New Products

01/01/2013

Back-end lithography system

The JetStep is a new 2X reduction stepper that has several advantages over the 1X approach, according to Rudolph, which acquired Azores last year. System advantages include the largest printable field-of-view, programmable aperture blades and large on-tool reticle library, large depth-of-focus along with autofocus to accommodate 3D structures in advanced packaging, very large working distance, and warped wafer handling (+/- 6mm). The system also feature programmable wafer edge protection, enabling a variable edge exclusion zone of 0.5-5 mm. The system also features a large (17mm) working distance between the lens and wafer, which helps avoid a common maintenance issue on 1X systems. In addition, with its flat panel lithography heritage, the JetStep System incorporates Azores' high precision grid motor stage. This provides a flexible platform that can be readily scaled to changing substrate sizes and types in the advanced packaging market. It can handle both standard and reconstituted 300mm and 330mm wafers, all panel sizes and is 450mm capable. Rudolph Technologies, Flanders, NJ. www.rudolphtech.com.

Stepper for LEDs, MEMS, power devices

Canon USA, Inc. recently launched the FPA-3030i5+ i-line stepper, designed for the manufacturing of LEDs, MEMS and power semiconductors. The FPA-3030 platform is an upgrade to earlier Canon "FPA-3000 platform" steppers. The FPA-3030i5+ features an overhauled software structure and electrical control system that allow application of optional advanced hardware (e.g., projection lens, wafer stage, and alignment system) that is not compatible with traditional FPA-3000 platform steppers. The FPA-3030i5+ is capable of providing imaging resolution below 0.35mm, while maintaining overlay accuracy of less than or equal to 40nm and throughput equal to or in excess of 104 wafers per hour. Canon USA, Lake Success, NY, www.usa.canon.com.

Updated LED wafer inspection tool

KLA-Tencor says its new fourth-generation LED wafer inspection system achieves greater flexibility, increased throughput, and improved efficiency for inspecting defects and performing 2D metrology in LED applications, as well as MEMS and semiconductor wafers (up to 200mm). The ICOS WI-2280, built on the company's WI-22xx platform, supports handling of whole wafers in carriers and diced wafers in hoop ring or film frame carriers, to accommodate multiple media with minimal equipment changeover. An enhanced rule-based binning defect classification and recipe qualification engine enable faster yield learning during production ramps, and improved process control and process tool monitoring strategies. Highly flexible advanced optical modules with dedicated image processing enable high defect capture rate and recipe robustness against varying process background. A frontend-to-backend-of-line connectivity analysis capability -- working in conjunction with the company's Candela LED unpatterned wafer inspection system and Klarity LED automated analysis and defect data management system -- delivers a single platform for defect source analysis. KLA-Tencor, Milpitas, CA, www.kla-tencor.com.

Solid State Technology | Volume 56 | Issue 1 | January 2013