Tronics to produce submicron MEMS technology of CEA-LETI

03/01/2013

Tronics launched a new large-scale MEMS project to industrialize CEA-Leti's breakthrough M&NEMS, or Micro and Nano Electro-Mechanical Systems, technology. This technology is based on piezoresistive nanowires rather than pure capacitive detection, which will advance device performance and chip size. This project sets the stage for a new generation of combo sensors for motion sensing applications.

Within two years, the team will develop 6 DOF, 9 DOF and higher DOF devices, where all sensing elements are using the same M&NEMS technology. The goal is to achieve both significant surface reduction and performance improvement of the multi-DOF sensors. Beyond the smaller die size and the ultra-low power consumption, M&NEMS technology allows manufacturing of all the sensor's axes with one unique technology platform. This high level of integration and commonality simplifies the associated control and readout electronic circuits, both in terms of design and operational efficiency.

In addition to investments by Tronics and its partners, a substantial portion of the project's cost is supported by a 6.5 million euros grant provided by the French Ministry of Industry within its Nanoelectronique Industrial Support program.

To generate the volumes required by consumer applications, Tronics plans to support the technology all the way to high volume eight inch production maturity.

Solid State Technology | Volume 56 | Issue 2 | February | 2013