Product Focus: Metrology / Inspection
02/01/2008
Piezo force microscopy module
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The MFP-3D atomic force microscope module enables very high sensitivity, high bias, and crosstalk-free measurements of piezoelectrics, ferroelectrics, multiferroics, and biological systems. The module is an MFP-3D accessory that enables high voltage PFM measurements and advanced imaging modes for characterizing the sample material. With this module, a bias is applied to the AFM tip using proprietary electronics, a high voltage cantilever, and sample holder. The vertical and lateral response amplitude measures the local electromechanical activity of the surface, and the phase of the response yields information on the polarization direction. High probing voltages, up to ±220V, can characterize even very weak piezo materials. The large frequency range (1kHz-2MHz) allows imaging both at the static condition, and effective use of several cantilever resonances and use of the inertial stiffening of the cantilever. Asylum Research, Santa Barbara, CA USA; www.asylumresearch.com.
300mm wafer probe station
The Elite 300 300mm wafer probe station for devices with process nodes at 45nm and below incorporates electrical and mechanical technology, advanced materials, and leading-edge measurement techniques. The station offers end-to-end productivity improvements through its advanced ergonomic design, measurement capability, and flexibility. Applications include RF/DC device characterization and modeling, wafer-level reliability, IC failure analysis, and design debug. The Elite 300 is reportedly the lowest-noise environment for ultra low-level noise measurements. The software automatically tracks wafer movement; an upward-looking camera system is included for advanced vertical probe cards. It offers a wide standard temperature range (-60°C to 300°C) plus a 400°C thermal chuck option. A 300mm large-area microscope system, with video and software navigation, eases verification of large area and full-wafer needle contact. Cascade Microtech, Beaverton, OR USA; www.cascademicrotech.com.
Vision-based wafer pre-aligner
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The In-Sight 1820 vision-based wafer pre-aligner uses this company’s NotchMax alignment technology and provides precise noncontact measurement of wafer position and orientation that is faster and reportedly more accurate than comparably priced mechanical systems. The pre-aligner determines wafer position and orientation in less than half a second while mechanical pre-aligners must typically spin wafers for several seconds. NotchMax, the newest member of the PatMax family of geometric pattern finding technologies, aligns wafers with a center position accuracy of ±15µm and an orientation accuracy of ±0.05°. More accurate pre-alignment saves fine alignment steps inside a process tool to boost throughput. Cognex Corp., Natick, MA USA; www.cognex.com
Microspectroscopy tool
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The QDI 2010 UV-visible-NIR microspectrophotometer for semiconductor and flat panel display analysis is designed for spectroscopic analysis on the microscopic scale, including film thickness measurement, colorimetric analysis of individual FPD pixels, and even development of light sources such as organic light emitting diodes and semiconductor lasers. It is capable of nondestructively measuring UV-visible-NIR range spectra of sample areas as small as a micron by transmission, reflectance, and light emission. It is now possible to directly quantify the thickness of films by transmission in addition to reflectance, leading to more accurate results when transparent substrates are used. The tool is also used to develop and qualify the pigments used in individual pixels of displays as well as the light sources. CRAIC Technologies, San Dimas, CA USA; www.microspectra.com.
Laser voltage probing system
The Ruby laser voltage probing system provides accurate waveform and timing measurements of signals switching inside sub-volt devices. The Ruby system is based upon this company’s mature laser voltage probing technology using a polarization differential probing acquisition scheme. Coupled with a production proven “point-and-click” solid immersion lens, the Ruby system produces accurate and low-noise timing waveforms. Credence Systems Corp., Milpitas, CA USA; www.credence.com.
Auto vibration system
The WaferSense auto vibration system (AVS) is designed to detect wafer-damaging equipment vibrations. It enables faster identification of wafer contamination sources and maximizes motion parameters. It is designed to monitor three-axis accelerations and equipment vibration to maximize equipment motion and wafer throughput. The WaferSense AVS is a wireless, wafer-like accelerometer available in a 200mm or 300mm format that was designed to move through semiconductor process equipment and automation material handling systems including cassettes, SMIFs and FOUPs to observe and monitor three-axis accelerations and vibrations. It reports x, y, and z acceleration, has a range of ±2G, and can detect wafer slides, slips, bumps, scrapes and rough handling. Fab engineers can see the effect of adjustments in real time, speeding equipment alignment and setup, and motion parameters can be optimized. CyberOptics Semiconductor, Beaverton, OR USA; www.cyberopticssemi.com.
Mobile scanning electron microscope
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The CarryScope mobile scanning electron microscope can travel or easily be moved to different locations as needed. In the research or manufacturing setting, the CarryScope can be transported between the lab, conference room, or office for inspection of products or analysis of research samples. The JEOL CarryScope delivers several high resolution performance imaging and analytical capabilities of conventional electron microscopes, making it easy to observe high and low magnifications of fine surface structures and digitally record images. Standard features include 8× to 300,000× imaging and up to 5nm resolution. The CarryScope produces a sharp image that makes it possible to conduct and annotate high precision measurements on submicron structures. The optional eucentric motorized specimen stage holds a specimen up to 150mm in dia. JEOL USA Inc., Peabody, MA USA; www.jeolusa.com
X-ray metrology platform
The 6200 three-channel next generation x-ray metrology platform is based on novel, rapid, noncontacting, and nondestructive x-ray technology, and has been in use for various thin film measurement applications in high volume semiconductor fabs worldwide for several years. The JVX6200i model’s three metrology channels are fast x-ray reflectance (XRR), capable of first principle independent thickness, density, and roughness measurements; micro-spot x-ray fluorescence (XRF), providing the smallest spot size available and multichannel detectors for fast data acquisition; and small angle x-ray scattering (SAXS) for measurement of pore size and distribution down to 7Å. The JVX6200i reportedly produces significant throughput improvements in all three metrology channels (XRR, XRF and SAXS) with much shorter acquisition times and provides improved reliability and diagnostics capability. Jordan Valley Semiconductors Inc., Migdal Ha’Emek, Israel; www.jvsemi.com.
Smart sampling option for YieldManager software
The Knights Smart Sampling option for this company’s YieldManager yield management software automates inline wafer inspection review sampling for the defect-review tools used in semiconductor manufacturing. With this new option, fab engineers are better able to select the defect-review tool that will accurately detect potential yield-killing defects, dramatically reducing manufacturing cycle time, accelerating yield ramp, and improving time to market. The data used to build Smart Sampling’s defect sampling parameters is based upon defect size, location, layer, severity, and type. The tool supports defect grouping, which enables more efficient and more accurate defect classification. Users can configure specific groups of defects based on any property or combination of properties. Once sampling parameters are created, they are programmed into both the review tools and the Knights YieldManager database for future defect review and analysis. Magma Design Automation, San Jose, CA USA; www.magma-da.com.
Laser confocal system
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The LEXT OLS3100 3D laser confocal microscopy-based metrology system minimizes the need for manual operation, improving the ease of use for all functions. The new system features improved functionality and a higher level of measurement performance than the original. The operation navigator provides animations to guide users through each step of microscopic observation, enabling the completion of a series of steps by simply using the mouse in the same way as shown in the animations. With LEXT, 3D image capturing can be performed with just one click of the 3D capture button. Time-consuming tasks, such as setting the upper and lower focal limits, are completed automatically. The LEXT integrates an apochromatic objective lens specially developed for confocal laser scanning microscopes with a near-UV (408nm) laser light. Olympus Life Science Europa Gmbh, Hamburg, Germany; www.olympus-europa.com.
Metrology automation platform
The Atlas platform for semiconductor metrology OEMs uses an industry standard 300mm/200mm capable EFEM to reliably align and transfer wafers from the loadports to the inspection station. Overall airflow and pressure balance between the process stage and the EFEM has been optimized through CFD modeling to ensure clean wafer transfer. The standard metrology automation platform has been designed to allow for wafer level thermal and vibration isolation to ensure a controlled environment for tool-to-tool matching. A standard power distribution and control system with a GUI interface has been integrated into the system and, when combined with the required connectivity software, the platform will meet all the 300mm factory software interface requirements. Wafer sizes handled are: 200mm, 300mm, and 200/300mm bridge tool. Substrates types can be Si or quartz. Repeatability (at wafer hand-off location) for the x, y, and z axes is 0.003 in., and for the Theta axis is 0.1°. Owens Design Inc., Fremont, CA USA; www.owensdesign.com.
Transparent thin film metrology tools
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The S3000A transparent thin film metrology system combines this company’s industry-standard multiwavelength focused beam ellipsometry and a new, faster, deep ultraviolet reflectometer (DUVR) on the company’s high-speed XPort automation platform. The transparent film metrology tools reportedly deliver reliable measurements in high-volume production in advanced fabs. Stabilized laser diodes (633nm, 784nm, and 923nm) in the S3000A system improve the technology’s reportedly inherent advantages in accuracy and precision, tool matching, and long-term stability. The tool’s DUV reflectometer uses parallel data collection to improve throughput, precision, and spectral resolution. The XPort platform provides superior wafer handling with up to 4 industry-standard TDK load ports, a dual-arm robot, and built-in control of molecular airborne contaminants. Rudolph Technologies, Flanders, NJ USA; www. rudolphtech.com.
ESD event detector
The model 900 ESD event detector is a diagnostic tool for manufacturing environments that are sensitive to electrostatic discharge (ESD). It is used to identify incidents of or verify suspected areas of ESD activity within a manufacturing site. A voltage-sensitive antenna on the unit can be positioned near potential problem areas (where electrostatic discharge is suspected) to monitor ESD events. Detection is conveyed via an audible buzzer and/or a visual color-coded light display that depicts intensity. The detector alerts manufacturing engineers to the presence of potentially harmful (and invisible) electrostatic charging. TREK Inc., Medina, NY USA; www.trekinc.com.
Etch measurement suite
The PlasmaWafer Suite is an application for this company’s SensArray wafer-level metrology tools that provide a measurement capability to help verify plasma etch chamber health and quickly identify problems such as drift, non-uniformity, and slight differences in chamber matching. The PlasmaWafer Suite consists of high-precision temperature measurement SensorWafers, called the PlasmaTemp, and a second type called PlasmaVolt, which can directly measure plasma voltage at the wafer surface to help diagnose problems in RF power delivery systems and other key chamber components. SensorWafers are wafers containing extensive measurement instrumentation that are inserted inside the etch chamber where they capture high-precision, time-sequence temperature and plasma data from the fast-changing etch environment while the process is occurring. KLA-Tencor, San Jose, CA USA; www.kla-tencor.com.