09/05/2011 

ULVAC Inc. uncrated the UNECS-3000A spectroscopic ellipsometer, which can measure the thinness of a thin film and optical constant. The noncontact film measurement tool targets semiconductor and liquid crystal display (LCD) manufacturing control.

09/01/2011 

The Future of Mobile Display by ROA Holdings finds that larger panels are increasing mobile device usage, and AMOLED is replacing LCD as the mainstream display technology. Mobile device companies, rather than display makers, are leading the drive for new technologies.

09/01/2011 

3D-capable thin film transistor (TFT) panel shipments were primarily for LCD TVs, reaching 4.9 million units in Q2 2011. According to the DisplaySearch Quarterly Large-Area TFT LCD Shipment Report, panel makers are targeting 53% growth in 3D LCD TV panel shipments for Q3.

09/01/2011 

University of Florida researchers developed a manufacturing process for quantum dot LEDs that is lower cost and higher volume than previous attempts, eliminating vacuum-based steps. The research spawned a start-up company: NanoPhotonica.

08/30/2011 

The IEEE Photonics Conference 2011, previously known as the IEEE LEOS Annual Meeting, will offer more than 550 technical presentations by the world

08/25/2011 

Asia's cleanroom hardware and consumables spending will hit $7.5 billion in 2015, comprising over 60% of the global market, according to the latest revision to the McIlvaine Cleanrooms: World Markets report.

08/24/2011 

Pico projectors, projector modules that can be integrated into cell phones and other electronics, are just gaining market adoption. However, expect pico projectors to exceed 97.5 million units, with revenues hitting $10 billion, by 2017, says Global Industry Analysts Inc.

08/18/2011 

DARPA awarded QD Vision Inc. $900,000 to advance their quantum-dot-based infrared materials and deliver two prototype devices in the next 12 months.

08/02/2011 

Dolomite has embedded electrodes into microfluidic chips to integrate microfluidics and electrochemistry. Dolomite implemented its thermal bonding process to create complex, leak-free microfluidic structures with electrodes as small as 2?m.

07/27/2011 

The Industrial Consortium On Nanoimprint (ICON), led by A*STAR's Institute of Materials Research and Engineering (IMRE), will roll out 2 commercial-volume roll-to-roll (R2R) manufacturing process for creating nano-scale textures on films and other surfaces.

07/22/2011 

JSR Corporation's subsidiary JSR Micro Korea will begin operation of a new

07/21/2011 

Wrapping up the Organic Microelectronics & Optoelectronics Workshop, Michael A. Fury reports on vertical structures for OLEDs, solution processing for OLEDs and organic TFTs, small-molecule organic semiconductors, and characterizing mobility and recombination in organic PV devices.

07/20/2011 

Techcet's Michael A. Fury reports from the Organic Microelectronics & Optoelectronics Workshop in San Francisco, where talks delved into flexible displays, organic molecular tunnel junctions, thin-film microprocessors, and a microphone that can "see" sound.

07/19/2011 

Each market in which Edwards is a supplier -- semiconductors, flat panel, photovoltaics, LEDs, has its own cycles and technology requirements. Matthew Taylor, CEO of Edwards, discusses the needs and market personality of each sector.

07/13/2011 

The Conformal Film Deposition (CFD) suite of dielectric films consists of oxide, doped oxide and nitride films that are deposited below 450

05/10/2011 

Teknek, contact cleaning technology provider, introduced the Ultracleen range of cleaning roller for flat panel display (FPD), solar photovoltaic (PV), touch panel, and other thin films.

04/11/2011 

Corning Incorporated (NYSE: GLW) said today the company plans to maintain production levels at its Shizuoka and Sakai City LCD glass facilities during Sharp Corporation’s temporary production curtailment of LCD panels.

03/15/2011 

Novellus Systems (NASDAQ: NVLS) debuted the VECTOR Excel for pre- and/or post-processing of dielectric films, such as diffusion barriers. New interface engineering reduces the RC delay constant without incorporating new materials into the back-end-of line (BEOL) integration scheme. 

03/14/2011 

CAPRES A/S, semiconductor metrology systems maker for the direct nano- and micro-scale electrical characterization of materials, announced a repeat order for its fully automated 300mm microRSP-A300 from an industry-leading foundry in Asia.

02/15/2011 

CEA-Leti and Edwards demonstrated an energy-saving controller system for subfabs that automatically puts process-support equipment in idle mode when fab processes are not running. It communicates with the load lock and process pumps to determine the process status of the tool.