02/08/2020  The Open Artwork System Interchange Standard (OASIS®) format, which can reduce both file sizes and loading times. The OASIS format has been available for almost 15 years and is accepted by every major foundry. It is also supported by all industry standard EDA tools.

02/05/2020  A lithographic method for TSV alignment to embedded targets was evaluated using in-line stepper self metrology, with TIS correction.

02/05/2020  Layout schema generation generates random, realistic, DRC-clean layout patterns of the new design technology for use in test vehicles.

03/01/2019  A research team at Tokyo Tech's Department of Materials Science and Engineering including Tsuyoshi Michinobu and Yang Wang report a way of increasing the electron mobility of semiconducting polymers, which have previously proven difficult to optimize.

02/28/2019  90% of closures were ?200mm wafer fabs; greatest number of closures in Japan.

02/27/2019  ON Semiconductor today announced its top distribution partners for 2018.

02/27/2019  The IBM board of directors today elected Admiral Michelle J. Howard to the board, effective March 1, 2019.

02/27/2019  Qualcomm Incorporated and Samsung Electronics have named two executives to join the Silicon Integration Initiative board of directors. Si2 is a global research and development joint venture that provides standard interoperability solutions for integrated circuit design tools.

02/27/2019  Micron Technology, Inc. today added a new cost-efficient solid-state drive (SSD) to its client computing portfolio.

02/26/2019  The SEMI Europe Industry Strategy Symposium (ISS Europe) returns in Milan, Italy, this year from 31st March to 2nd April, 2019 to explore new opportunities and challenges in the digital economy.

02/26/2019  Scientists create a unique platform to study quantum optical physics on the nanoscale.

02/26/2019  Sigma Labs, Inc. was named a member of the Manufacturing Technology Centre (MTC) located at Ansty Park, Coventry, UK.

02/26/2019  The Electronic System Design Alliance, a SEMI Strategic Association Partner, today opened nominations for member company executives to serve on the ESD Alliance Governing Council for the next two-year term.

02/25/2019  Cadence Design Systems, Inc. today announced that Toshiba Memory Corporation has successfully used the Cadence CMP Process Optimizer, a model calibration and prediction tool that accurately simulates multi-layer thickness and topography variability for the entire layer stack, to accelerate the delivery of its advanced 3D flash memory devices.

02/25/2019  Soitec, a designer and manufacturer of innovative semiconductor materials, today announced it is the first materials supplier to join the China Mobile 5G Innovation Center.

02/25/2019  SEMI today announced SEMI Works, a comprehensive program to attract, develop and retain the talent critical to the worldwide electronics industry's continued innovation and growth.

02/22/2019  GOWIN Semiconductor Corp. announces the release of GOWIN's new EDA tool, YunYuan 1.9.

02/22/2019  January billings of North American equipment manufacturers declined 10 percent when compared to the prior month.

02/22/2019  Despite increasing development costs, IC manufacturers continue to make great strides.

02/21/2019  A team of Cambridge researchers have found a way to control the sea of nuclei in semiconductor quantum dots so they can operate as a quantum memory device.