Device Architecture

DEVICE ARCHITECTURE ARTICLES



SEMATECH appoints IBM veteran to direct strategic growth initiatives

04/28/2014  Dr. Barth will join SEMATECH’s executive management team and will be responsible for cultivating effective alliance relationships and driving key strategic partnerships that align with the company’s core business objectives and long-term value creation and growth.

MACOM launches new 55 W GaN on SiC pulsed power transistor

04/28/2014  M/A-COM Technology Solutions Inc., a supplier of high performance RF, microwave, and millimeter wave products, today announced a new GaN on SiC HEMT Pulsed Power Transistor for civilian and military radar pulsed applications.

Freescale appoints Dan Durn as CFO

04/25/2014  Freescale Semiconductor today announced that it has selected Dan Durn as senior vice president and chief financial officer, replacing current CFO, Alan Campbell, who announced his decision to retire in January of this year.

Will interconnect manufacturing requirements cramp Moore's Law's style?

04/25/2014  The recent years have seen considerable contention in the semiconductor industry on whether Moore’s Law is alive and well.

Spansion adds to flash memory portfolio

04/24/2014  Spansion is adding three new Serial NOR and three new NAND memory densities specifically qualified to meet the extended temperature ranges and stringent quality requirements of the automotive industry.

Contour Semiconductor names former Intel exec as new CEO

04/22/2014  Contour Semiconductor, Inc., a provider dedicated to producing low-cost, high-volume, non-volatile memory chips, today announced that it has appointed veteran semiconductor industry executive Saul Zales as Chief Executive Officer.

High-performance, low-cost ultracapacitors built with graphene and carbon nanotubes

04/22/2014  By combining the powers of two single-atom-thick carbon structures, researchers at the George Washington University's Micro-propulsion and Nanotechnology Laboratory have created a new ultracapacitor that is both high performance and low cost.

New technology symposium at SEMICON West 2014 to spotlight critical issues in semiconductor manufacturing

04/22/2014  The new program addressing the most important and critical issues facing the future of semiconductor manufacturing in a new and more technical conference format.

SanDisk donates $1M to Berkeley College of Engineering

04/21/2014  The donation will fund recently completed renovations to Cory Hall, home of the College’s Department of Electrical Engineering and Computer Sciences, and the undergraduate student Computing Lab, which has been renamed the SanDisk Computing Lab.

Cadence to acquire Jasper Design Automation

04/21/2014  Cadence Design Systems, Inc. today announced plans to acquire Jasper Design Automation, Inc., a provider of formal analysis solutions, for approximately $170 million in cash.

Altera and TSMC collaborate to bring advanced packaging technology to Arria 10 FPGAs and SoCs

04/21/2014  Altera Corporation and TSMC today announced the two companies have worked together to bring TSMC's patented, fine-pitch copper bump-based packaging technology to Altera's 20 nm Arria 10 FPGAs and SoCs.

LG-Swiss researchers announce graphene membrane breakthrough

04/18/2014  The findings open up the possibility in the future to develop highly efficient filters to treat air and water.

GLOBALFOUNDRIES and Samsung join forces on 14nm finFETs

04/17/2014  Fabless companies could skip the 20nm node and move straight to 14nm FinFETs. That is the hope of GLOBALFOUNDRIES and Samsung who are announcing a joint program that offers a single process design kit (PDK) and manufacturing at four different fabs with identical processes.

MKS introduces dynamic frequency tuning patented DFT technology offered in RF plasma generators

04/17/2014  MKS Instruments, Inc., a global provider of technologies that enable advanced processes and improve productivity, has introduced Dynamic Frequency Tuning (DFT) technology in RF plasma generators.

Deca Technologies ships 100-millionth wafer-level packaged component

04/16/2014  Deca Technologies, an electronic interconnect solutions provider to the semiconductor industry, today announced that it has shipped its 100-millionth component.

Mentor Graphics design and verification tools certified for TSMC 16nm FinFET production

04/15/2014  Mentor Graphics Corp. today announced that its IC design to silicon solution has achieved certification for TSMC's Design Rule Manual (DRM) and SPICE model version 1.0 for its 16nm FinFET process.

Shiny quantum dots brighten the future of solar cells

04/14/2014  A house window that doubles as a solar panel could be on the horizon, thanks to recent quantum-dot work by Los Alamos National Laboratory researchers in collaboration with scientists from University of Milano-Bicocca (UNIMIB), Italy.

SEMI releases fourth quarter 2013 worldwide photovoltaic equipent market statistics report

04/09/2014  Billings and bookings show improvement in the fourth quarter.

February semiconductor sales up 11.4 percent compared to last year

04/09/2014  The Semiconductor Industry Association (SIA) today announced that worldwide sales of semiconductors reached $25.87 billion for the month of February 2014, an increase of 11.4 percent from February 2013 when sales were $23.23 billion.

Global Semiconductor Alliance celebrates 20 years of industry collaboration

04/08/2014  The Global Semiconductor Alliance (GSA) is celebrating 20 years of industry collaboration this year.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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