Displays

DISPLAYS ARTICLES



Foldable AMOLED panel shipments to top 50M units by 2025

11/09/2018  Spurred on by growing demand for innovative user experience in smartphones, shipments of foldable active-matrix organic light-emitting diode (AMOLED) panels are expected to reach 50 million units by 2025 for the first time since their launch in 2018, according to IHS Markit.

FlexTech Taiwan Committee launched to advance flexible hybrid electronics

11/06/2018  SEMI Taiwan today announced the formation of the FlexTech Taiwan Steering Committee.

German research institute drives flexible electronics innovations

10/30/2018  SEMI spoke with Prof. Christoph Kutter, executive director, Fraunhofer EMFT, about trends and innovations in flexible hybrid electronics ahead of his presentation at the 2018 FLEX Europe - Be Flexible conference at SEMICON Europa 2018, 13-16, November 2018, in Munich, Germany.

MagnaChip to begin volume production of new automotive display driver IC

10/22/2018  MagnaChip Semiconductor Corporation, a designer and manufacturer of analog and mixed-signal semiconductor platform solutions, today announced that volume production of a new Display Driver IC (DDIC) for automotive panel displays has begun.

Apple, the best positioned to bring high volume consumer microLEDs to market

10/09/2018  MicroLED displays could potentially match or exceed OLED performance in all critical attributes.

Plessey chooses AIX G5+ C MOCVD tool for GaN-on-Silicon monolithic microLEDs display innovation

09/20/2018  Plessey, a developer of award-winning optoelectronic technology solutions, announces it has placed an order for its next reactor from AIXTRON SE.

Commercially relevant bismuth-based thin film processing

09/19/2018  Researchers from Osaka University demonstrate a photoresponsive film processing technique that balances morphological properties with electronic performance.

Two quantum dots are better than one: Using one dot to sense changes in another

09/19/2018  Osaka University-based collaboration fabricates the first nanoelectronic device that can detect single-electron events in a target quantum dot using a second dot as a sensor.

FLEX/MSTC 2019 Call for Papers deadline is September 28, 2018

09/19/2018  Educate the industry with the latest in flexible, hybrid and printed electronic innovations OR sensor systems enabling autonomous mobility.

Tight supplies impede LCD panel cost reduction in third quarter of 2018

09/10/2018  Tight supplies of display panel materials and components, such as driver integrated circuit (IC), glass substrate and polarizer, are expected to slow the decline rate of liquid crystal display panel costs.

Large TFT LCD shipments hit record monthly high in July 2018

08/31/2018  Expanded production capacity, historical-low LCD TV panel prices and panel makers’ efforts to clear up inventories help.

Universal Display Corporation announces recipients of the 2018 UDC Innovative Research and Pioneering Technology Awards at IMID Korea

08/31/2018  These awards were presented at the 18th International Meeting of Information Display (IMID) conference on August 30, 2018 in Busan, Korea by Dr. Julie Brown, Senior Vice President and Chief Technology Officer of Universal Display.

Environmentally friendly photoluminescent nanoparticles for more vivid display colors

08/30/2018  Osaka University-led researchers created a new type of light-emitting nanoparticle that is made of ternary non-toxic semiconductors to help create displays and LED lighting with better colors that are more environmentally friendly.

Avegant closes $12M round of funding

08/28/2018  Avegant Corp. announced today that the company closed $12M in Series AA funding from new investors Walden SKT Venture Fund and China Walden Venture Investments III, L.P., as well as previous investors.

CTA study: China tariffs will cost the U.S. economy up to $2.4B annually

08/17/2018  The Trump administration's consideration of tariffs on Chinese printed circuit assemblies and connected devices would cost the economy $520.8 million and $2.4 billion annually for the 10 percent and 25 percent tariffs, respectively, according to a new study commissioned by the Consumer Technology Association (CTA).

SEMI integration of ESD Alliance underway

08/14/2018  SEMI today announced that all legal requirements have been met for the ESD (Electronic Systems Design) Alliance to become a SEMI Strategic Association Partner.

Shipments of flexible AMOLED panels expected to exceed rigid panels by 2020

08/13/2018  Amid growing demand for active matrix organic light-emitting diode (AMOLED) panels for smartphones, shipments of flexible AMOLED panels are expected to account for more than 50 percent of total AMOLED panel shipments by 2020.

SEMI testifies against U.S. tariffs; Members meet with congressional leaders urging trade action

07/30/2018  Two months after opposing $34 billion in U.S. trade tariffs on behalf of the U.S. semiconductor manufacturing industry, Jonathan Davis, global vice president of industry advocacy at SEMI, this week spoke out against an additional $16 billion duties on Chinese goods.

Tokyo Tech Hosono's story of IGZO TFT development features in Nature Electronics

07/25/2018  Each issue of the journal Nature Electronics contains a column called 'Reverse Engineering,' which examines the development of an electronic device now in widespread use from the viewpoint of the main inventor. The July 2018 column tells the story of the IGZO thin film transistor (TFT) through the eyes of Professor Hideo Hosono of Tokyo Tech's Institute of Innovative Research (IIR), who is also director of the Materials Research Center for Element Strategy.

Future electronic components to be printed like newspapers

07/20/2018  A new manufacturing technique uses a process similar to newspaper printing to form smoother and more flexible metals for making ultrafast electronic devices.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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