Flexible Displays

FLEXIBLE DISPLAYS ARTICLES



Silicon nano-ribbons = flexible, stretchable ICs, says ConFab presenter David Icke

05/19/2011 

Silicon nano-ribbons manufactured by mc10The holy grail of flexible electronics would combine the performance of ICs with a form factor that could be stretched, twisted, and conformed to unconventional shapes. David Icke, CEO, MC10 Inc. spoke about flexible electronics in his ConFab Emerging Technologies talk, "Electronics Anywhere: Conformal, Stretchable Electronics Technology & Applications."

MRS Day 3: Memory, hardmasks, low-k -- nothing's confidential

04/28/2011 

Michael A. Fury continues reporting from this year's MRS Spring meeting. Highlights from Day 3: PCM and other memory devices; damascene vs. amorphous carbon hardmasks, more on low-k and ULK materials, and studies of barrier materials and deposition processes.

Henkel brings adhesives into Holst Centre research network on flexible electronics

04/18/2011 

Adhesives with electrical conductivity, moisture barriers, etc. are needed for heterogeneous integration of silicon and plastic electronics, lamination and interconnection of functional foils to form working devices such as flexible solar cells, OLED lighting, or flexible displays, and other technologies. Henkel will work in various research areas at Holst.

Large OLEDs top lists in China

04/07/2011 

Small-sized OLEDs are mature, now that rapid adoption has occured in the mobile phone sector. With technical advances and mass production processes, larger-sized OLEDs will come to the fore, according to CCID Consulting. Advancements are needed in the areas of process equipment and driver IC technology for China to become an OLED leader. CCID and NanoMarkets summarize their OLED market assessments for China, Japan, and Korea.

Nanocomposites in nature fuel OPV flex electronics

01/13/2011 

Chiton teeth. Source: Northwestern UniversityResearchers at Northwestern University are using an atomic-scale imaging tool to study organic/inorganic interfaces. Understanding how composites like the Eastern beaded chiton's teeth are designed can help scientists intelligently construct new materials.

SmartKem wins Welsh grant for flexible semiconductor materials

01/05/2011 

SmartKem Ltd, developer of novel printable semiconductor materials for flexible electronics, announced that the Welsh Assembly Government has awarded the company £335,000 in funding to further develop its flexible printed electronics solutions.

NanoTech-developing-high-speed-ALD-system-under-FlexTech-grant

11/30/2010 

The FlexTech Alliance has awarded a contract to Cambridge NanoTech to develop a high-speed atomic layer deposition (ALD) system. When completed, the system will enable the manufacture of large-area and flexible substrates for use in organic electronics, solar cells, biomedical devices, and displays.

Flexible-Display-Center-AUO-AMOLED-development

11/17/2010 

The Flexible Display Center at Arizona State University announced that AU Optronics has become an industry partner. The companies will collaborate on the development of mixed oxide thin film transistors to accelerate the commercial availability of active-matrix organic light-emitting diode flexible displays.

Nobel_Laureate_graphene_researcher_Kostya_Novoselov plans SEMICON Europa talk

10/11/2010 

Dr. Kostya Novoselov will present, "Graphene: Materials in the Flatland." His talk will be given within the Plastic Electronics Conference on Thursday, October 21 in the plenary hall of Messe Dresden.

Nanotubes pass acid test: Rice U research method untangles long tubes, clears hurdle toward armchair quantum wire

07/14/2010 

Rice University scientists have found the ultimate solvent for all kinds of carbon nanotubes (CNTs), a breakthrough that brings the creation of a highly conductive quantum nanowire closer.

Flextech Alliance, Western MI U develop materials registry

07/08/2010 

The registry targets more timely, efficient, and accurate selection of the most appropriate material sets for flexible, printed electronics industry product developments, and serve all manufacturing platforms. The project is being funded in response to an identified critical industry need for more reliable performance and applications data on the variety of materials used in flexible, printed and organic (FPO) electronics applications.

Inside the NIST gold/Si "sandwich" molecular switch

09/25/2009 

NIST materials scientist Mariona Coll Bau gives Small Times more insight into recent work with molecular switches and organic-silicon/metal "sandwiches," utilizing a flip-chip lamination process.

New England nanotech center renews funding

08/26/2009  August 25, 2009: The Nanoscale Science and Engineering Research Center for High-rate Nanomanufacturing, a joint venture pooling efforts from Northeastern, U. of Massachusetts/Lowell, and U. of New Hampshire, has received a five-year, $12.25M renewal grant from the National Science Foundation to continue its work with commercializing nanoscale scientific process.

Northwestern, Baxter Healthcare form innovation alliance

01/09/2009  January 9, 2009: Northwestern Univesity and Baxter Healthcare Corp. will create a multidisciplinary research and innovation alliance, building on their existing collaboration on topics ranging from stem cell and nanotechnology research to student recruitment.

Solterra plucks new science chief from AZU display center

11/24/2008  November 24, 2008: Hague Corp., a solar technology and quantum dot manufacturing company, has appointed Ghassen E. Jabbour to the position of chief science officer, to lead development and characterization of thin-film quantum dot solar cell products at recently acquired Solterra Renewable Technologies.

IMEC touts optical links in flexible substrate

10/09/2008  European R&D consortium IMEC says it has made first functional optical links embedded in a flexible substrate, paving the way toward optical sensing foils for use in monitoring irregular or moving surfaces.

USDC Expands ANNUAL FlexIBLE ELECTRONICS & DISPLAYS Conference

06/18/2008  June 18, 2008 -- The U.S. Display Consortium (USDC), a public/private partnership chartered with developing the flat panel display (FPD) and flexible electronics industry infrastructure, today announced a significant expansion to its 8th annual Flexible Electronics and Displays Conference, which returns February 2-5, 2009.

Vitex touts flexible CIGS lifetime achievement

06/12/2008  June 12, 2008 - Vitex Systems says it has achieved a "key breakthrough" in protecting flexible copper indium gallium selenide (CIGS) solar cells with its "Flexible Glass," achieving 1100 hrs of testing in high-temperature and humidity conditions with stable efficiency.

Center for High-rate Nanomanufacturing's "revolutionary" technology for nanoscale assembly

05/16/2008  May 16, 2008 -- Researchers at the Nanoscale Science and Engineering Center for High-rate Nanomanufacturing (CHN) at Northeastern University say they have discovered "an innovative technology that will have a tremendous impact on the nanotechnology industry." And they plan to demonstrate a prototype next month.

Binghamton University opens microelectronics manufacturing center

04/03/2008  Binghamton University inaugurated its Center for Advanced Microelectronics Manufacturing (CAMM) facility this week. A collaborative effort by Binghamton University, Endicott Interconnect Technologies and Cornell University, the CAMM plans to pioneer microelectronics manufacturing research and development in a roll-to-roll (R2R) format.




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Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

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As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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