Device Architecture

DEVICE ARCHITECTURE ARTICLES



Towards all solid-state 3D thin-film batteries for durable and fast storage

05/16/2014  One way to make Li-ion batteries more durable, safer, smaller and in particularly faster, is a transition towards all solid-state 3D thin-film Li-ion batteries.

New materials and processes for advanced interconnects

05/16/2014  Although on-chip interconnects have not been scaling at the same speed as other parts of the chip, new capabilities enabled by graphene and CNTs, among other materials, could soon change that.

Nanowire bridging transistors open way to next-generation electronics

05/14/2014  A new approach to integrated circuits, combining atoms of semiconductor materials into nanowires and structures on top of silicon surfaces, shows promise for a new generation of fast, robust electronic and photonic devices.

Transphorm obtains exclusive licensing rights to Furukawa Electric's GaN patent portfolio

05/14/2014  Transphorm Inc. today announced that it has obtained a sole worldwide license to Furukawa Electric Co., Ltd.'s extensive Gallium Nitride (GaN) power device portfolio that includes approximately 40 U.S. issued patents and 110 Japanese issued patents.

SEMATECH appoints Satyavolu Papa Rao to lead process technology

05/13/2014  In this key role, Papa Rao will serve as the operational lead, overseeing the strategic development of SEMATECH’s manufacturing, process, materials and ESH-related activities.

Cree announces low cost extended bandwidth GaN HEMT transistors

05/07/2014  In response to broader bandwidth demand, Cree, Inc. introduces a family of GaN HEMT RF transistors that delivers industry-leading bandwidth and high efficiency performance to support today’s busy LTE networks.

GlobalFoundries introduces 55nm automotive-specific advanced semiconductor manufacturing platform

05/07/2014  GLOBALFOUNDRIES today introduced an optimized semiconductor manufacturing platform aimed specifically at meeting the stringent and evolving needs of the automotive industry.

Avago completes acquisition of LSI

05/06/2014  Avago Technologies Limited and LSI Corporation today announced Avago has completed its acquisition of LSI Corporation for $11.15 per share in an all-cash transaction valued at approximately $6.6 billion.

Microchip introduces 64-Mbit parallel Flash memory device on advanced process technology

05/06/2014  Microchip Technology Inc., a provider of microcontroller, mixed-signal, analog and Flash-IP solutions, today introduced a new parallel Flash memory device.

Peregrine Semiconductor ships first UltraCMOS 10 production units

05/06/2014  With partner GLOBALFOUNDRIES, the company also announces the completion of product and process qualification for the advanced RF SOI technology.

Intel architecture fuels new wave of Chrome devices

05/06/2014  Intel Corporation and other companies today introduced a new lineup of Chrome devices, including the first designs using Intel Celeron processors based on the Bay Trail-M system-on-chip (SoC).

Intel hires Steven Fund as new chief marketing officer

05/05/2014  Intel Corporation today announced it has named Steven Fund, a senior industry executive with extensive brand and marketing experience, to the post of corporate vice president and Chief Marketing Officer reporting directly to Intel CEO Brian Krzanich.

Global semiconductor industry posts highest-ever first quarter sales

05/05/2014  The Semiconductor Industry Association (SIA) today announced that worldwide sales of semiconductors reached $78.47 billion during the first quarter of 2014, marking the industry's highest-ever first quarter sales.

An edgy look at 2D molybdenum disulfide

05/01/2014  Berkeley Lab researchers observe 1D edge states critical to nanoelectronic and photonic applications.

New rapid synthesis developed for bilayer graphene and high-performance transistors

05/01/2014  Researchers at University of California, Santa Barbara, in collaboration with Rice University, have recently demonstrated a rapid synthesis technique for large-area Bernal (or AB) stacked bilayer graphene films that can open up new pathways for digital electronics and transparent conductor applications.

Zeta Instruments hires former KLA-Tencor exec as new COO

04/30/2014  Zeta Instruments, Inc., an optical profiling and inspection company providing solutions for high-tech manufacturing, has announced that Jeff Donnelly has joined the company as its chief operating officer.

Brooks Automation to acquire DMS

04/30/2014  The cash purchase price is approximately $31 million, subject to an adjustment for working capital at closing. The acquisition is expected to close within the next two weeks upon satisfaction of customary closing conditions.

MACOM expands portfolio of high performance GaN components for RF solutions

04/30/2014  M/A-COM Technology Solutions Inc., a supplier of high performance RF, microwave and millimeter wave products, today announced the availability and full technical support for 17 high-performance gallium nitride on silicon (GaN on Si) RF power transistors and amplifiers recently added to the MACOM product portfolio as a result of its acquisition of Nitronex, LLC.

Micron releases new SATA solid state drive

04/29/2014  Micron Technology, Inc. this week announced a new enterprise-class solid state drive (SSD) designed specifically for data center storage platforms.

Scaling to 5nm: A plethora of paths

04/28/2014  Previous semiconductor technology generations developed more clearly defined “winners” in terms of process technologies and materials choices.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

Sponsored By:

More Webcasts