Flexible Displays

FLEXIBLE DISPLAYS ARTICLES



Soaring indium costs drive hunt for alternative in transparent electrodes

03/30/2012 

As electronic devices with ITO-based displays proliferate, as is the case with smartphones and media tablets, indium market prices are soaring, Displaybank reports. ITO electrodes are also prone to cracking, which presents a problem for flexible displays.

Pervasive Displays partners with Energy Micro for electronic paper dev kit

03/27/2012 

Pervasive Displays partnered with Energy Micro, provider of low-power, ARM-Cortex-processor-based microcontrollers, to develop and prototype a range of electronic paper displays with low power consumption the main focus.

SEMICON Europa 2012 seeks presenters

03/23/2012 

SEMI is seeking papers for technical sessions and presentations at the upcoming SEMICON Europa 2012, October 9-11 in Dresden, Germany. Technical presentation abstracts are due April 30.

Reel-to-reel coater eliminates waste of roller-in-bath tools

03/15/2012 

Rainbow Technology Systems introduced the Panda Coater for high-performance coating of sheet and reel-to-reel materials. It offers an alternative to coventional roller-in-bath systems.

UniPixel names manufacturing partner for display cover films

03/13/2012 

UniPixel Inc. (NASDAQ:UNXL) tapped Carestream Tollcoating to manufacture and distribute its Diamond Guard protective cover films for displays.

Dupont Teijin Films exec joins FlexTech Alliance leadership

03/08/2012 

FlexTech Alliance, focused on developing the flexible, printed electronics industry supply chain, appointed its 2012 Governing Board members.

SEMI acquires Plastic Electronics Conference and Exhibition

03/05/2012  SEMI has acquired the Plastics Electronics Conference and Exhibition, a move which will help advance the successful commercialization of new products in the field of organic and inorganic large area electronics (OLAE).

Metrology project launches in Europe for thin films

03/02/2012 

The National Physical Laboratory in the UK is leading a new EMRP project on thin film manufacturing metrology for industries such as opto electronics, plastic and printed electronics, displays and lighting, memories and solar cells.

Attend FPD China for next-gen display technologies and China's displays industry role

03/01/2012 

Dynamic changes in the FPD industry range from new LCD, AMOLED, touch, and flexible technologies to the emergence of China as the leading consumer and manufacturer of display products. FPD China covers the entire industry supply chain.

Kent Displays triples flexible LCD production capacity with second R2R line

03/01/2012 

Kent Displays is installing its second roll-to-roll (R2R) production line at its Kent, OH headquarters, manufacturing flexible Reflex No Power LCDs.

Samsung's LCD spin-out brings AMOLED to the display forefront, more efficiency

02/29/2012 

Samsung Electronics Co. Ltd. recently spun off its LCD operations, which IHS analysts say will boost the short-term competitiveness of the business, and may herald the long-term dominance of AMOLED in display technology.

Asian Research Network develops CNT touch sensors, electronic ink

02/28/2012 

Several Asian universities and research institutes launched the Asian Research Network to strengthen research and educational cooperation across Asia. ARN members have produced transparent touch sensors using CNT, and electronics inks.

European collaboration to develop organic and large-area electronics

02/27/2012 

Europe’s leading organic and large-area electronics (OLAE) organizations have joined forces in the Framework 7 project COLAE, which aims to speed up the commercialization and adoption of organic and large area electronics by promoting collaboration between industry clusters throughout Europe.

Konica Minolta moves to MEMS for OLED-printing inkjet head

02/14/2012 

In the company's first use of MEMS technology, Konica Minolta developed the KM128SNG-MB high-precision inkjet printhead for manufacturing printed electronics.

Georgia Institute of Technology, PARC + Thin Film Electronics, Western Michigan University win FLEXIs for flexible electronics advances

02/09/2012 

FlexTech Alliance awarded its 2012 FLEXI Awards for flexible, printed electronics and displays industry to PARC and Thin Film Electronics, Western Michigan University, and the Georgia Institute of Technology.

2012 Flexible Electronics & Displays: The future is flexible

02/08/2012 

Printed flexible electronics represent the future of sensors, displays, power electronics, and lighting, according to experts at the FlexTech Alliance 2012 Flexible Electronics & Displays Conference & Exhibition.

Progress in Printed Electronics: An Interview with PARC’s Janos Veres

01/31/2012 

Solid State Technology editor Pete Singer caught up with Janos Veres, area manager for printed electronics in the electronic materials and devices laboratory at PARC.

Thinfilm forms printed display and battery partnerships

01/24/2012 

Thin Film Electronics ASA (Thinfilm) announced technology partnerships with printed display and printed battery companies, part of its roadmap for integrating fully printed electronic systems.

USPTO seeks nominees for National Medal of Technology and Innovation

01/24/2012 

The USPTO is looking to increase the diversity of honorees for its annual National Medal of Technology and Innovation (NMTI), honoring "this nation's creative geniuses."

imec launches flexible OLED display manufacturing research with Holst Centre

01/19/2012 

imec and Holst Centre, with associated industry partners, are developing flexible active-matrix OLED display technology, the associated drivers and circuits, and new manufacturing equipment to build the displays, all with an eye on low-cost and high-volume production.




WEBCASTS



Environment, Safety & Health

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The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

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As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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