Product Focus Wafer Processing
05/01/2008
Expanded line of sputtering targets
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These sputtering targets are available in 62 different metals and alloys, as well as compounds such as borides, carbides, fluorides, nitrides, oxides, selenides, silicides, sulphides, and tellurides. In addition, the surfaces of flat sheets up to 80 ?? 400mm can be heat treated, remelted, or alloyed using a continuous thermal process. Thin layers of metals or oxides can also be melted onto the surface. This process is especially suited for the creation of double-layer sheets and foils, or for ceramic superconductors on metallic or ceramic substrates, and for the creation of thin layers of solder on metals. Goodfellow Corp., Oakdale, PA USA; www.goodfellow.com.
Hydrogen peroxide sensor
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The new dFFOZ-P dissolved full flow hydrogen peroxide sensor is designed to monitor and control the concentrations of the critical peroxide in an SPM bath, also known as a Piranha bath, in semiconductor manufacturing cleaning processes. Compact and fully automatic, the dFFOZ-P continuously and instantaneously monitors the concentration of peroxide, enabling the automatic spiking of the SPM solution. The dFFOZ-P provides measurement of a wide range of concentrations from very dilute concentrations (700:1) up to very high concentrations (4:1) from 0 to 70,000mg/L. The sensor is “clean-ready” for high-purity semiconductor processes and can be installed inline at flow rates up to 150slpm and at temperatures in excess of 140??C. The dFFOZ-P incorporates analog and digital output proportional to concentrations, providing feedback ideal to keep the concentrations of the SPM solutions within the allowable ranges and therefore eliminate unnecessary chemical replacement, thus minimizing operating costs. IN USA Inc., Norwood, MA USA; www.inusacorp.com.