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SEMI and Solid State Technology announce the 2014 “Best of West” Award finalists

07/08/2014  Each year at SEMICON West, the largest and most influential microelectronics exposition in North America, the “Best of West” awards are presented by Solid State Technology and SEMI. The award was established to recognize contributors moving the industry forward with their technological developments in the microelectronics supply chain.

Sunny prospects await photovoltaics in 2014

07/08/2014  The long night in solar energy may be coming to an end.

What's next for semiconductor packaging?

07/08/2014  With mobile devices continuing to shrink in size and wearable electronics emerging as a new market for semiconductors, advanced packaging technologies are taking on increasing importance in the global supply chain. Aside from the 3DIC package/system-in-package area, what is going on in semiconductor packaging these days?

Printed, flexible, and organic electronics: A growing opportunity

07/08/2014  In wearable gadgets, flexible electronics may have met its dream application. And that’s no stretch of the imagination.

FinScale’s Quantum FinFET Aims to Revive Moore’s Law

07/07/2014  FinScale Incorporated, the semiconductor device and process innovation company, today announced immediate availability of its qFinFETTM technology, a next generation 3D MOSFET architecture and manufacturable process readily transferable to foundries and integrated device manufacturers

SEMI Announces Results of Board Elections and Leadership Appointments

07/07/2014  SEMI today announced that Martin Anstice, president and CEO, Lam Research Corporation; Kevin Crofton, president and COO, SPTS Technologies; Tien Wu, COO, ASE Group; and Guoming Zhang, executive vice president, Sevenstar Electronics, were elected as new directors to the SEMI International Board of Directors in accordance with the association's by-laws.

SEMI Forecasts Back-to-Back Years of Double-Digit Growth in Chip Equipment Spending

07/07/2014  SEMI projects back-to-back years of double-digit growth in worldwide semiconductor equipment sales according to the mid-year edition of the SEMI Capital Equipment Forecast, released here today at the annual SEMICON West exposition.

Internet of Things: big numbers, many opportunities

07/03/2014  Whatever forecast one uses for the future of the Internet of Things in terms of connected objects or business opportunities, the IoT will be big.

IoT will transform transportation

07/03/2014  Cars that can get along without drivers are coming, down the road, but they are a small part of the changes that the global transportation industries will undertake as microelectronics and the Internet of Things prompt major changes in infrastructure and logistics, as well as all type of vehicles.

Gopal Rao at The ConFab: Scaling isn’t enough anymore

06/25/2014  The core element of the semiconductor industry’s roadmap has been scaling – but Gopal Rao believes that isn’t enough anymore.

ConFab panelists discuss optimizing R&D in the changing semi landscape

06/24/2014  Overheard @The ConFab: “I feel the best I’ve felt about semi since 2009.” –Mike Noonen, Silicon Catalyst

A silicon replacement? USC Viterbi School of Engineering overcomes major issue in carbon nanotube tech

06/23/2014  Researchers from the USC Viterbi School of Engineering describe how they have overcome a major issue in carbon nanotube technology by developing a flexible, energy-efficient hybrid circuit combining carbon nanotube thin film transistors with other thin film transistors.

At The ConFab 2014: Do we still need Moore’s Law?

06/23/2014  Many questions were in the air on the first day of the 10th annual ConFab 2014, and certainly chief among them was raised during Dr. Roawen Chen of Qualcomm’s keynote “What’s On Our Mind” on Monday morning when he asked, “Should we pursue Moore's Law unconditionally?"

GlobalFoundries presents first global Supplier Awards

06/23/2014  JSR Corporation, Lam Research, Tokyo Electron Ltd. and SUMCO Corporation honored for outstanding collaboration, service and cost leadership.

Flexible glass firms branch into new applications

06/22/2014  Ultrathin glass is well suited for use as interposers in semiconductor packaging applications.

Subatmospheric gas storage and delivery: Past, present and future

06/19/2014  Storing gas on a sorbent provides an innovative, yet simple and lasting solution.

200mm equipment market gaining new lease on life

06/16/2014  In 2004/2005, shipments of 300mm wafer fab equipment (WFE) began to outpace that of 200mm platforms.

Industry sustainability efforts mount with III-Vs and other advanced technologies

06/12/2014  The introduction of new materials, such as III-Vs, into high-volume manufacturing of semiconductors, likely will occur sometime around the 7nm and/or 5nm nodes.

Global flat-panel TV shipments enjoy sound growth in Q1

06/11/2014  Worldwide shipments of flat-panel televisions rose convincingly in the first quarter of 2014 compared to the same period last year, a stronger-than-expected showing that puts the industry on firm footing for the year.

SABIC collaborates with Cima NanoTech on breakthrough display technology

06/05/2014  As smart materials become one of the fastest growing areas of materials technology, SABIC and Cima NanoTech, a Singapore and US-based company, have announced the joint development of a plastics industry first: a transparent conductive polycarbonate film that has the potential to revolutionize the materials used in consumer electronics, household goods, automotive, architecture and healthcare.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

Sponsored By:

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