11/11/2014  With generous “Morgan Challenge Matchmaker” contributions, the SEMI Foundation recently reached its goal of $1 million for workforce development.

11/10/2014  New research may help to develop graphene-based electronic devices that only become conductors when an external ultra-short pulse is applied, and are otherwise insulators.

11/10/2014  Applied Materials, Inc. today announced it collaborated with Samsung Electronics Co., Ltd. and PSK Inc., a Korea-based leader in photoresist removal, to develop an advanced patterning solution for the manufacture of future generations of NAND and DRAM device designs.

11/07/2014  Graphene Frontiers LLC, a developer of graphene materials and device technology, announces the issuance of a key industry patent.

11/07/2014  SEMATECH, the global consortium of semiconductor manufacturers, today announced that Dr. Ronald Goldblatt has been named President and Chief Executive Officer by the company’s Board of Directors, effective immediately. Dr. Goldblatt has served as acting President and Chief Executive Officer since April 2014.

11/06/2014  Presentations by Accenture Japan, Scripps, Toyota and ARM, were announced today for SEMICON Japan 2014, the largest exhibition in Japan for semiconductor manufacturing and related processing technology.

11/06/2014  GLOBALFOUNDRIES, a provider of advanced semiconductor manufacturing, design and technology solutions, today announced a partnership with INVECAS Inc.

11/05/2014  SEMI today announced that Tetsuro (Terry) Higashi, chairman, president and CEO of Tokyo Electron Limited (TEL), has been selected as the 2015 recipient of the SEMI Sales and Marketing Excellence Award, inspired by the late Bob Graham.

11/05/2014  Reno Sub-Systems (Reno) today announced that it has closed its first venture funding round with Intel Capital, early stage Canadian venture capital organization Innovacorp and other investors.

11/04/2014  The Global Semiconductor Alliance (GSA) is pleased to announce the 2014 award nominees for the GSA Awards Dinner Celebration taking place on Thursday, December 11, 2014, at the Santa Clara Convention Center in Santa Clara, Calif.

10/30/2014  SEMI announced today that the deadline for presenters to submit an abstract for the 26th annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) is extended to November 10.

10/30/2014  Synopsys, Inc. today announced the availability of the silicon-proven DesignWare AEON Few Time Programmable (FTP) Trim Non-Volatile Memory (NVM) IP for TowerJazz 180-nanometer (nm) SL process technology.

10/29/2014  Today, SEMI announced an exceptional lineup of speakers for SEMICON Japan?s Opening Day ? Accenture, Applied Materials, ARM, IBM Japan, Intel K.K., NIICT, Scripps, Toshiba, and Toyota.

10/29/2014  Silvaco, Inc. (Silvaco) and TSI Semiconductors, LLC (TSI) today announced that they have extended their collaboration to accelerate the development and production launch of TSI's 0.25um BCDMOS process technology.

10/28/2014  Kilopass Technology Inc., a provider of semiconductor logic embedded non-volatile memory (eNVM) intellectual property (IP), announced today that it has successfully ported its one-time programmable (OTP) NVM technology to TSMC's 16 nanometer (nm) FinFET process.

10/28/2014  Intersil Corporation, a provider of innovative power management and precision analog solutions, today announced the appointment of two accomplished executives to its board of directors, bringing the total number of independent directors to nine.

10/24/2014  Yesterday, KLA-Tencor announced a plan to significantly accelerate its strategy to drive stockholder returns.

10/23/2014  Semiconductor Manufacturing International Corporation and Maxscend Technologies Inc., a RF IP company based in China, announced that Maxscend Bluetooth RF IP has been silicon proven on SMIC's 55nm low leakage logic process.

10/22/2014  Capped by last week’s announcement that Qualcomm Inc. would buy CSR PLC, the automotive semiconductor industry recently has been undergoing a wave of merger and acquisition (M&A) activity that has shaken up the competitive order of the market.

10/22/2014  Samsung today announced that it is mass producing the industry’s most advanced 8-gigabit (Gb) DDR4 memory and 32-gigabyte (GB) module, both of which will be manufactured based on a new 20-nanometer (nm) process technology, for use in enterprise servers.