09/18/2012 

At IEDM, IBM researchers will demonstrate high-performance state-of-the-art CMOS circuits —including SRAM memory and ring oscillators—on a flexible plastic substrate.

09/17/2012 

Shipments of tablets are booming, and that means demand for tablet displays is set to spike as well -- and some new panel makers are getting in on the action, reports IHS iSuppli.

09/07/2012 

Analysts weigh the reasons behind Intel's downwardly-revised 3Q12 results, from macroeconomic sluggishness to tablet-PC cannibalization -- and whether its pullback in 2012 capex plans spells trouble for the market overall.

08/21/2012 

An unnamed "major Asian customer" will use Aixtron's Prodos polymer PVD tool to deposit organic polymer thin films for production of flexible electronic devices.

08/14/2012 

Printing is emerging as a technology that can replace traditional photolithography processes for electronics manufacturing, reducing costly material use, very complex processes, and expensive equipment.

08/09/2012 

The FlexTech Alliance announced the Call for Papers is open for the 12th annual Flexible Electronics & Displays Conference & Exhibition.

08/09/2012 

AIXTRON launched the PRODOS-200 PVPD system for deposition of organic thin film materials, used to make OTFT displays and OLEDs, and in other manufacturing applications.

08/08/2012 

Brown University developed a simpler, cheaper, solution-based manufacturing process for indium tin oxide (ITO) conductive films used in displays and solar cell manufacturing.

08/03/2012 

E Ink Holdings, electronic paper and LCD technology company, signed a definitive agreement to buy shares of SiPix Technology Inc., the maker of electronic paper displays.

08/03/2012 

Charles Annis, DisplaySearch, reports on new thin glass products for lighter, thinner, and flexible displays, and shares the pros and cons of thinned glass and polymer substrates.

08/03/2012 

Panasonic Corporation (NYSE:PC, TOKYO:6752) will reform its head office and governance as of October 1, aiming to reduce internally focused work and focus on customer needs.

08/01/2012 

Most firms offering alternatives to ITO focus on the touch-screen sensor market; however, this sector is too small for many of these firms to generate significant revenues. NanoMarkets outlines the various ITO alternatives, and their possible application spaces.

07/27/2012 

Optomec’s Aerosol Jet deposition tools are being used for printed sensor, display, solar cell, CMOS and passive devices, and other development areas, with new installations at CEA Liten (France), Innovation Lab (Germany) and the University of Sheffield (UK).

07/25/2012 

UniPixel completed the production-level qualification of its Diamond Guard Hard Coat film with its manufacturing and distribution partner, Carestream Tollcoating.

07/20/2012 

IPC and JPCA released their first operational-level standard for the printed electronics industry, defining terms and establishes basic requirements for substrate materials used in printed electronics: ceramic, organic, metal, glass and other.

07/19/2012 

Historically, only p-type organic semiconductors have been viable when deposited on flexible substrates. With Polyera’s advances in n-type organic semiconductors, CMOS devices from displays to RFID tags can be printed.

07/09/2012 

Ushio launched its thinnest UV irradiance meter 'UIT-q365." The meter is 4.9mm thick, used to keep major UV processes within spec. It can be used during optical film manufacturing for flexible electronics, as well as during adhesion of precision optical parts.

07/05/2012 

ITO is the basis of more than 90% of TCFs, used in displays, flexible photovoltaics, and other devices, reports Cathleen Thiele, IDTechEx. With indium prices rising, and technical challenges related to indium’s brittle nature, manufacturers are looking to new technologies, such as finely printed conductive meshes, layers of silver or copper that are highly transparent, organic transparent conductors and variations such as carbon nanotubes and graphene.

07/03/2012 

Technology for making circuits with organic materials, non-vacuum processes, and flexible substrates has made striking progress, but it’s been a challenge to find applications where the new technologies offer must-have advantages. Paula Doe, SEMI, reports on flexible and large-area OLED displays and lighting.

06/29/2012 

OLED thin film encapsulation technology is the one of technologies emerging as the core technology of flexible OLED, and technology development and patent securing competition between world’s leading OLED companies will increase accordingly, shows Displaybank.