Flexible Displays

FLEXIBLE DISPLAYS ARTICLES



Wearable and mobile devices leading to rise in flexible displays

07/21/2016  Flexible displays for tablet PCs, near-eye virtual reality devices, automotive monitors and OLED TVs expected by 2022.

Flexible medical device manufacturing developments

07/14/2016  The SEMICON West 2016 Flexible Electronics Forum provided two days of excellent presentations by industry experts on these topics, and the second day focused on the medical applications of flexible circuits.

Wide color gamut displays to comprise 17% of display shipment area in 2018

06/14/2016  Shipment area of wide color gamut (WCG) displays is expected to reach 32 million square meters in 2018, which represents 17 percent of total display shipment area.

Changing markets drive smarter manufacturing by IC sector

06/13/2016  The changing market for ICs means the end of business as usual for the greater semiconductor supply chain. Smarter use of data analytics looks like a key strategy to get new products more quickly into high yield production at improved margins.

The CEA announces expanded collaboration with Intel

05/18/2016  The CEA (Atomic Energy Commission) and Intel are boosting their collaboration through a new R&D agreement signed in Paris on Thursday 12 May.

John Caldwell appointed as chairman of AMD Board of Directors

05/13/2016  AMD today announced that its Board of Directors has appointed Board member John Caldwell as Chairman.

FlexTech completes flexible hybrid electronics projects with ENrG, nScrypt, and PARC

05/11/2016  FlexTech, a SEMI Strategic Association Partner, today announced the formal completion of three flexible hybrid electronics (FHE) R&D projects under its U.S. Army Research Laboratory (ARL) technology investment agreement.

New research shows how silver could be the key to gold-standard flexible gadgets

05/11/2016  Research published in the journals Materials Today Communications and Scientific Reports has described how silver nanowires are proving to be the ideal material for flexible, touch-screen technologies while also exploring how the material can be manipulated to tune its performance for other applications.

Melissa Grupen-Shemansky appointed SEMI's CTO for flexible electronics and advanced packaging

05/04/2016  SEMI today announced the appointment of Melissa Grupen-Shemansky, Ph.D., as Chief Technology Officer (CTO) for the FlexTech Group and for SEMI’s Advanced Packaging program.

UW-Madison engineers fabricate fastest flexible silicon transistor

04/20/2016  Working in collaboration with colleagues around the country, University of Wisconsin-Madison engineers have pioneered a unique method that could allow manufacturers to easily and cheaply fabricate high-performance transistors with wireless capabilities on huge rolls of flexible plastic.

Researchers develop new semiconducting polymer for forthcoming flexible electronics

04/20/2016  A joint research team has developed a new n-type semiconducting polymer with superior electron mobility and oxidative stability.

What screens are made of: New twists (and bends) in LCD research

04/18/2016  Using a pioneering X-ray technique developed at Berkeley Lab, a research team has recorded the first direct measurements confirming a tightly wound spiral molecular arrangement that could help unravel the mysteries of its formation and possibly improve LCD performance.

The future is here: Interactive screens on your packages

04/08/2016  Instead of reading a label, consumers could be interacting with an electronic screen on packaging in the future, thanks to a revolutionary new development by scientists at the University of Sheffield.

Effective graphene doping depends on substrate material

03/29/2016  Juelich physicists have discovered unexpected effects in doped graphene - i.e. graphene that is mixed with foreign atoms.

Replacement for silicon devices looms big with ORNL discovery

03/17/2016  Two-dimensional electronic devices could inch closer to their ultimate promise of low power, high efficiency and mechanical flexibility with a processing technique developed at the Department of Energy's Oak Ridge National Laboratory.

EV Group scales up nanoimprint lithography for display manufacturing

03/14/2016  EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the EVG 7200 LA SmartNIL system for display manufacturing and other applications that require large-area substrates.

World's thinnest lens to revolutionize cameras

03/11/2016  Scientists have created the world's thinnest lens, one two-thousandth the thickness of a human hair, opening the door to flexible computer displays and a revolution in miniature cameras.

Overlooked resistance may inflate estimates of organic-semiconductor performance

03/10/2016  If unaccounted for, 'non-ideal' behaviors can inflate estimates of charge-carrier mobility.

Wearable device display unit shipments to hit $39M by 2016

02/26/2016  The growing popularity of wearable applications is driving up shipments of the displays used in these devices.

Call for Papers open for SEMICON Europa 2016 and 2016FLEX Europe

02/24/2016  SEMI today announced the "Call for Papers" for technical sessions and presentations for SEMICON Europa 2016 which takes place 25-27 October in Grenoble, France.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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