06/09/2006  June 9, 2006 - Korean fabless chip firm Tomato LSI and IP licensing firm Clairvoyante say they have produced the world's smallest single-chip IC driver for amorphous silicon TFT VGA display panels, in response to demand for high-resolution panels used in handheld mobile devices.

04/04/2006  April 4, 2006 - IMEC and its associated laboratory at the U. of Ghent have developed a new process flow for ultrathin chip packages resulting in bendable packaged chips. The process has been demonstrated with silicon chips thinned down to 20-30µm, with total thickness of 50µm.

02/23/2006  February 23, 2006 - Vitex Systems Inc., San Jose, CA, a developer of equipment and films used for organic light-emitting diode (OLED) displays, says it is changing its business model to focus on licensing IP for its thin-film encapsulation technology.

10/04/2005  October 4, 2005 - Seiko Epson Corp. has made what it claims is the world's first bendable SRAM (static random access memory) device, using low-temperature polysilicon TFTs (thin film transistors), according to the Nikkei English News.

09/23/2005  L.L. Moro, N.M. Rutherford, X. Chu, R.J. Visser, Vitex Systems, San Jose, California

All electronic and optoelectronic devices require protection from the influences of the environment. A thin-film, transparent, and flexible moisture and gas barrier called Barix can be applied at low temperatures (e.g., <80°C). Although this type of barrier layer can be used in many applications, its attributes make it a key enabling technology for creating plastic flexible substrates...

12/29/2004  (December 29, 2004) Corvallis, Ore.—Researchers at Oregon State University and Hewlett Packard have reported their first example of an entirely new class of materials that could be used to make transparent transistors that are inexpensive, stable, and environmentally benign. This could lead to new industries and a broad range of new consumer products, scientists say.

09/08/2004  September 8, 2004 - EV Group, Scharding, Austria, is expanding its operations in North America in response to increased business and customer demand. EV Group Inc., the company's US subsidiary, will combine its headquarters, Technology Center, and Customer Support Division in the ASU Research Park in Tempe, AZ.

06/17/2004  You'll have to try this as a thought experiment if you're not in Japan: Imagine you're reading this on a handheld device the size of a paperback book. The device looks like an over-sized Palm handheld, except the screen doesn't glow. Instead, it reflects the light around you, like paper. Would you switch to a handheld electronic device? Sony Corp. is betting you will say yes.

04/19/2004 

03/11/2004  (March 11, 2004) El Segundo, Calif.—If 2001 and 2002 were the dark ages for the semiconductor industry (and they were!), last year represented the start of a chip renaissance, with sales rising at a healthy 14.2 percent rate, according to data from iSuppli Corp., a provider of market intelligence services for the EMS, OEMs and supplier communities.

08/07/2003  If the second quarter is any guide, some small tech companies are "growing up." Late stage investments accounted for more small tech venture dollars than in previous quarters and experts say small tech startups – especially in nanotech – are defining themselves more by the markets in which they operate than by the technologies they use.

07/25/2003  Imagine your kitchen blender conks out the day you’re hosting a large cocktail party. You search an online catalog, decide on a model, and click the “buy” button. But instead of waiting for the appliance to be shipped to your door, a new kind of printer on your desk springs into action, literally building the blender for you from the bottom up in a matter of hours. Call it desktop manufacturing. And thanks to small tech, it’s becoming a reality.

06/27/2003  If Baruch Levanon of Israel’s Power Paper Ltd. has his way, billions of batteries may soon be rolling off the printing presses just like your morning newspaper. Levanon believes it is just a matter of time before his slender, flexible batteries are used to power applications ranging from smarter smart cards to MEMS-driven health-care devices.

04/24/2003 

12/11/2002  Dec. 11, 2002 - Wilmington, DE, and Ewing, NJ - DuPont Displays, a business unit of DuPont and a developer and manufacturer of polymer OLED displays, together with Universal Display Corp. (UDC), an innovator of OLED technologies, have signed a joint development agreement to create a new generation of soluble OLED materials and technology.

02/01/2000  Statshield EMI/RFI High Moisture Barrier Bags provide a dry ESD-protected package for ESDS devices. The moisture transmission rate is < 0.005 gr, and the 6.5 mil thickness offers over 30 pounds of puncture resistance. Static dissipative properties comply with EIA-583-1 and available sizes range from 4 x 6≤ to 18 x 24≤. Desiccant and humidity indicator cards are available.

05/01/1999  The 3300 Moisture Barrier Bag offers long-term protection from moisture, high-frequency protection and static shielding to protect sensitive electronic components or parts. According to the manufacturer, the bag is constructed of a multi-layer 3.6 mil film that provides puncture and tear resistance, meets the requirements of EIA-583 Class I and contains no amines, amides or N-Octanoic acid. Bags are available in standard and custom sizes.

06/01/1998  These cleanroom packaging products help control contamination as well as provide ESD and moisture barrier protection. The line includes clear barrier laminates; high barrier foil laminates; static protective moisture barrier; low, medium and high density polyethylene; static shielding bags. All items are manufactured in a Class 100 cleanroom certified to Federal Standard 209E.