Products News
08/01/2008
3D laser confocal microscope
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The VK-9700 Color 3D laser scanning confocal microscope combines the capabilities of SEMs and non-contact profilometry with the simplicity of a conventional microscope. Major features include a 18,000?? magnification and 0.001µm 3D. The unit performs a variety of non-contact 3D measurements that include surface profile, roughness, 3D, and comparative measurements. The 3D display works with the virtual trackball method and the use of a computer mouse to control the viewing angle, lighting angle, zoom level, and Z-axis height. 3D images can be illuminated with pseudo-light when displayed on the screen. Adjusting the angle of the light in accordance with an object shades microscopic irregularities on the surface of an object. Three software programs are available for use with the VK-9700: VK-Viewer, VK-Analyzer, and VK-Assembler. An optional adjustable stand will allow the measurement of tall objects up to 100mm and a wide selection of lenses can be used based on the type of object. Also available are larger stages for wafers up to 300mm long, electric stages for automatic image assembly, and a separate measuring head that makes possible the non-destructive examination of large-sized targets. Keyence Corp. of America, Woodcliff Lake, NJ USA; ph 888/539-3623, www.keyence.com.
Test system
The X-Series MXc test system offers seamless compatibility with current CX systems, while providing expanded upgrade capabilities that enable deployment for an even broader range of applications. The MXc can be field-upgraded to provide increased performance and resources for wireless, RF, power, automotive, and datacomm application testing. The upgrade offers the ability to double the number of instrument slots, access higher-performance instruments, and address more complex test requirements. The X-Series MXc is fully outsource-manufactured and available immediately. LTX Corp., Norwood, MA USA; ph 781/461-1000, www.ltx.com.
Integrated metrology system
The IMPULSE 300mm real-time integrated metrology (IM) system is used to monitor vital CMP, CVD, etch, and photolithography process applications for 32nm nodes and beyond. Following the company’s 9000 and 9010 IM systems, the IMPULSE incorporates new innovations in mechano-optical design and algorithms, allowing up to 70% higher throughput over previous-generation systems and 3?? tighter process control windows, claims the company. The IMPULSE IM module also provides plug-and-play connectivity with the company’s high-end Atlas XP stand-alone metrology systems through its NanoNet connectivity solution. Nanometrics Inc., Milpitas, CA USA; ph 408/545-6000, www.nanometrics.com.
Infrared sensor for measuring wafers
The WaferScan 300 measures shape and thickness of wafers of all sizes, up to 300mm. The system has a modular design, allowing it to support a variety of sensors for different applications, including the company’s Optical Stylus Probe (OSP) and new IR WTS, as well as roughness measurement sensor. Measurement capabilities include thickness, TTV, LTV, shape, stress, roughness, film thickness, and X/Y dimensional measurement, and can be configured for semi- or fully automated operation. The IR based WTS measures wafer thickness from a single side with nanometer-level accuracy at a very high data rate, claims the company. The WTS can be purchased as an OEM for integration into critical process equipment or within the company’s WaferScan system for production monitoring. Tamar Technology, Newbury Park, CA USA; ph 805/480-3358, www.tamartechnology.com.
Micromaching system
Model 5800 dual-beam laser system micromachines very high-quality micro features in semiconductor, metallic, solar, ceramic, and glass applications. The unit incorporates two high-power fiber lasers specifically designed for industrial use. By utilizing the patented Compound Beam Positioner with seven axes of coordinated motion control, there is no stepping time and no abutment errors involved during machining, claims the company. The Model 5800 system comes with programmable spacing between the two beams, which results in optimal machining speed. The combined effect of the high-power fiber laser and field-proven compound beam positioner provides maximum flexibility. ESI Inc., Portland, OR USA; ph 503/641-4141, www.esi.com.
Automated optical inspection (AOI) technology
NanoScan automated optical inspection (AOI) technology employs highly accurate and sensitive detection of problem-causing particles and pattern defects during FPD manufacture, providing submicron particle inspection for the company’s AOI platforms. Through the use of NanoScan-enabled equipment, such as the company’s NexTStar and the FPDStar, manufacturers can identify and map particle and pattern defects in the active matrix display as well as defects in the intricate circuits surrounding the active matrix. This can all be accomplished on a single platform and at resolutions as small as 300nm, claims the company. The technology will be used primarily within the FPD industry and will be focused on the emerging OLED technology of both glass and flexible substrates. The technology will also be used for TFT/LCD displays, touch-screen substrates, and solar panels. NexTech FAS, Austin, TX USA; ph 512/833-0740, www.nextechfas.com.
Temperature/process controllers
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This series of temperature/process controllers has one program pattern consisting of 16 segments. The front panel of the CN6201 temperature/process controller features a dual display and has a splash-proof and dust-proof design. The universal input supports thermocouple, RTD, and voltage input types. Options include dual alarms, retransmission output, and RS-485 communications interface. Recommended applications are heat treating, water baths, industrial oven control, and any process control application. The CN6201 series comes with a two-year warranty, and pricing starts at $285. Omega Engineering Inc., Stamford, CT USA; ph 203/359-1660, www.omega.com.
Clean-burning binder for advanced industrial applications
NB-180, a poly(propylene carbonate) (PPC) sacrificial binder, is an amorphous, colorless thermoplastic polymer that degrades completely and uniformly into environmentally benign products, making it suitable for high-performance applications, particularly in the precise assembly of micro- and nano-scale devices. The company claims NB-180 burns cleaner than competitive products and also decomposes more predictably at temperatures that are much lower than currently available products. Complete burnout occurs by 300??C in inert atmospheres such as nitrogen, argon, and hydrogen. NB-180, the company’s first product, can be produced in customized viscosities and molecular weights to meet specific solution requirements. Pricing varies based on formulation and quantity ordered and is available upon request. Novomer, Ithaca, NY USA; ph 607/330.2321, www.novomer.com.
OSP system and Raman spectrometer
The OSP-300 laser-based optical surface profilometer system provides inline non- contact surface profile characterization of blanket and device wafers between process steps for R&D and manufacturing applications. The company claims the system provides local surface profile information that can be used to identify process anomalies that other surface profiling tools might miss. The data is plotted in a “visually intuitive” format, which gives wafer flatness, curvature, contour maps, and vector plots that can be compared to baseline data to reveal reproducibility issues. The scan sensitivity designed into this tool reveals local distortion as well as global warpage, twist, distortion, and pattern rotation. The MRS-300 Multi-Wavelength Raman Spectroscopy System allows non-destructive wafer characterization of local lattice strain and crystal quality, as well as depth profiling for evaluation or product wafers. It can also be used as a non-contact, non-destructive Ge content characterization tool for strained Si technology. WaferMasters Inc., San Jose, CA USA; ph 408/451-0850, www.wafermasters.com.
Laser workstations
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PV-5000 laser workstation processes solar thin film photovoltaic (PV) products. The company will sell these systems to PV product manufacturers globally, with the first system deliveries scheduled for the fourth quarter of this year. The workstations have the ability to laser machine high-efficiency solar thin-film panels that cost less to manufacture than current silicon-based PV panels, claims the company. The unit is based on the successful ChromaDice DPSS laser platform and is designed for isolation and series interconnection of thin-film solar cells. The laser systems employ high peak power, short pulsed Diode Pumped Solid State (DPSS) laser sources to remove a wide range of thin films from large glass, metal, or polymer substrates. A variety of wavelengths suitable for different layer materials are available, including 1064nm, 532nm, 355nm, and 266nm. These systems use advanced laser technology scribing to produce fine scribed lines with virtually no heat affected zone >30Mohm isolation. J. P. Sercel Associates (JPSA), Manchester, NH USA; ph 603/518-3200, www.jpsalaser.com.
Dry strip system
The RS photoresist dry strip cleaning system contains paired-chamber process modules that can run production recipes with the highest throughputs available, according to the company. The system has a multi-chamber design that allows users to run different cleaning recipes simultaneously or perform maintenance on one module while the others continue to operate. The platform includes technology required to address cleaning challenges in future technology nodes, such as those associated with advanced lithography and high-k/metal-gate adoption. Two of these systems will be shipped in Q3: one to Europe to support a 32/22nm collaborative research program, and the other to an existing memory manufacturer. Axcelis Technologies, Beverly, MA USA; ph 978/787-4000, www.axcelis.com.
Process and control software package
Applied E3 is a factory automation (FA) software package for improving the productivity of semiconductor, flat panel display, and photovoltaic solar cell manufacturing. According to the company, the Applied E3 system can boost process capability by >30%, reduce unscheduled downtime, and shorten cycle time to achieve up to a 20% increase in overall equipment effectiveness. Using scalable software architecture, the Applied E3 provides a combination of modules, including those for equipment automation, data collection, and logic handling, which simplify the construction, deployment, and maintenance of automated process control (APC) applications. Applied Materials, Santa Clara, CA USA; ph 408/727-5555, www.appliedmaterials.com.
e-beam inspection system
The eS35 e-beam inspection system is capable of detecting and classifying smaller physical defects and more subtle electrical defects at significantly higher speeds, according to the company. The unit features improved sensitivity and advances in on-board review and binning, along with substantial throughput gains. The company claims the eS35 features higher beam current density, a smaller pixel, and a faster data rate to deliver improved capture of the smallest defects at throughputs 2 to 4?? than that of its predecessor, the eS32. These advances are aided by a lower noise floor and algorithms that maximize sensitivity in each region of the die, across the wafer. Via the company’s µLoop technology, the system is currently being used for 6Xnm and 5Xnm device production, 4Xnm ramp, and 3Xnm development, capturing a range of defect types on both front-end and back-end layers. The µLoop proxy provides accelerated detection of systematic defects and is suitable for logic and flash devices. KLA-Tencor, San Jose, CA USA; ph 408/875-3000, www.kla-tencor.com.
Perfluoroelastomer parts for semiconductor thermal processes
Kalrez 8900 perfluoroelastomer parts for semiconductor thermal processes feature longer seal life in higher-temperature semiconductor manufacturing processes, claims the company. The parts are for static and dynamic sealing applications in thermal processes such as oxidation, diffusion furnace, metal CVD, ALD, and LPCVD. Kalrez 8900 parts reportedly have excellent thermal stability with maximum continuous service temperature of 325??C, very low outgassing properties, and excellent response to temperature cycling effects. Suggested applications include quartz tube seals, plenum seals, chamber seals, and center ring seals. DuPont Performance Elastomers, Wilmington, DE USA; ph 302/792-4000, www.dupontelastomers.com.
Maskless exposure system
The SF-100 XTREME maskless exposure system provides for micropatterning of features as small as 1 micron in size. The photolithography system uses Smart Filter technology licensed by the company from the U. of South Florida. This technology incorporates micro-optical techniques to project master images directly onto diverse substrate materials. The SF-100 XTREME then adds substrate movement and an inline, confocal camera system to improve overall system results, especially when patterning fine features.Intelligent Micro Patterning LLC, St. Petersburg, FL USA; ph 727/522-0334, www.intelligentmp.com.
Gas lifetime control system
The Gas Lifetime eXtension (GLX2) control system (second-generation) for the XLA and XLR series of light sources extends the maximum time between light source gas exchanges from one billion pulses to two billion pulses, and reduces downtime associated with gas refills by a factor of 20, compared with non-GLX systems, according to the company. GLX installations show improved bandwidth stability trends over epxtended gas lifetimes, enabling chipmakers to better meet their critical dimension (CD) control requirements. Cymer Inc., San Diego, CA USA; ph 858/385-7300, www.cymer.com.