Device Architecture

DEVICE ARCHITECTURE ARTICLES



Intel honors 21 companies with Preferred Quality Supplier and Achievement Awards

03/04/2015  Intel Corporation today announced that 19 companies will receive the 2014 Intel Preferred Quality Supplier (PQS) award that recognizes commitment to performance excellence and continuous improvement.

Comparing market sizes and forecasted growth rates for systems, ICs

03/03/2015  Cellphones expand as largest system market; IoT growing fastest through 2018.

Freescale and NXP agree to $40 Billion merger

03/03/2015  Chipmaker NXP Semiconductors NV announced Sunday night that it has agreed to buy Freescale Semiconductor Ltd for $11.8 billion and merge business operations.

Imec demonstrates compact wavelength-division multiplexing CMOS silicon photonics transceiver

02/26/2015  This week, at the 2015 International Solid State Circuits Conference (ISSCC), imec, in collaboration with Tyndall National Institute, the University of Leuven (KULeuven) and the Ghent University, demonstrated a 4x20Gb/s wavelength division multiplexing (WDM) hybrid CMOS silicon photonics transceive

Semiconductor unit shipments to exceed one trillion devices in 2017

02/26/2015  Updated forecast expects robust 8.2% average annual unit shipment growth through 2019.

Top semiconductor R&D leaders ranked for 2014

02/26/2015  Intel’s R&D expenditures were 2x greater than nearest competitor; Qualcomm with largest percentage increase; Nvidia with highest R&D/sales ratio.

Freescale pushes for a secure Internet of Things

02/24/2015  As the Internet of Things (IoT) continues to gain momentum, Freescale Semiconductor and its partners are tackling the most dire challenge the young movement has faced to date – the alarming lack of unified guidelines for ensuring the security of IoT applications.

Radio chip for the 'Internet of things'

02/24/2015  At this year's Consumer Electronics Show in Las Vegas, the big theme was the "Internet of things" -- the idea that everything in the human environment, from kitchen appliances to industrial equipment, could be equipped with sensors and processors that can exchange data, helping with maintenance and the coordination of tasks.

AG Semiconductor Services and JA Mitsui Leasing join forces

02/24/2015  AG Semiconductor Services, LLC (AGSS), one of the largest suppliers of used electronics manufacturing equipment, is pleased to announce that it has entered into a strategic relationship with JA Mitsui Leasing, Ltd. (JAML).

Applied Materials unveils breakthrough e-beam metrology tool for finFET transistors and 3D NAND devices

02/23/2015  At the SPIE Advanced Lithography conference in San Jose, Calif., Applied Materials, Inc., today announced the industry's first in-line 3D CD SEM metrology tool for solving the challenges of measuring the high aspect ratio and complex features of 3D NAND and FinFET devices.

January 2015 book-to-bill supports positive outlook for semiconductor equipment industry

02/20/2015  A book-to-bill of 1.03 means that $103 worth of orders were received for every $100 of product billed for the month.

The future of electronics -- now in 2-D

02/20/2015  The future of electronics could lie in a material from its past, as researchers from The Ohio State University work to turn germanium--the material of 1940s transistors--into a potential replacement for silicon.

Penn researchers develop new technique for making molybdenum disulfide

02/20/2015  University of Pennsylvania researchers have made an advance in manufacturing one such material, molybdenum disulphide.

Micron appoints Robert Peglar as Vice President of Advanced Storage Solutions

02/19/2015  Micron Technology, Inc. today announced that Robert Peglar has been named as vice president of Advanced Storage Solutions.

China's semiconductor investment plans focus of SEMICON China 2015

02/19/2015  China's new industry investment and government promotion policies outlined in the recent "National Guidelines for Development and Promotion of the IC Industry" represents major opportunities for China and global semiconductor companies.

Novel crumpling method takes flat graphene from 2-D to 3-D

02/17/2015  Researchers at the University of Illinois at Urbana-Champaign have developed a unique single-step process to achieve three-dimensional (3D) texturing of graphene and graphite.

Samsung announces mass production of industry’s first 14nm finFET mobile application processor

02/17/2015  Samsung Electronics Co., Ltd. announced that it has begun mass production of industry’s first mobile application processor using the advanced 14-nanometer (nm) FinFET process technology.

Novel solid-state nanomaterial platform enables terahertz photonics

02/17/2015  cientists are pioneering the use of nanomaterials in compact, sensitive, fast, low-cost terahertz detectors with potential in applications such as biomedical diagnostics, airport security screening and high data-rate wireless communication

Ghent University and imec demonstrate interaction between light and sound in nanoscale waveguide

02/17/2015  Silicon photonics enables extreme light-matter interaction.

Extreme-temperature electronics

02/13/2015  Many industries are calling for electronics that can operate reliably in a harsh environment, including extreme temperatures above 200° Celsius.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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