Device Architecture

DEVICE ARCHITECTURE ARTICLES



TSV based memory going to volume production: the era of 3DIC finally begins

12/01/2014  With the recent Samsung announcement of mass production of 64 GB DDR4 DIMMs that use TSV technology for enterprise servers and cloud-based applications, all three of the major DRAM memory manufactures, Samsung, Hynix and Micron, have now announced the commercialization of TSV based memory architectures.

GIGAPHOTON provides new function for 50% reduction of neon gas consumption for ArF immersion laser users

11/25/2014  Gigaphoton Inc., a lithography light source manufacturer, today announces the provision of a new function, called “eTGM (eco-Total Gas Management),” for the existing users of its flagship high-output GT Series of ArF immersion laser products free of charge for a fixed period of time.

Micron Technology CFO to retire in 2015

11/24/2014  Micron Technology, Inc. announced that Ronald C. Foster, Chief Financial Officer (CFO) and Vice President of Finance, will retire from Micron next year.

Hybrid Memory Cube Consortium releases new specification

11/24/2014  The Hybrid Memory Cube Consortium (HMCC), dedicated to the development and establishment of an industry-standard interface specification for Hybrid Memory Cube (HMC) technology, today announced the finalization and public availability of its HMCC 2.0 specification (HMCC 2.0).

PDSTI completes acquisition of Montage

11/24/2014  Montage Technology Group Limited, a global fabless provider of analog and mixed-signal semiconductor solutions addressing the home entertainment and cloud computing markets, today announced that Montage Technology Global Holdings, Ltd., an entity jointly formed by Shanghai Pudong Science and Technology Investment Co., Ltd. and China Electronics Investment Holdings Limited, has completed its acquisition of the company.

North American book-to-bill report shows equipment order activity has moderated

11/21/2014  North America-based manufacturers of semiconductor equipment posted $1.10 billion in orders worldwide in October 2014 (three-month average basis) and a book-to-bill ratio of 0.93, according to the October EMDS Book-to-Bill Report published today by SEMI.

China and US boost worldwide industrial semiconductor market in 2014

11/20/2014  Continuing strength in China and a resurgent U.S. economy are combining to drive accelerated growth in the worldwide market for semiconductors used in industrial applications this year, according to IHS Technology.

Carbonics aims for improved power consumption and performance with new carbon nanomaterials

11/19/2014  Startup is backed by $5.5M investment, leveraging carbon research conducted at UCLA and USC.

New process isolates promising material

11/18/2014  Molybdenum disulfide has emerged as a leading successor to graphene.

Notebook PC shipments rise year over year as tablet PCs decline

11/18/2014  Notebook PC growth was primarily driven by the developed regions of North America and Western Europe, which increased year-over-year shipments by more than 20 percent in the third quarter.

Revolutionary solar-friendly form of silicon shines

11/18/2014  Silicon is the second most-abundant element in the earth's crust. When purified, it takes on a diamond structure, which is essential to modern electronic devices--carbon is to biology as silicon is to technology. A team of Carnegie scientists led by Timothy Strobel has synthesized an entirely new form of silicon, one that promises even greater future applications.

GigOptix appoints Darren Ma as Vice President and Chief Financial Officer

11/18/2014  GigOptix, Inc., a supplier of advanced high speed semiconductor components, today announced the appointment of Darren Ma as Vice President and Chief Financial Officer.

SK Hynix Memory Solutions opens office in Longmont, Colorado

11/18/2014  SK Hynix Memory Solutions (SKHMS), a provider of NAND flash solutions, today announced the opening of its new engineering development center in Longmont, Colorado.

New way to move atomically thin semiconductors for use in flexible devices

11/13/2014  Researchers from North Carolina State University have developed a new way to transfer thin semiconductor films, which are only one atom thick, onto arbitrary substrates, paving the way for flexible computing or photonic devices.

Intel CEO Brian Krzanich elected chairman of Semiconductor Industry Association

11/13/2014  The Semiconductor Industry Association (SIA) today announced that the SIA board of directors has elected Brian Krzanich, CEO of Intel, as its 2015 chairman and Dr. Necip Sayiner, president, CEO and director of Intersil, as its 2015 vice chairman.

Professors from UC Berkeley and UT Dallas honored for excellence in semiconductor research

11/13/2014  The Semiconductor Industry Association (SIA), in consultation with Semiconductor Research Corporation (SRC), today presented its University Research Award to professors from University of California, Berkeley and University of Texas at Dallas in recognition of their outstanding contributions to semiconductor research.

Deal to expand information technology agreement will strengthen semiconductor industry

11/11/2014  Agreement will extend tariff-free coverage of the latest semiconductor products and technologies.

AKHAN Semiconductor announces licensing agreement with Argonne National Laboratory

11/11/2014  AKHAN Semiconductor Inc. and the U.S. Department of Energy’s Argonne National Laboratory have reached an exclusive licensing agreement on a patent portfolio that will provide AKHAN with the intellectual property to become a fully-integrated semiconductor designer, developer and manufacturer.

Freescale and Intel processors now active at Rochester Electronics

11/11/2014  Rochester Electronics, a fully-authorized manufacturer and distributor of semiconductors, will launch 2015 with the re-introduction of many popular processors from Freescale and Intel.

Qualcomm joins SRC’s Trustworthy and Secure Semiconductors and Systems Initiative

11/11/2014  Semiconductor Research Corporation (SRC) today announced that Qualcomm Technologies, Inc., a wholly owned subsidiary of Qualcomm Incorporated, has joined SRC’s Trustworthy and Secure Semiconductors and Systems (T3S) program.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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