symposium (ISS) 2017 to be held January 8-11 at the Ritz-Carlton, Half Moon Bay.

11/16/2016  Celebrating its 30th anniversary, the largest-ever SEMICON Korea will be held from February 8 to 10, featuring 600 exhibiting companies and an expected 40,000 attendees at COEX, Seoul.