Device Architecture

DEVICE ARCHITECTURE ARTICLES



Synopsys, STMicroelectronics and Samsung to collaborate on adoption of 28nm FD-SOI technology

06/04/2014  Synopsys, Inc. today announced it has extended its collaboration with STMicroelectronics to include Samsung Electronics, enabling broader market adoption of ST's 28nm FD-SOI technology for SoC design.

2D transistors promise a faster electronics future

06/03/2014  Faster electronic device architectures are in the offing with the unveiling of the world’s first fully two-dimensional field-effect transistor (FET) by researchers with the Lawrence Berkeley National Laboratory (Berkeley Lab).

Synopsys and Intel collaborate on 14nm Tri-Gate design platform

06/03/2014  Synopsys, Inc. and Intel Corporation today announced broad SoC design enablement for Intel's 14nm Tri-Gate process technology for use by customers of Intel Custom Foundry.

Georgia Tech research develops physics-based spintronic interconnect modeling for beyond-CMOS computing

06/03/2014  Georgia Institute of Technology researchers collaborating with and sponsored by Intel Corporation through the Semiconductor Research Corporation (SRC) have developed a physics-based modeling platform that advances spintronics interconnect research for beyond-CMOS computing.

Critical test issues up for debate at Test Vision 2020

06/02/2014  Test professionals who want to learn, forecast and debate the future of semiconductor test will attend the 7th annual IEEE Test Vision 2020 Workshop, held in conjunction with SEMICON West 2014 (July 8-10) in San Francisco.

ams wins patent validity lawsuit launched by Melexis

05/29/2014  ams, a manufacturer of high performance sensor and analog solutions, announces that the company has won a last-instance verdict against Melexis.

Down to 5nm: Scaling with the usual suspects - performance, cost

05/29/2014  The semiconductor industry never lacks for challenges and/or controversy as it forges ahead from one technology node to the next.

IEDM announces 2014 Call for Papers

05/28/2014  The 60th annual IEEE International Electron Devices Meeting (IEDM) has issued a Call for Papers seeking the world's best original work in all areas of microelectronics research and development.

ams reaches out to Chinese engineering community with new micro-site

05/27/2014  ams AG, a provider of high performance analog ICs and sensors, has launched a new micro-site in China in an initiative designed to provide a more direct channel for communication with China's one million-strong electronic design and engineering community.

UT Dallas team creates flexible electronics that change shape inside body

05/27/2014  Transistors maintain electrical properties after implantation.

Intel to collaborate with Rockchip

05/27/2014  Intel Corporation today announced it has entered into a strategic agreement with Rockchip to expand the breadth of and accelerate the rate at which it brings its Intel architecture and communications-based solutions to market for a range of entry-level Android tablets worldwide.

Synopsys and TSMC collaborate to validate DesignWare IP in TSMC 16nm FinFET process

05/27/2014  Synopsys, Inc. today announced the validation of DesignWare IP in the TSMC 16nm FinFET process technology, demonstrating the ongoing collaboration between Synopsys and TSMC to provide designers with proven IP for their advanced system-on-chip (SoC) designs.

KLA-Tencor announces new Teron SL650 reticle inspection system

05/23/2014  Today, KLA-Tencor Corporation announced the Teron SL650, a new reticle quality control solution for IC fabs that supports 20nm design nodes and beyond.

Sales of semiconductor equipment in North America continue to demonstrate strong growth

05/23/2014  A book-to-bill of 1.03 means that $103 worth of orders were received for every $100 of product billed for the month.

NIST studies why quantum dots suffer from "fluorescence intermittency"

05/22/2014  Researchers at the National Institute of Standards and Technology (NIST), working in collaboration with the Naval Research Laboratory, have found that a particular species of quantum dots that weren't commonly thought to blink, do.

Microchip Technology to acquire ISSC Technologies

05/22/2014  Microchip Technology Incorporated, a provider of microcontroller, mixed-signal, analog and Flash-IP solutions, and ISSC Technologies Corporation (ISSC) today announced that Microchip has signed a definitive agreement to acquire ISSC.

MagnaChip announces CEO transition

05/21/2014  MagnaChip Semiconductor Corporation, a Korea-based designer and manufacturer of analog and mixed signal semiconductor products, today announced that Sang Park, 67, has retired as Chairman, Chief Executive Officer and Director, effective immediately.

DAC panels tackle giga-scale design challenges, semiconductor market in China

05/21/2014  The ProPlus blog here on Solid State Technology has looked at giga-scale design challenges and, this year, so will the Design Automation Conference (DAC).

ON Semiconductor introduces new family of low voltage power MOSFETs

05/20/2014  ON Semiconductor has introduced a new family of six N-channel MOSFETS that have been designed and optimized to deliver efficiency.

MediaTek, SK Hynix, AMD, and Micron sales surge in first quarter

05/19/2014  Top 20 ranking shows that semiconductor industry company consolidation continues to accelerate.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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