Displays

DISPLAYS ARTICLES



Wafer shipments forecast to increase in 2017, 2018 and 2019

10/17/2017  Total wafer shipments this year are expected to exceed the market high set in 2016 and are forecast to continue shipping at record levels in 2018 and 2019.

Sun Chemical enters into license agreement to introduce new screen printable molecular inks

10/12/2017  Sun Chemical has entered into a license agreement to introduce a new family of molecular inks for the printed electronics market with Groupe Graham International (GGI).

Gartner identifies the top 10 strategic technology trends for 2018

10/06/2017  Gartner, Inc. this week highlighted the top strategic technology trends that will impact most organizations in 2018.

Flexible display shipments will increase to 643M units annually by 2022

10/04/2017  In 2017, key flexible display components achieved cost and performance parity with their rigid counterparts for the first time, thus removing a key market barrier and opening the door to rapid adoption in a variety of otherwise-rigid devices such as e-readers and wearables.

Team builds flexible new platform for high-performance electronics

10/04/2017  A team of University of Wisconsin–Madison engineers has created the most functional flexible transistor in the world -- and with it, a fast, simple and inexpensive fabrication process that’s easily scalable to the commercial level.

Extra sulphur improves electronic structure of quantum dots

10/02/2017  Quantum dots are nanometre-sized semiconductor particles with potential applications in solar cells and electronics. Scientists from the University of Groningen and their colleagues from ETH Zürich have now discovered how to increase the efficiency of charge conductivity in lead-sulphur quantum dots.

SEMICON Europa moves to Munich: Empowering innovation and shaping the value chain

09/20/2017  New programs on Materials, Automotive, and Flexible Electronics expand SEMICON Europa's impact.

Andrew Wilson elected to Intel Board of Directors

09/18/2017  Intel Corporation today announced that Andrew Wilson, CEO of Electronic Arts Inc., has been elected to Intel's board of directors. Wilson's election brings Intel's board membership to 12.

Driven by TV size migration, large TFT display market continues to grow 6% by area in 2017

09/15/2017  The large thin film transistor (TFT) display market is expected to continue to expand in 2017 despite slower end-market demand, according to IHS Markit.

More than 45,000 expected at SEMICON Taiwan 2017

09/12/2017  Upbeat about the growth prospects of Taiwan's electronics sector, more than 45,000 visitors are expected to attend SEMICON Taiwan 2017 which opens tomorrow at Taipei's Nangang Exhibition Center.

Fab equipment spending breaking industry records

09/12/2017  2017 fab equipment spending (new and refurbished) is expected to increase by 37 percent, reaching a new annual spending record of about US$55 billion.

Flex Logix joins TSMC IP Alliance Program

09/05/2017  Flex Logix Technologies, Inc., the supplier of embedded FPGA IP and software, today announced that it has joined the TSMC IP Alliance Program included in TSMC's Open Innovation Platform.

Flexible hybrid electronics & sensors impacting the automotive industry

09/05/2017  FlexTech, a SEMI strategic association partner, will host a one-day Flexible Hybrid Electronics and Sensors Automotive Industry workshop in Detroit, Michigan on September 13, 2017 to explore how FHE adds functionality, decreases weight and impacts design. Automotive and electronics industry leaders will gather to discuss the market demands and challenges with automotive technology and present disruptive changes brought by flexible hybrid electronics (FHE) and sensors.

Leti and partners in PiezoMAT Project develop new fingerprint technology

09/05/2017  Leti today announced that the European R&D project known as PiezoMAT has developed a pressure-based fingerprint sensor that enables resolution more than twice as high as currently required by the U.S. Federal Bureau of Investigation (FBI).

Equipment forecast: $49.4 billion

09/01/2017  In 2018, 7.7 percent growth is expected, resulting in another record-breaking year—totaling $53.2 billion for the global semiconductor equipment market.

TV market: Quantum dots reinforce LCD positioning, faced with the OLED solutions

08/31/2017  How will the competitive landscape evolve, especially with OLED solutions?

Panel makers forecast to maintain high fab utilization rates in Q3

08/29/2017  The overall utilization rate of display panel fabrication (fab) plants is expected to remain high in the third quarter of 2017, recording similar levels for the fifth consecutive quarter.

SparkLabs launches $50M early-stage fund for South Korea

08/25/2017  SparkLabs Group, a network of accelerators and funds, is launching a $50 million early-stage fund (Series A & B) primarily focused on South Korea.

OLED encapsulation materials market to grow 16% CAGR to $233M by 2021

08/21/2017  The popularity of organic light-emitting diode (OLED) TVs and smartphones has boosted not only the OLED display market but also the OLED encapsulation materials market.

Ultrathin Layers with Large Contact Area on Carbon Fibers as High-Performance Electrode

08/15/2017  To meet the novel functions of next-generation electronics, including foldable displays, flexible power sources are needed.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

Sponsored By:

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