Device Architecture

DEVICE ARCHITECTURE ARTICLES



UW scientists build a nanolaser using a single atomic sheet

03/24/2015  University of Washington scientists have built a new nanometer-sized laser -- using the thinnest semiconductor available today -- that is energy efficient, easy to build and compatible with existing electronics.

Silicon Labs and Digi-Key challenge developer innovation with "Your IoT" design competition

03/24/2015  Silicon Labs and Digi-Key today announced an IoT design contest for pioneering developers who want to create connected "things" that will help make the world a smarter, more connected and energy-friendly place.

NXP and GlobalFoundries announce production of 40nm embedded non-volatile memory technology

03/24/2015  GLOBALFOUNDRIES, a provider of advanced semiconductor manufacturing technology, and NXP Semiconductor N.V, a semiconductor company for secure connection solutions, today announced that they have jointly developed a next-generation embedded non-volatile memory.

North American semiconductor equipment industry posts February 2015 book-to-bill ratio of 1.02

03/20/2015  A book-to-bill of 1.02 means that $102 worth of orders were received for every $100 of product billed for the month.

NC State researchers create 'nanofiber gusher'

03/19/2015  Engineers and researchers at North Carolina State University and one of its start-up companies have now reported a method that can produce unprecedented amounts of polymer nanofibers, which have potential applications in filtration, batteries and cell scaffolding.

GSA announces 2015 Board of Directors election results and appointment

03/19/2015  The Global Semiconductor Alliance (GSA) announced the appointment of two key executives as well as the results of its 2015 Board of Directors’ election.

NXP-Freescale merger to result in world's eighth largest chip maker

03/18/2015  The recent acquisition of Freescale Semiconductor by NXP Semiconductors would catapult the merged entity into the world’s eighth-largest chipmaker, positioning the newly minted giant for an even more formidable presence in key industrial sectors, according to IHS.

MACOM announces new 650 W GaN on SiC HEMT pulsed power transistor

03/18/2015  M/A-COM Technology Solutions Inc. today announced a 650 W gallium nitride (GaN) on silicon carbide (SiC) HEMT pulsed power transistor for L-band pulsed avionics applications.

AKM Semiconductor signs global distribution agreement with Digi-Key

03/18/2015  Global electronic components distributor Digi-Key Corporation, a provider of electronic component selection, availability and delivery, has partnered with AKM Semiconductor Inc., to facilitate the global distribution of AKM’s products.

High tech start-ups to connect with investors at SEMICON Europa 2015

03/17/2015  SEMICON Europa 2015 (October 6-8) will prominently feature second edition of this very successful program connecting early-stage companies with strategic investors, venture capitalists and other relevant stakeholders.

Imec to honor TSMC Chairman Dr. Morris Chang with "Lifetime of Innovation Award"

03/17/2015  Nano-electronics research center imec has announced that it will award Dr. Morris Chang, founding chairman of Taiwan Semiconductor Manufacturing Company, Limited (TSMC), the world's first and largest semiconductor foundry, with a lifetime of innovation award.

Recovering economies driving growth in the industrial semiconductor market

03/16/2015  The industrial semiconductor market will post a 9.7 percent compound annual growth rate (CAGR) over the next several years as revenue rises from $34.8 billion in 2013 to $55.2 billion in 2018.

11 IC product categories to exceed total IC market growth in 2015

03/12/2015  IC Insights’ March Update to the 2015 McClean Report (being released later this month) refreshes the forecasts for 33 major IC product categories through 2019.

Applied Materials honored as a 2015 World's Most Ethical Company

03/10/2015  Applied Materials, Inc. today announced it has been recognized as a 2015 World's Most Ethical Company by the Ethisphere Institute.

CEA-Leti announces launch of Silicon Impulse IC design competence center

03/10/2015  CEA-Leti today announced the launch of its Silicon Impulse IC design competence center, a comprehensive IC technology platform offering IC design, advanced intellectual property, emulator and test services along with industrial multi-project wafer (MPW) shuttles.

Squeezing out new science from material interfaces

03/09/2015  With more than five times the thermal conductivity of copper, diamond is the ultimate heat spreader. But the slow rate of heat flow into diamond from other materials limits its use in practice.

Dr. Zixue Zhou appointed as Chairman of SMIC

03/09/2015  Semiconductor Manufacturing International Corporation ("SMIC"), the largest pure-play foundry provider in China, has appointed Dr. Zixue Zhou as the new chairman and executive director of SMIC. Dr. Zhou's position as chairman will become effective as of today.

Graphene meets heat waves

03/06/2015  In the race to miniaturize electronic components, researchers are challenged with a major problem: the smaller or the faster your device, the more challenging it is to cool it down.

UT Dallas technology could make night vision, thermal imaging affordable

03/04/2015  Semiconductors made in CMOS technology reach nearly 10 terahertz.

Mentor Graphics joins the Center for Power Electronics Systems

03/04/2015  Mentor Graphics Corporation today announced that it has joined the Center for Power Electronics Systems (CPES) at Virginia Tech, the industry consortium dedicated to improving electrical power processing and distribution across various systems.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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