FPDs and TFTs

FPDS AND TFTS ARTICLES


Picosecond laser enables new high-tech devices

07/05/2012 

Industrially proven and robust, picosecond lasers are proving their worth in cutting and patterning of delicate materials for a wide variety of industrial applications.
TFT-LCD price fixing case brings $261M charge against Toshiba

07/04/2012 

A federal court jury found that Toshiba Corporation and its subsidiaries conspired with the world’s other leading manufacturers of Thin Film Transistor-Liquid Crystal Displays (TFT-LCDs) to raise and fix the prices of TFT-LCD panels and certain products.
Epson ships 80M HTPS TFT panels for 3LCD projectors

07/02/2012 

Seiko Epson reached the milestone of 80 million high-temperature polysilicon (HTPS) TFT LCD panels for 3LCD projectors, enough for more than 26.5 million projector units.
How 4K x 2K LCD TVs affect display panel manufacturing, yields

07/02/2012 

Ultra-high resolution, called 4K x 2K, displays may be the new selling point for LCD TVs. The architecture requires changes to manufacturing methods, including more photomask layers, notes David Hsieh, DisplaySearch, in this summary of the feature and its effects.
Samsung Mobile Display sources OLED materials from Novaled

07/02/2012 

Samsung Mobile Display (SMD) wiill purchase dopant materials used in the transport layers of its AMOLED display modules from Novaled. Novaled will also provide its proprietary PIN OLED technology to SMD for use in the production of SMD’s AMOLED display modules.
OLED thin-film encapsulation technology key to new applications

06/29/2012 

OLED thin film encapsulation technology is the one of technologies emerging as the core technology of flexible OLED, and technology development and patent securing competition between world’s leading OLED companies will increase accordingly, shows Displaybank.
ALD partnership enables surface functionalization of powders

06/29/2012 

Cambridge NanoTech entered a licensing agreement with Ghent University in Belgium to commercialize an ALD particle coating technology that uses thermal and plasma processes.
Edwards optimizes dry vacuum pumps for FPD fab

06/26/2012 

Edwards (NASDAQ:EVAC) debuted the iXL250Q and iXL750Q dry pumps, joining the iXL500Q pump in flat panel display (FPD) Gen-4 through Gen-10 fabs.
JPSA picosecond laser micromachining platform reduces debris and thermal damage

06/26/2012 

JP Sercel Associates Inc. released the IX-6168-PS picosecond-laser-based micromachining platform, using lasers with 5-500 picosecond pulse lengths.
Sony, Panasonic combine OLED manufacturing expertise to achieve large-panel, low-cost fab

06/25/2012 

Panasonic and Sony will combine their core and printing technology to jointly develop next-generation organic light-emitting diode (OLED) panel and module manufacturing technology.
Global LCD TV shipments fall for the first time

06/21/2012 

Worldwide TV shipments fell almost 8% year over year Y/Y in Q1 2012. The biggest contributor to this decline was a slowdown in shipments of LCD TVs, which fell Y/Y for the first time in the history of the category, declining just over 3%, to 43 million units, says NPD DisplaySearch.
Conference report: TechConnect, Day 2

06/21/2012 

Day 2 of the 2012 TechConnect World Summit, Expo & Showcase opened with fifteen parallel sessions ranging from printed and flexible electronics to device modeling to green chemistry and water to nanotechnology for cancer diagnostics. The unifying theme for this conference is promising technology in search of funding and the opportunity for market validation.
Samsung TV teardown report released: Advanced LCD cover, 3D display

06/20/2012 

Samsung Electronics’ UN46ES8000F TV is a high-end product with electronics and display integration. Displaybank performed a teardown analysis of the product.
AMAT’s Varian integration continues with Dickerson named president

06/20/2012 

In mid-2011, semiconductor manufacturing and assembly equipment supplier Applied Materials (NASDAQ:AMAT) acquired Varian Semiconductor Equipment Associates Inc. Now, the company is adding Varian’s former CEO Gary Dickerson as president.
OLED adoption means shifting reqs for OLED materials

06/18/2012 

Display maker MicroVision plans fundraising through public stock offer

06/15/2012 

MicroVision Inc. (Nasdaq:MVIS), ultra-miniature laser display maker, closed an underwritten public offering, with Oppenheimer & Co. Inc. as underwriter.
ERG Smart Bridge eases LCD transitions from CCFL to LED backlights

06/14/2012 

As LEDs replace CCFLs for backlighting of LCDs, manufactures face LCD upgrades and supporting electronics redesigns. ERG developed the Smart Bridge module to quickly, easily and economically upgrade to LEDs, using the system’s existing input power signals.
Dontech glass filters optimize display clarity and contrast

06/14/2012 

Dontech released the VCG-Series glass filters, formed with next-generation glass fabrication and thin-film vacuum deposition technology to provide exceptional optical transparency and environmental durability.
PANL hits white OLED performance record

06/11/2012 

Universal Display Corporation (NASDAQ: PANL) announced record-breaking performance of its white organic light-emitting diode (OLED) lighting technology.
3M debuts LCD backlight film with power of 3

06/11/2012 

3M Optical Systems Division unveiled its OneFilm optical film technology, which incorporates the functionality of three individual light management films into a single enhancement film for LCD backlights.



WEBCASTS


Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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