FPDs and TFTs

FPDS AND TFTS ARTICLES



NanoGram, Teijin to push printed silicon for PV, TFT

03/16/2009  March 16, 2009: NanoGram Corp., which develops and manufactures advanced products and solutions for optical, electronic and energy applications, has entered into a technology development agreement (TDA) with Teijin Ltd. to further develop NanoGram's printed silicon ink.

SPIE keynote: "Virtuous cycle" for ICs, LCD applies to PV too

02/24/2009  The same "Virtuous Cycle" that has led to business success in semiconductor and display markets can be used to generate significant growth in PV markets, according to Applied Materials SVP Gilad Almogy, in his SPIE keynote address.

LCD manufacturing technologies target increasing transmission to reduce panel costs

01/12/2009  LCD prices are on a relentless downward trend. Lower prices are key to stimulating more demand and further growing the total market in terms of units as well as shifting demand to larger panel sizes. In order to maintain margins as prices fall, LCD producers constantly strive to lower costs. This trend is being exacerbated by the current weak economic environment and significant oversupply, causing prices to fall near cost levels, ever intensifying the focus on cost reduction.

AU Optronics eyes solar inroads

01/08/2009  AU Optronics, Taiwan's biggest maker of TFT-LCD panels, says it will extend its work with display technology into a pilot line for solar-cell panels at the Central Taiwan Science Park in Taichung during this year. The company also is establishing a new "Energy Project Office" to direct its efforts in green energy.

Challenging market conditions for 2009

01/08/2009  Market outlook in the semiconductor equipment industry is notoriously difficult due to its infamous cyclicality, but this year's global turmoil in the financial markets has added a new dimension of complexity and uncertainly. Add to this the new synergistic segments such as flat-panel display (FPD) and solar, with their unique business drivers, and we now have an exponentially more complex planning situation.

Taiwan DRAM bailout redux: Bailout numbers, who wants in, Elpida's role

01/06/2009  Taiwan's National Development Fund reportedly is ready to appropriate about US $6B to underpin its DRAM and flat-panel display industries, but individual companies are still hashing out whether their individual needs will be met. And an outside party is stumping to be the island's DRAM consolidator to challenge Samsung.

AMAT accelerating TSV implementation, launches Silvia etch tool

12/01/2008  Sizing up a TSV market beyond the early adopters, Applied Materials is collaborating with material and equipment suppliers (and others) to ensure the full readiness of TSV implementation. AMAT execs update SST on the firm's TSV efforts, including a new TSV process sequence developed with Semitool and a new etch tool.

Analysts: LCD tool spending dips, 2009 outlook unclear

11/04/2008  Manufacturing output for TFT-LCD displays is expected to hit record highs in 2008, but look for spending to fall off a cliff in 2009, according to separate analyst reports.

Vacuum processing for solar cells

10/24/2008  Like integrated circuit and flat-panel display manufacturing, solar cell manufacturing depends on a variety of vacuum-based processes, from PECVD silicon deposition to lamination of the finished module. Yet vacuum-based processes in solar cell manufacturing pose special challenges for pump designers.

Tegal+AMMS eyes growth in 3D packaging, MEMS

09/08/2008  Tegal Corp.'s proposed acquisition of Alcatel Micro Machining Systems' (AMMS) deep reactive ion etch (DRIE) and plasma-enhanced chemical vapor deposition (PECVD) products is "a critical part of our growth strategy" to extend into higher-growth markets in 3D IC packaging and MEMS devices, the company asserts.

Tegal to Acquire Alcatel Micro Machining Systems Product Line

09/05/2008  Tegal Corporation announced an agreement with Alcatel Micro Machining Systems (AMMS) and Alcatel-Lucent to acquire their deep reactive ion etch (DRIE) and plasma-enhanced chemical vapor deposition (PECVD) products, and the related intellectual property. The addition of these capabilities to Tegal's plasma-etch and deposition systems will reportedly enable Tegal to further expand into MEMS and 3D wafer level packaging applications.

Tegal to Acquire Alcatel's DRIE, PECVD product lines

09/03/2008  Sept. 3, 2008 - Tegal Corp., a designer and manufacturer of plasma etch and deposition systems, has agree to acquire ' (AMMS) and Alcatel-Lucent's deep reactive ion etch (DRIE) and plasma-enhanced chemical vapor deposition (PECVD) products and related IP in a $5M in cash-and-stock transaction.

Tegal to Acquire Alcatel Micro Machining product lines

09/03/2008  September 3, 2008: Tegal Corp., a designer and manufacturer of plasma etch and deposition systems, has agree to acquire Alcatel Micro Machining Systems' (AMMS) and Alcatel-Lucent's deep reactive ion etch (DRIE) and plasma-enhanced chemical vapor deposition (PECVD) products and related IP, directed at advanced 3D wafer-level packaging applications.

AMAT: 3Q was "trough," but 2009 recovery still tenuous

08/19/2008  Applied Materials' fiscal 3Q08 results were generally in line with expectations, with sales and profits dropping sharply during what CEO Mike Splinter called the "trough" of the industry's current downcycle. Here's a quick bullet-point summary of highlights from the company's quarterly conference call.

Novellus execs lay out case for industry, market growth opportunities

07/15/2008  Beneath the industry's current schizophrenia -- slump in mainstream IC, growth in PV solar -- there are opportunities to compete and succeed with specific technologies and products tuned to the unique needs of both logic and memory customers, explained Novellus execs in a packed-theater presentation.

Orbotech buying Photon Dynamics for $290M

06/26/2008  June 26, 2008 - Israeli firm Orbotech, a supplier of automated optical inspection equipment for printed circuit boards and flat-panel displays, has agreed to purchase Photon Dynamics for $290M in cash in an effort to spur growth and diversify their FPD businesses.

Liquidia Technologies' founder receives prestigious $500,000 Lemelson-MIT Prize

06/25/2008  June 25, 2008 -- Liquidia Technologies announced that Professor Joseph DeSimone, Liquidia Founder and chancellor's eminent professor of chemistry at the University of North Carolina-Chapel Hill (UNC) has received the $500,000 Lemelson-MIT Prize for outstanding inventors.

SVTC opens solar R&D center, names first partner & customer

06/25/2008  June 25, 2008 - SVTC Technologies has officially opened its Silicon Valley Photovoltaic Development Center in San Jose, with a new solar-cell manufacturing line, solar-module certification equipment, and a major silicon-wafer solar cell customer.

AMAT adds VC firm Francisco, pitches for ASMI's entire frontend biz

06/17/2008  June 17, 2008 - A day after its $400M-$500M offer for ASMI's ALD/PECVD units was rebuffed -- but with an asterisk -- Applied Materials has pitched a new proposal: buying all of ASMI's frontend business activities, with help from Francisco Partners.

AMAT-ASMI redux: No thanks, but we're listening

06/16/2008  June 16, 2008 - In a scenario reminiscent of the recent Axcelis/Sumitomo public M&A tussle, ASMI board members say they aren't interested in selling their ALD and/or PECVD businesses to Applied Materials "as such" though the firm "is willing to explore and discuss [...] any alternative arrangements" that could be beneficial to the company and its shareholders.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

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As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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