Flexible Displays

FLEXIBLE DISPLAYS ARTICLES



Conference report: TechConnect, Day 2

06/21/2012 

Day 2 of the 2012 TechConnect World Summit, Expo & Showcase opened with fifteen parallel sessions ranging from printed and flexible electronics to device modeling to green chemistry and water to nanotechnology for cancer diagnostics. The unifying theme for this conference is promising technology in search of funding and the opportunity for market validation.

Panasonic re-ups imec research partnership on CMOS, flexible electronics, more

06/14/2012 

imec and Panasonic Inc. have entered into the next phase of a comprehensive and broadened collaboration agreement for joint R&D on healthcare, wireless communication, flexible electronics and advanced CMOS process technologies.

PANL hits white OLED performance record

06/11/2012 

Universal Display Corporation (NASDAQ: PANL) announced record-breaking performance of its white organic light-emitting diode (OLED) lighting technology.

Exciting display products take awards at Display Week

06/05/2012 

The Society for Information Display (SID), a global organization dedicated to the advancement of electronic display technology, announced the winners of its 17th annual Display Industry Awards.

CNTs produced with >95% semiconducting content now available from SWeNT

05/31/2012 

SouthWest NanoTechnologies (SWeNT) released SG65i, a single-wall carbon nanotube product with >95% semiconducting concentration, before secondary processing to remove metallic SWCNT content.

AGC carrier glass enables ultra-thin display fab in existing production lines

05/30/2012 

AGC has developed 0.5mm carrier glass for handling and transport of its 0.1mm-thick ultra-thin glass during product manufacturing processes.

Largest flexible OLED display fabbed with mixed-oxide TFT

05/30/2012 

The Flexible Display Center at ASU, in conjunction with Army Research Labs scientists, manufactured what it is reporting as the world's largest flexible, full-color OLED display prototype. FDC used advanced mixed-oxide TFTs to build the 7.4” device.

ITF: Reconfigurable radios and scaled CMOS for a true mobile life

05/25/2012 

The next big thing according to Charlotte Soens, manager mm-wave communication program at imec, is that people will start using these mobile devices to watch high-quality photos and videos, stored in the cloud. Soens presented details at imec's International Technology Forum.

3M flexible barrier films for displays come to market

05/22/2012 

M’s Optical Systems Division made its flexible, optically clear 3M FTB3-50 and FTB3-125 films available commercially, to protect sensitive electronics displays from water vapor and oxygen. The films previously were sold under limited R&D agreements.

FLEXcon supports flexible electronics with new R&D center in MA

05/10/2012 

Adhesive coating/laminating company FLEXcon opened its newly constructed, 20,000sq.ft. Technology and Innovation Center for R&D at its headquarters in Spencer, MA.

Organic complementary logic aim of 2 European research projects

05/04/2012 

The Heterogeneous Technology Alliance in Europe is focusing on high-performance organic electronic circuits through 2 projects: COSMIC to develop p- and n-type OTFTs for complementary logic, and POLARIC for shrinking critical dimensions of OTFTs.

Top 10 innovative technology firms in Q1

05/04/2012 

Lux Research profiled 328 companies across 15 different emerging technology domains in Q1 2012. Of these, Lux Research selected its top 10, including a gallium-nitride (GaN) power device maker, printed electronics supplier, and others.

Arkema enters microelectronics manufacturing research area with CEA

05/01/2012 

CEA will extend its collaboration with Arkema beyond photovoltaics into microelectronics and organic electronics, setting up two joint public-private research projects in CEA-Leti and CEA-Liten.

OLEDs erode LCD dominance, starting in small displays

04/20/2012 

Organic light-emitting diode (OLED) will be a nearly $11 billion market in 2017, and will take some display market share from the $100-billion LCD sector, according to a Lux Research report.

Conference Report: MRS Spring 2012, Day 3

04/12/2012 

Blogger Mike Fury reports from the MRS Spring 2012 meeting in San Francisco. Highlights from the third day: leakage and TDDB in low- ? dielectrics, flexible energy storage and conversion, Mn capping layers and diffusion barriers, hard masks for Cu interconnects, nanogenerators, Cu in RF, flexible temperature sensors, NEMS and MEMS in HDD, ZnO nanostructures, and various aspects of CMP.

Conference report: MRS Spring 2012, Day 2

04/11/2012 

Blogger Mike Fury reports from the MRS Spring 2012 meeting in San Francisco. Highlights from the second day: OLED TFT displays, single transistor DRAMs, silicon photonic wires, CNTs, 3D optical interconnects, graphene for RF and sensing, transparent ZnO, epidermal electronic systems, stretchable electronics, ultra-low-k dielectrics, patterning of electroceramics, PRAM (an alternative to NRAM), and inkjet printing of superconducting films.

Polyera readies flexible semiconductors for launch with $24.5M funding round

04/05/2012 

Polyera pulled in $24.5 million in Series C funding, with all existing investors joining co-leaders Chengwei Capital and Tsing Capital, both in China. A good portion of the funding will be invested in Polyera's Asia-Pacific operations.

Oxide TFT comes to the fore with FPD growth

04/04/2012 

The FPD market's growth is pushing next-generation display technologies forward, as profitability worsens for a-Si TFTs. New core technologies are needed to improve the performance of TFTs, such as oxide TFTs.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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