Device Architecture

DEVICE ARCHITECTURE ARTICLES



Spin Memory teams with Applied Materials to produce a comprehensive embedded MRAM solution

11/12/2018  Spin Memory, Inc. (Spin Memory), the MRAM developer, today announced a commercial agreement with Applied Materials, Inc. (Applied) to create a comprehensive embedded MRAM solution.

Nine Top-15 2018 semi suppliers forecast to post double-digit gains

11/12/2018  Samsung expected to extend its number one ranking and sales lead over Intel to 19%.

MRSI announces HVM3 die bonding demonstration capability in Shenzhen China

11/09/2018  MRSI Systems (Mycronic Group) announces new demonstration capability at its sister company, Shenzhen Axxon Automation (Mycronic Group) facility in the Longhua district, Shenzhen, China.

SEMI supports U.S. return to trade talks with China, issues trade negotiation principles

11/08/2018  SEMI today voiced support and encouragement for trade discussions between U.S. President Donald Trump and People's Republic of China President Xi Jinping -- talks that are planned for Dec. 1 during the G20 Summit in Argentina.

Semiconductor Research Corporation welcomes SK hynix to its acclaimed GRC and NST research programs

11/08/2018  SRC research focused on next-generation semiconductor technology continues to attract the world's leading semiconductor design and manufacturing companies.

Pinnacle Imaging Systems and ON Semiconductor collaborate on new HDR surveillance solution using Xilinx technology

11/07/2018  Pinnacle Imaging Systems and ON Semiconductor today jointly announced a new lower cost HDR video surveillance solution capable of capturing high contrast scenes (120 dB) with 1080p and 30 frames per second (fps) output.

Micron announces mass production of industry's highest-capacity monolithic memory for mobile applications

11/07/2018  Micron Technology, Inc. today announced that it has begun mass production of the industry's highest-capacity and first monolithic 12Gb low-power double data rate 4x (LPDDR4x) DRAM for mobile devices and applications.

Third quarter silicon wafer shipments increase, set new quarterly record

11/07/2018  Worldwide silicon wafer area shipments increased during the third quarter 2018, surpassing record second quarter 2018 area shipments to set another all-time high, according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

SkyWater appoints Tom Legere as Senior Vice President of Operations

11/06/2018  SkyWater Technology Foundry today announced that Tom Legere has been appointed as Senior Vice President of Operations.

Making steps toward improved data storage

11/06/2018  Kyoto University maps nanoscale changes in memory material.

BISTel partners with Siemens to deliver MindSphere applications for advanced data analytics and predictive maintenance

11/05/2018  BISTeL, a provider of adaptive intelligent (AI) applications for smart manufacturing today announced that it has joined the MindSphere Partner Program, Siemens’ partner program for Industrial IoT solution and technology providers.

SEMI wins award for Nano-Bio Materials Consortium to grow digital health industry

11/05/2018  SEMI announced today that it has signed a new agreement with the U.S. Air Force Research Laboratory (AFRL) to expand the Nano-Bio Materials Consortium's (NBMC) work in advancing human monitoring technology innovations for telemedicine and digital health.

Micron provides statement on U.S. Department of Justice indictments relating to theft of Micron trade secrets

11/02/2018  Micron Technology, Inc. today received the announcement from the U.S. Department of Justice that on Nov. 1, 2018, it had issued indictments against United Microelectronics Corporation (UMC), Fujian Jinhua Integrated Circuit (Jinhua) and three former employees of Micron's Taiwan unit for conspiracy to commit trade secret theft, economic espionage and related crimes.

Quarterly year-over-year growth slows substantially for IC market

11/02/2018  Analysis shows decline from 23% year-over-year growth in 1Q18 to 6% forecast for 4Q18.

MagnaChip Semiconductor appoints semiconductor veteran Jeong Ki Min as Chief of Strategic Planning

11/01/2018  MagnaChip Semiconductor Corporation, a designer and manufacturer of analog and mixed-signal semiconductor platform solutions, today announced the appointment of Jeong Ki Min to the newly created position of Chief of Strategic Planning

GLOBALFOUNDRIES introduces Avera Semi, a wholly owned subsidiary to deliver custom ASIC solutions

11/01/2018  GLOBALFOUNDRIES today announced the establishment of Avera Semiconductor LLC, a wholly owned subsidiary dedicated to providing custom silicon solutions for a broad range of applications.

GSA announces new leadership and multiple market initiatives

10/31/2018  The Global Semiconductor Alliance (GSA) Board of Directors has appointed Dr. Lisa Su, President and Chief Executive Officer of Advanced Micro Devices, Inc. (AMD), as Chair of GSA Board of Directors and Simon Segars, Chief Executive Officer of Arm, as the Vice Chair.

Innodisk bringing the next-generation NAND flash to the industrial embedded market

10/31/2018  Innodisk is launching its industrial-grade 3D NAND SSD series, making the newest NAND flash technology available for the challenging requirements of embedded and industrial applications.

Netronome announces open chiplet architecture for advanced SoC designs

10/31/2018  Netronome today announced an open architecture for domain-specific accelerators designed to significantly reduce the burgeoning cost of silicon development as demanded by modern data center server, edge computing and automotive applications.

Tests show integrated quantum chip operations possible

10/31/2018  For the first time, an Australian team has combined 2 fundamental quantum techniques on an integrated silicon platform, confirming the promise silicon -- the basis of all modern computer chips -- for quantum computing.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

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As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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