01/29/2014  Crocus Technology today announces it has licensed its Magnetic Logic Unit technology to ARM.

01/28/2014  Researchers with the U.S. Department of Energy (DOE)’s Lawrence Berkeley National Laboratory (Berkeley Lab) have developed a “process friendly” technique that would enable the cooling of microprocessor chips through carbon nanotubes.

01/27/2014  Mobile PCs and smartphones will represent the top revenue opportunities for high-speed wireless integrated circuit (IC) suppliers by 2018, as these devices are projected to be the highest-volume applications in this market over the next five years.

01/27/2014  Apple and Samsung remained the world’s largest buyers of semiconductor chips in 2013, but the intensifying battle between the two for the hearts and minds of consumers in their product offerings could presage another mighty showdown this year for the top ranking, according to a new report from IHS Technology.

01/27/2014  Semiconductor Manufacturing International Corporation, China's largest and most advanced semiconductor foundry, announced today that its 28nm technology has been process frozen and the company has successfully entered Multi Project Wafer stage to support customer's requirements on both 28nm PolySiON (PS) and 28nm high-k dielectrics metal gate processes.

01/27/2014  At the SEMI Industry Strategy Symposium Europe (ISS Europe 2014) on February 23-25 in Salzburg, semiconductor industry executives will examine the conditions required to achieve the EU’s 10/100/20 strategy.

01/24/2014  The December three-month average bookings were at the highest level since June 2012 — a positive sign for the 2014 spending outlook.

01/24/2014  We asked leading industry experts and analysts to give us their perspectives on what we can expect in 2014.

01/23/2014  Improving economic competitiveness through cost reduction, cycle time improvement and more eco-friendly processing.

01/23/2014  In addition to extending the fin-based design investments, augmenting the FinFET for improved performance allows an evolution of the process infrastructure for a few more nodes.

01/23/2014  At the recent Georgia Tech Global Interposer Technology (GIT) Workshop in Atlanta, the pervasive theme appeared to be whether a change in substrate is required to lower overall costs and help drive HVM (high volume manufacturing) applications.

01/23/2014  Should foundries establish and share best practices to manage sub-nanometer effects to improve yield and also manufacturability?

01/21/2014  A new technique from an international team of researchers working at Berkeley Lab’s Advanced Light Source (ALS) promises to deliver the goods.

01/16/2014  The market for 3DICs globally is forecast to reach USD 7.52 billion by 2019, according to a new market report published by transparency market research.

01/16/2014  ARM and global semiconductor foundry UMC this week announced an agreement to offer the ARM Artisan physical IP platform along with POP IP for UMC’s 28nm high-performance low-power (HLP) process technology.

01/15/2014  Semiconductor Research Corporation (SRC), a university-research consortium for semiconductors and related technologies, has launched a significant new initiative on Trustworthy and Secure Semiconductors and Systems (T3S).

01/15/2014  SEMI today announced that two teams — from the University of Florida and Xilinx — are recipients of the 2013 SEMI Award for North America.

01/14/2014  Nanotechnology research and development center imec, today announced the celebration of its 30th anniversary.

01/09/2014  Worldwide, the semiconductor industry growth rate back in 1973 was about 30 percent and slipped into 1975 with negative sales growth rates.

01/06/2014  STMicroelectronics has released details of its STi8K architecture addressing future Systems-on-Chips (SoCs).