Featured Products
06/01/2008
Toxic gas detection system
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The Draeger Guardian Gas Detection System uses electrochemical sensor technology for detecting hazardous gas leaks, such as hydrochloric acid and vapors at low concentrations, where by–products can foul tubes, pipes, and instruments. The unit, which is considered to act as a one–to–one replacement of the common paper tape technology widely used throughout the semiconductor industry today, uses sensors, manufactured by Draeger, with an expected sensor life time of up to three years. The detector provides rolling, charted recordings of the hazardous gas concentrations over time and uses no consumable parts, tapes, or paper. Draegerwerk AG & Co. KGaA, L??beck, Germany; www.draeger.com.
Polishing pads
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IC1000 AT and VisionPad CMP pads have a new groove design that targets 200mm and 300mm tungsten polishing processes and improves slurry delivery to the leading edge of the wafer. According to company claims, the design achieves up to a 35% reduction in slurry consumption without sacrificing removal rate, defectivity, or uniformity performance. The IC1000 AT features consistent pad stiffness and predictable polish performance, as well as lower overall pad spend and less spend on pad qualifications. The company says the VisionPad has a softer surface than a traditional hard pad, which is needed to reduce defects, while maintaining the rigidity needed for planarization performance. The product is currently undergoing full beta testing and is available for sampling. Rohm and Haas Electronic Materials, CMP Technologies, Philadelphia, PA USA; www.rohmhaas.com.
Wafer scanner
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The WS 3840 is the latest addition to the Wafer Scanner product family for inspection and metrology of back–end semiconductor manufacturing processes, including bumping, probing, sawing, and dicing. The scanner integrates the company’s laser triangulation technology for 3D bump metrology and sensitive 2D image–based macro defect inspection on the same wafer handler platform that is used by all of the company’s advanced inspection and metrology tools. A time–delay integration (TDI) line scan camera provides image–based macro defect inspection for wafer surface and bump, and measures 2D bump characteristics, such as diameter, shape, and placement accuracy. High–resolution color imaging is also available for defect review and classification. Automatic defect classification, sophisticated analytical routines, and comprehensive reporting extract actionable information from the data stream. The system imports and exports wafer maps in all major data formats to facilitate offline defect review. The first unit will be delivered to a major foundry in Asia in Q3 2008. Rudolph Technologies, Flanders, NJ USA; www.rudolphtech.com.
Rotary vane pumps
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PentaLine rotary vane pumps have a new optimized drive system, which provides environmentally friendly vacuum for applications in the low and medium range of 10–3 mbar. Available in pumping speeds up to 35 m3/h, PentaLine is designed for use in analytical instrumentation, research, and development applications, and critical industrial and coating processes. According to company claims, the PentaLine drive system reduces power consumption by up to 50%. The pumps are hermetically sealed, which pre–vents oil leaks, and run noiselessly and cooler, with minimum vibration. Pfeiffer Vacuum Inc., Nashua, NH USA; www.pfeiffer–vacuum.com.